TW200624221A - Flexible rinsing step in a cmp process - Google Patents
Flexible rinsing step in a cmp processInfo
- Publication number
- TW200624221A TW200624221A TW094133140A TW94133140A TW200624221A TW 200624221 A TW200624221 A TW 200624221A TW 094133140 A TW094133140 A TW 094133140A TW 94133140 A TW94133140 A TW 94133140A TW 200624221 A TW200624221 A TW 200624221A
- Authority
- TW
- Taiwan
- Prior art keywords
- cmp process
- rinsing step
- cmp
- flexible
- flexible rinsing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04104686 | 2004-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200624221A true TW200624221A (en) | 2006-07-16 |
Family
ID=35501116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094133140A TW200624221A (en) | 2004-09-27 | 2005-09-23 | Flexible rinsing step in a cmp process |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1796873A1 (fr) |
JP (1) | JP2008515182A (fr) |
KR (1) | KR20070055567A (fr) |
CN (1) | CN101065218B (fr) |
TW (1) | TW200624221A (fr) |
WO (1) | WO2006035337A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101663739B (zh) * | 2007-04-20 | 2011-10-26 | 株式会社荏原制作所 | 研磨装置 |
CN109262442A (zh) * | 2017-07-18 | 2019-01-25 | 中芯国际集成电路制造(上海)有限公司 | 一种清洗化学机械研磨设备的系统和化学机械研磨系统 |
KR102434418B1 (ko) * | 2022-03-10 | 2022-08-22 | (주)뉴이스트 | 반도체 웨이퍼의 연마 공정에 사용되는 캐리어 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US6293845B1 (en) * | 1999-09-04 | 2001-09-25 | Mitsubishi Materials Corporation | System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current |
WO2001064395A2 (fr) * | 2000-03-01 | 2001-09-07 | Speedfam-Ipec Corporation | Systeme de commande modulaire et procede pour outil de planarisation chimico-mecanique |
US6602724B2 (en) * | 2000-07-27 | 2003-08-05 | Applied Materials, Inc. | Chemical mechanical polishing of a metal layer with polishing rate monitoring |
-
2005
- 2005-09-15 CN CN2005800407303A patent/CN101065218B/zh not_active Expired - Fee Related
- 2005-09-15 EP EP05798546A patent/EP1796873A1/fr not_active Withdrawn
- 2005-09-15 KR KR1020077006805A patent/KR20070055567A/ko not_active Application Discontinuation
- 2005-09-15 WO PCT/IB2005/053043 patent/WO2006035337A1/fr active Application Filing
- 2005-09-15 JP JP2007533018A patent/JP2008515182A/ja not_active Withdrawn
- 2005-09-23 TW TW094133140A patent/TW200624221A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2008515182A (ja) | 2008-05-08 |
WO2006035337A1 (fr) | 2006-04-06 |
EP1796873A1 (fr) | 2007-06-20 |
KR20070055567A (ko) | 2007-05-30 |
CN101065218B (zh) | 2011-08-17 |
CN101065218A (zh) | 2007-10-31 |
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