TW200737456A - Flip chip substrate structure and method for fabricating the same - Google Patents
Flip chip substrate structure and method for fabricating the sameInfo
- Publication number
- TW200737456A TW200737456A TW095110361A TW95110361A TW200737456A TW 200737456 A TW200737456 A TW 200737456A TW 095110361 A TW095110361 A TW 095110361A TW 95110361 A TW95110361 A TW 95110361A TW 200737456 A TW200737456 A TW 200737456A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder mask
- flip chip
- chip substrate
- substrate structure
- fabricating
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to a flip chip substrate structure, which comprises at least one circuit build-up structure having two sides respectively formed thereon a first solder mask and a second solder mask, wherein plural openings are formed in the first solder mask and the second solder mask in order to expose the portions of the circuit build-up structure on both sides for use as the electrical contact pads; and plural solder bumps, which are formed on the electrical contact pads on both sides of the circuit build-up structure. The present invention also provides a method to fabricate the structure. The structure increases the integration and achieves the purpose of miniaturization. The method solves the problem of layer multiplicity and process complexity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095110361A TW200737456A (en) | 2006-03-24 | 2006-03-24 | Flip chip substrate structure and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095110361A TW200737456A (en) | 2006-03-24 | 2006-03-24 | Flip chip substrate structure and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200737456A true TW200737456A (en) | 2007-10-01 |
TWI317163B TWI317163B (en) | 2009-11-11 |
Family
ID=45073328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095110361A TW200737456A (en) | 2006-03-24 | 2006-03-24 | Flip chip substrate structure and method for fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200737456A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI423410B (en) * | 2010-12-31 | 2014-01-11 | Au Optronics Corp | Metal conductive structure and manufacturing method |
-
2006
- 2006-03-24 TW TW095110361A patent/TW200737456A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI423410B (en) * | 2010-12-31 | 2014-01-11 | Au Optronics Corp | Metal conductive structure and manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
TWI317163B (en) | 2009-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |