TW200717640A - Polishing method and polishing apparatus, and program for controlling polishing apparatus - Google Patents

Polishing method and polishing apparatus, and program for controlling polishing apparatus

Info

Publication number
TW200717640A
TW200717640A TW095134182A TW95134182A TW200717640A TW 200717640 A TW200717640 A TW 200717640A TW 095134182 A TW095134182 A TW 095134182A TW 95134182 A TW95134182 A TW 95134182A TW 200717640 A TW200717640 A TW 200717640A
Authority
TW
Taiwan
Prior art keywords
polishing
stand
completion
polishing apparatus
preparatory process
Prior art date
Application number
TW095134182A
Other languages
Chinese (zh)
Other versions
TWI423316B (en
Inventor
Tsuneo Torikoshi
Kuniaki Yamaguchi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200717640A publication Critical patent/TW200717640A/en
Application granted granted Critical
Publication of TWI423316B publication Critical patent/TWI423316B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by operation during a polishing-resting time period; carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface; and starting polishing of a workpiece after completion of the preparatory process to polishing. Determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.
TW095134182A 2005-09-16 2006-09-15 Polishing method and polishing apparatus, and program for controlling polishing apparatus TWI423316B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005269843A JP4757580B2 (en) 2005-09-16 2005-09-16 Polishing method, polishing apparatus, and program for controlling polishing apparatus

Publications (2)

Publication Number Publication Date
TW200717640A true TW200717640A (en) 2007-05-01
TWI423316B TWI423316B (en) 2014-01-11

Family

ID=37865100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134182A TWI423316B (en) 2005-09-16 2006-09-15 Polishing method and polishing apparatus, and program for controlling polishing apparatus

Country Status (6)

Country Link
US (1) US8332064B2 (en)
JP (1) JP4757580B2 (en)
KR (1) KR101276715B1 (en)
CN (1) CN101262981B (en)
TW (1) TWI423316B (en)
WO (1) WO2007032519A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795449B (en) * 2017-10-25 2023-03-11 日商荏原製作所股份有限公司 Non-transitory computer-readable storage medium storing a program of stretching operation of elastic membrane, method of stretching operation of elastic membrane, and polishing apparatus

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311178B2 (en) * 2007-10-15 2013-10-09 株式会社ニコン Polishing apparatus and polishing pad dressing method in polishing apparatus
US8734661B2 (en) * 2007-10-15 2014-05-27 Ebara Corporation Flattening method and flattening apparatus
JP5392483B2 (en) * 2009-08-31 2014-01-22 不二越機械工業株式会社 Polishing equipment
CN102479266B (en) * 2010-11-26 2014-10-22 香港理工大学 Method for generating structural surface by polishing
CN102528653B (en) * 2010-12-30 2014-11-05 中芯国际集成电路制造(上海)有限公司 Fixed type particle grinding device and grinding method thereof
JP6209088B2 (en) 2013-01-25 2017-10-04 株式会社荏原製作所 Polishing method and apparatus
JP5534488B2 (en) * 2013-06-24 2014-07-02 株式会社ニコン Polishing apparatus and polishing pad dressing method in polishing apparatus
CN104669032B (en) * 2013-11-30 2017-12-12 东莞市远方物流设备有限公司 logistics system
SG10201508329UA (en) * 2014-10-10 2016-05-30 Ebara Corp Buffing apparatus and substrate processing apparatus
CN105014524B (en) * 2015-05-27 2017-09-26 苏州德锐朗智能科技有限公司 A kind of grinding technics of face lapping mill
JP6376085B2 (en) * 2015-09-03 2018-08-22 信越半導体株式会社 Polishing method and polishing apparatus
JP2017087407A (en) * 2015-11-17 2017-05-25 アルバック成膜株式会社 Polishing method and polishing device
CN106002510B (en) * 2016-07-14 2018-08-24 吴江佳亿电子科技有限公司 The production line for sorting and reprocessing for high voltage ceramic capacitor ceramic dielectric chip thickness
JP6938262B2 (en) * 2017-07-24 2021-09-22 株式会社ディスコ Wafer processing method
WO2020048311A1 (en) * 2018-09-07 2020-03-12 杭州众硅电子科技有限公司 Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit
CN109465738A (en) * 2018-12-10 2019-03-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） A kind of polishing pedestal and polissoir
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
JP7296849B2 (en) * 2019-10-21 2023-06-23 株式会社ディスコ Cutting device and cutting blade dressing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0850956A (en) 1994-08-08 1996-02-20 Sumitomo Wiring Syst Ltd Fixing structure of rubber plug for sealing
JP3724869B2 (en) 1995-10-09 2005-12-07 株式会社荏原製作所 Polishing apparatus and method
JP2862073B2 (en) * 1995-12-08 1999-02-24 日本電気株式会社 Wafer polishing method
JP3164045B2 (en) * 1997-11-27 2001-05-08 日本電気株式会社 Semiconductor wafer mounting base
JPH11294503A (en) 1998-04-06 1999-10-29 Shinko Electric Co Ltd Positioning device of automated guided vehicle
JP2000153445A (en) * 1998-11-19 2000-06-06 Seiko Epson Corp Dresser for polishing device
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
JP2001345298A (en) * 2000-05-31 2001-12-14 Ebara Corp Apparatus and method for polishing
JP2003117816A (en) * 2001-10-03 2003-04-23 Hitachi Ltd Method and device for dressing polishing pad, and method of polishing work by using the device
JP2003117823A (en) * 2001-10-09 2003-04-23 Kohan Kogyo Kk Dresser for polishing pad
US6733368B1 (en) * 2003-02-10 2004-05-11 Seh America, Inc. Method for lapping a wafer
US7105446B2 (en) * 2003-09-04 2006-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for pre-conditioning CMP polishing pad
JP2005203729A (en) * 2003-12-19 2005-07-28 Ebara Corp Substrate polishing apparatus
KR101078007B1 (en) * 2004-06-21 2011-10-28 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus and polishing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795449B (en) * 2017-10-25 2023-03-11 日商荏原製作所股份有限公司 Non-transitory computer-readable storage medium storing a program of stretching operation of elastic membrane, method of stretching operation of elastic membrane, and polishing apparatus

Also Published As

Publication number Publication date
US8332064B2 (en) 2012-12-11
JP2007075973A (en) 2007-03-29
WO2007032519A1 (en) 2007-03-22
CN101262981A (en) 2008-09-10
TWI423316B (en) 2014-01-11
JP4757580B2 (en) 2011-08-24
CN101262981B (en) 2013-05-15
KR101276715B1 (en) 2013-06-19
US20090264052A1 (en) 2009-10-22
KR20080046737A (en) 2008-05-27

Similar Documents

Publication Publication Date Title
TW200717640A (en) Polishing method and polishing apparatus, and program for controlling polishing apparatus
DE602007000916D1 (en) Method and system for efficient DRX operation during delivery in LTE
TW200624224A (en) Polishing apparatus and polishing method
WO2009091189A3 (en) Substrate holder, substrate supporting apparatus, substrate processing apparatus, and substrate processing method using the same
DE60310099D1 (en) METHOD AND DEVICE FOR MIXING PROCESS MATERIALS
DE502007003728D1 (en) METHOD FOR RE-GRINDING CUTTING TOOLS, THREADMOVERS AND SIMILAR TOOLS, AND GRINDING MACHINE FOR IMPLEMENTING THE PROCESS
TW200601446A (en) Tape adhering method and tape adhering apparatus
WO2011077344A3 (en) Method for monitoring the amount of contamination imparted into semiconductor wafers during wafer processing
TW200717686A (en) Apparatus and method for treating substrate
PL1725700T3 (en) Method for removing a coating
MY163872A (en) Method and apparatus for dressing polishing pad
WO2009120722A3 (en) Methods and apparatus for conserving electronic device manufacturing resources
KR20180084642A (en) Substrate processing apparatus, substrate processing method and recording medium
WO2008081508A1 (en) Regeneration apparatus and method of regeneration
PL374471A1 (en) Method for operating a programmable washing machine
WO2008117419A1 (en) Operation instruction system, operation instruction method, operation instruction program, computer-readable recording medium containing the operation instruction program and operation instruction device
WO2010121029A3 (en) Cyclic self-limiting cmp removal and associated processing tool
WO2007085247A3 (en) Process for conducting cleaning operations in a fluid-receiving device of a foodstuff-processing apparatus, and fluid-receiving device and foodstuff-processing apparatus therefor
PL2198991T3 (en) Sheet metal loading and unloading unit with a tool holder for sheet metal processing machines
TW200833466A (en) Polishing method and polishing apparatus
TW200608482A (en) System and method for multi-steage process control in film removal
MXPA05010036A (en) Method for laundering fabric with a non-aqueous working fluid using a select rinse fluid.
ITMI20121941A1 (en) PROCESS AND TOOL MACHINE FOR COMPLETE PROCESSING OF SHAPED PARTS
MY136721A (en) Wafer planarization composition and method of use
TW200603312A (en) Apparatus and method for indexing of substrates and lead frames