WO2001064395A2 - Systeme de commande modulaire et procede pour outil de planarisation chimico-mecanique - Google Patents

Systeme de commande modulaire et procede pour outil de planarisation chimico-mecanique Download PDF

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Publication number
WO2001064395A2
WO2001064395A2 PCT/US2001/006658 US0106658W WO0164395A2 WO 2001064395 A2 WO2001064395 A2 WO 2001064395A2 US 0106658 W US0106658 W US 0106658W WO 0164395 A2 WO0164395 A2 WO 0164395A2
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
recipe
module
modules
cmp
Prior art date
Application number
PCT/US2001/006658
Other languages
English (en)
Other versions
WO2001064395A3 (fr
Inventor
Jack Nimtz
Gary Rickords
Mark Freseman
Randy Smith
Original Assignee
Speedfam-Ipec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam-Ipec Corporation filed Critical Speedfam-Ipec Corporation
Publication of WO2001064395A2 publication Critical patent/WO2001064395A2/fr
Publication of WO2001064395A3 publication Critical patent/WO2001064395A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)

Abstract

L'invention concerne un système et un procédé pour une machine de planarisation chimico-mécanique (CMP) automatique. Le système comprend une pluralité de modules interchangeables de traitement CMP. Chaque module est une compilation de codes logiciels groupés appelés 'objets'. Des modules de traitement peuvent être ajoutés ou retirés du système selon les besoins, soit pendant l'assemblage de la machine soit pendant son utilisation effective. Le système est configuré pour permettre aux utilisateurs d'entrer une 'recette' de traitement pour chaque plaquette d'une cassette de plaquettes, laquelle guide le système pour traiter la plaquette d'une façon voulue.
PCT/US2001/006658 2000-03-01 2001-02-27 Systeme de commande modulaire et procede pour outil de planarisation chimico-mecanique WO2001064395A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51643200A 2000-03-01 2000-03-01
US09/516,432 2000-03-01

Publications (2)

Publication Number Publication Date
WO2001064395A2 true WO2001064395A2 (fr) 2001-09-07
WO2001064395A3 WO2001064395A3 (fr) 2002-08-29

Family

ID=24055562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/006658 WO2001064395A2 (fr) 2000-03-01 2001-02-27 Systeme de commande modulaire et procede pour outil de planarisation chimico-mecanique

Country Status (2)

Country Link
TW (1) TW503156B (fr)
WO (1) WO2001064395A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035337A1 (fr) * 2004-09-27 2006-04-06 Koninklijke Philips Electronics N.V. Etape flexible de rincage dans une operation de polissage chimiomecanique
US9915938B2 (en) 2014-01-20 2018-03-13 Ebara Corporation Adjustment apparatus for adjusting processing units provided in a substrate processing apparatus, and a substrate processing apparatus having such an adjustment apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420796A (en) * 1993-12-23 1995-05-30 Vlsi Technology, Inc. Method of inspecting planarity of wafer surface after etchback step in integrated circuit fabrication
US5453933A (en) * 1993-09-08 1995-09-26 Hurco Companies, Inc. CNC control system
US5812394A (en) * 1995-07-21 1998-09-22 Control Systems International Object-oriented computer program, system, and method for developing control schemes for facilities
WO1999064940A1 (fr) * 1998-06-11 1999-12-16 Speedfam-Ipec Corp. Systeme de commande distribue pour une machine de traitement de tranche de semi-conducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453933A (en) * 1993-09-08 1995-09-26 Hurco Companies, Inc. CNC control system
US5420796A (en) * 1993-12-23 1995-05-30 Vlsi Technology, Inc. Method of inspecting planarity of wafer surface after etchback step in integrated circuit fabrication
US5812394A (en) * 1995-07-21 1998-09-22 Control Systems International Object-oriented computer program, system, and method for developing control schemes for facilities
WO1999064940A1 (fr) * 1998-06-11 1999-12-16 Speedfam-Ipec Corp. Systeme de commande distribue pour une machine de traitement de tranche de semi-conducteur

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035337A1 (fr) * 2004-09-27 2006-04-06 Koninklijke Philips Electronics N.V. Etape flexible de rincage dans une operation de polissage chimiomecanique
US9915938B2 (en) 2014-01-20 2018-03-13 Ebara Corporation Adjustment apparatus for adjusting processing units provided in a substrate processing apparatus, and a substrate processing apparatus having such an adjustment apparatus

Also Published As

Publication number Publication date
TW503156B (en) 2002-09-21
WO2001064395A3 (fr) 2002-08-29

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