TW200628023A - Carrier substrate capable of avoiding short circuit - Google Patents

Carrier substrate capable of avoiding short circuit

Info

Publication number
TW200628023A
TW200628023A TW094101925A TW94101925A TW200628023A TW 200628023 A TW200628023 A TW 200628023A TW 094101925 A TW094101925 A TW 094101925A TW 94101925 A TW94101925 A TW 94101925A TW 200628023 A TW200628023 A TW 200628023A
Authority
TW
Taiwan
Prior art keywords
pair
glue
flow passage
solder pads
solder
Prior art date
Application number
TW094101925A
Other languages
Chinese (zh)
Other versions
TWI260956B (en
Inventor
Sheng-Tsung Liu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94101925A priority Critical patent/TWI260956B/en
Publication of TW200628023A publication Critical patent/TW200628023A/en
Application granted granted Critical
Publication of TWI260956B publication Critical patent/TWI260956B/en

Links

Abstract

A carrier structure used in a passive component package, where a passive component is capsulated in the package, is disclosed. The carrier comprises a conductive layer having a pair of solder pads thereon having a gap formed therebetween and a solder resist layer formed on the conductive layer and the pair of solder pads and having a pair of openings through which the pair of solder pads are exposed, wherein each of the pair of openings has a slanting form at a side neighboring to each other and a glue flow passage is defined between each of the slanting sides of the openings and each of the pair of solder pads so that a glue material flow flowed from two sides of the glue flow passage intercepts at a crossing point in a glue capsulation process and fused solder material flowed from the two sides of the glue flow passage into voids, if existed, in the glue flow passage does not bridge each other in a later soldering process where the fused solder material is provided between the pairs of solder pads and the passive component.
TW94101925A 2005-01-21 2005-01-21 Carrier substrate capable of avoiding short circuit TWI260956B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94101925A TWI260956B (en) 2005-01-21 2005-01-21 Carrier substrate capable of avoiding short circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94101925A TWI260956B (en) 2005-01-21 2005-01-21 Carrier substrate capable of avoiding short circuit

Publications (2)

Publication Number Publication Date
TW200628023A true TW200628023A (en) 2006-08-01
TWI260956B TWI260956B (en) 2006-08-21

Family

ID=37874914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94101925A TWI260956B (en) 2005-01-21 2005-01-21 Carrier substrate capable of avoiding short circuit

Country Status (1)

Country Link
TW (1) TWI260956B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460842B (en) * 2011-01-24 2014-11-11 Powertech Technology Inc Package structure mechanically assembling with passive component and manufacturing method of its substrate
CN111545856A (en) * 2020-05-15 2020-08-18 宁波奥克斯电气股份有限公司 Method for preventing wave soldering from being connected and welded, printing screen and electric control board
CN112271170A (en) * 2020-10-27 2021-01-26 苏州通富超威半导体有限公司 Packaging substrate, flip chip packaging structure and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460842B (en) * 2011-01-24 2014-11-11 Powertech Technology Inc Package structure mechanically assembling with passive component and manufacturing method of its substrate
CN111545856A (en) * 2020-05-15 2020-08-18 宁波奥克斯电气股份有限公司 Method for preventing wave soldering from being connected and welded, printing screen and electric control board
CN111545856B (en) * 2020-05-15 2022-03-22 宁波奥克斯电气股份有限公司 Method for preventing wave soldering from being connected and welded, printing screen and electric control board
CN112271170A (en) * 2020-10-27 2021-01-26 苏州通富超威半导体有限公司 Packaging substrate, flip chip packaging structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI260956B (en) 2006-08-21

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