TW200628023A - Carrier substrate capable of avoiding short circuit - Google Patents
Carrier substrate capable of avoiding short circuitInfo
- Publication number
- TW200628023A TW200628023A TW094101925A TW94101925A TW200628023A TW 200628023 A TW200628023 A TW 200628023A TW 094101925 A TW094101925 A TW 094101925A TW 94101925 A TW94101925 A TW 94101925A TW 200628023 A TW200628023 A TW 200628023A
- Authority
- TW
- Taiwan
- Prior art keywords
- pair
- glue
- flow passage
- solder pads
- solder
- Prior art date
Links
Abstract
A carrier structure used in a passive component package, where a passive component is capsulated in the package, is disclosed. The carrier comprises a conductive layer having a pair of solder pads thereon having a gap formed therebetween and a solder resist layer formed on the conductive layer and the pair of solder pads and having a pair of openings through which the pair of solder pads are exposed, wherein each of the pair of openings has a slanting form at a side neighboring to each other and a glue flow passage is defined between each of the slanting sides of the openings and each of the pair of solder pads so that a glue material flow flowed from two sides of the glue flow passage intercepts at a crossing point in a glue capsulation process and fused solder material flowed from the two sides of the glue flow passage into voids, if existed, in the glue flow passage does not bridge each other in a later soldering process where the fused solder material is provided between the pairs of solder pads and the passive component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94101925A TWI260956B (en) | 2005-01-21 | 2005-01-21 | Carrier substrate capable of avoiding short circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94101925A TWI260956B (en) | 2005-01-21 | 2005-01-21 | Carrier substrate capable of avoiding short circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200628023A true TW200628023A (en) | 2006-08-01 |
TWI260956B TWI260956B (en) | 2006-08-21 |
Family
ID=37874914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94101925A TWI260956B (en) | 2005-01-21 | 2005-01-21 | Carrier substrate capable of avoiding short circuit |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI260956B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI460842B (en) * | 2011-01-24 | 2014-11-11 | Powertech Technology Inc | Package structure mechanically assembling with passive component and manufacturing method of its substrate |
CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
CN112271170A (en) * | 2020-10-27 | 2021-01-26 | 苏州通富超威半导体有限公司 | Packaging substrate, flip chip packaging structure and manufacturing method thereof |
-
2005
- 2005-01-21 TW TW94101925A patent/TWI260956B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI460842B (en) * | 2011-01-24 | 2014-11-11 | Powertech Technology Inc | Package structure mechanically assembling with passive component and manufacturing method of its substrate |
CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
CN111545856B (en) * | 2020-05-15 | 2022-03-22 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
CN112271170A (en) * | 2020-10-27 | 2021-01-26 | 苏州通富超威半导体有限公司 | Packaging substrate, flip chip packaging structure and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI260956B (en) | 2006-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8502377B2 (en) | Package substrate for bump on trace interconnection | |
JP2009147029A (en) | Wiring board and mounting structure of electronic component | |
TW200610078A (en) | Packaging with metal studs formed on solder pads | |
WO2007079121A3 (en) | Interconnected ic packages with vertical smt pads | |
WO2012087556A3 (en) | Device packaging with substrates having embedded lines and metal defined pads | |
TWI590404B (en) | Electronic device | |
TW200504952A (en) | Method of manufacturing semiconductor package and method of manufacturing semiconductor device | |
TWI446844B (en) | Printed circuit board and method for manufacturing a rinted circuit board | |
TWI569395B (en) | Substrate and package structure | |
JP2011166081A (en) | Semiconductor device, semiconductor package, interposer, method of manufacturing semiconductor device, and method of manufacturing interposer | |
JP2013115732A (en) | Surface mounted piezoelectric oscillator | |
TW200628023A (en) | Carrier substrate capable of avoiding short circuit | |
TW201304624A (en) | Substrate structure, array of semiconductor devices and semiconductor device thereof | |
TWI517318B (en) | Substrate having pillar group and semiconductor package having pillar group | |
JP2005109088A (en) | Semiconductor device and its manufacturing method, circuit substrate, and electronic equipment | |
TW200727422A (en) | Package structure and manufacturing method thereof | |
JP4324773B2 (en) | Manufacturing method of semiconductor device | |
CN103515329B (en) | Substrate structure and semiconductor package using the same | |
KR100779857B1 (en) | a flexible printed circuit board having flip chip bonding domain aligned top layer bump and inner layer trace | |
JP2008071883A (en) | Method of manufacturing semiconductor device | |
TW201306197A (en) | MPS-C2 semiconductor package | |
KR102191249B1 (en) | Chip resistor assembly | |
TW200737456A (en) | Flip chip substrate structure and method for fabricating the same | |
JP6920611B2 (en) | Semiconductor devices and their manufacturing methods | |
KR100818095B1 (en) | Flip chip package and method of fabricating the same |