TW200625529A - Contact hole structures and contact structures and fabrication methods thereof - Google Patents

Contact hole structures and contact structures and fabrication methods thereof

Info

Publication number
TW200625529A
TW200625529A TW095100375A TW95100375A TW200625529A TW 200625529 A TW200625529 A TW 200625529A TW 095100375 A TW095100375 A TW 095100375A TW 95100375 A TW95100375 A TW 95100375A TW 200625529 A TW200625529 A TW 200625529A
Authority
TW
Taiwan
Prior art keywords
structures
contact
contact hole
fabrication methods
material layer
Prior art date
Application number
TW095100375A
Other languages
English (en)
Other versions
TWI303468B (en
Inventor
Ju-Wang Hsu
Jyu-Horng Shieh
Yi-Nien Su
Peng-Fu Hsu
Hun-Jan Tao
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200625529A publication Critical patent/TW200625529A/zh
Application granted granted Critical
Publication of TWI303468B publication Critical patent/TWI303468B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76835—Combinations of two or more different dielectric layers having a low dielectric constant

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
TW095100375A 2005-01-12 2006-01-04 Fabrication mehtods for contact hole structures TWI303468B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/035,325 US7875547B2 (en) 2005-01-12 2005-01-12 Contact hole structures and contact structures and fabrication methods thereof

Publications (2)

Publication Number Publication Date
TW200625529A true TW200625529A (en) 2006-07-16
TWI303468B TWI303468B (en) 2008-11-21

Family

ID=36653832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100375A TWI303468B (en) 2005-01-12 2006-01-04 Fabrication mehtods for contact hole structures

Country Status (2)

Country Link
US (1) US7875547B2 (zh)
TW (1) TWI303468B (zh)

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US7154118B2 (en) 2004-03-31 2006-12-26 Intel Corporation Bulk non-planar transistor having strained enhanced mobility and methods of fabrication
US7042009B2 (en) * 2004-06-30 2006-05-09 Intel Corporation High mobility tri-gate devices and methods of fabrication
US7348284B2 (en) 2004-08-10 2008-03-25 Intel Corporation Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow
US7422946B2 (en) 2004-09-29 2008-09-09 Intel Corporation Independently accessed double-gate and tri-gate transistors in same process flow
US7332439B2 (en) 2004-09-29 2008-02-19 Intel Corporation Metal gate transistors with epitaxial source and drain regions
US20060086977A1 (en) 2004-10-25 2006-04-27 Uday Shah Nonplanar device with thinned lower body portion and method of fabrication
US7518196B2 (en) 2005-02-23 2009-04-14 Intel Corporation Field effect transistor with narrow bandgap source and drain regions and method of fabrication
US20060202266A1 (en) 2005-03-14 2006-09-14 Marko Radosavljevic Field effect transistor with metal source/drain regions
US7563701B2 (en) * 2005-03-31 2009-07-21 Intel Corporation Self-aligned contacts for transistors
US7858481B2 (en) 2005-06-15 2010-12-28 Intel Corporation Method for fabricating transistor with thinned channel
US7547637B2 (en) 2005-06-21 2009-06-16 Intel Corporation Methods for patterning a semiconductor film
US7279375B2 (en) 2005-06-30 2007-10-09 Intel Corporation Block contact architectures for nanoscale channel transistors
US7402875B2 (en) 2005-08-17 2008-07-22 Intel Corporation Lateral undercut of metal gate in SOI device
US7479421B2 (en) 2005-09-28 2009-01-20 Intel Corporation Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby
US20070090416A1 (en) 2005-09-28 2007-04-26 Doyle Brian S CMOS devices with a single work function gate electrode and method of fabrication
US7485503B2 (en) 2005-11-30 2009-02-03 Intel Corporation Dielectric interface for group III-V semiconductor device
US7396711B2 (en) * 2005-12-27 2008-07-08 Intel Corporation Method of fabricating a multi-cornered film
US8143646B2 (en) 2006-08-02 2012-03-27 Intel Corporation Stacking fault and twin blocking barrier for integrating III-V on Si
US8362566B2 (en) 2008-06-23 2013-01-29 Intel Corporation Stress in trigate devices using complimentary gate fill materials
US9786760B1 (en) * 2016-09-29 2017-10-10 International Business Machines Corporation Air gap and air spacer pinch off

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US6274391B1 (en) * 1992-10-26 2001-08-14 Texas Instruments Incorporated HDI land grid array packaged device having electrical and optical interconnects
JPH11307633A (ja) * 1997-11-17 1999-11-05 Sony Corp 低誘電率膜を有する半導体装置、およびその製造方法
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US6265780B1 (en) * 1998-12-01 2001-07-24 United Microelectronics Corp. Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
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US6451683B1 (en) * 2000-08-28 2002-09-17 Micron Technology, Inc. Damascene structure and method of making
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Also Published As

Publication number Publication date
US7875547B2 (en) 2011-01-25
US20060154478A1 (en) 2006-07-13
TWI303468B (en) 2008-11-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees