TW200620421A - Apparatus for fabricating display device - Google Patents

Apparatus for fabricating display device

Info

Publication number
TW200620421A
TW200620421A TW094136806A TW94136806A TW200620421A TW 200620421 A TW200620421 A TW 200620421A TW 094136806 A TW094136806 A TW 094136806A TW 94136806 A TW94136806 A TW 94136806A TW 200620421 A TW200620421 A TW 200620421A
Authority
TW
Taiwan
Prior art keywords
gas injector
display device
susceptor
chamber
injection holes
Prior art date
Application number
TW094136806A
Other languages
English (en)
Other versions
TWI453800B (zh
Inventor
Jae-Ho Kim
Original Assignee
Jusung Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jusung Eng Co Ltd filed Critical Jusung Eng Co Ltd
Publication of TW200620421A publication Critical patent/TW200620421A/zh
Application granted granted Critical
Publication of TWI453800B publication Critical patent/TWI453800B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)
TW094136806A 2004-10-28 2005-10-21 用於製造顯示裝置之設備 TWI453800B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040086470A KR101121417B1 (ko) 2004-10-28 2004-10-28 표시소자의 제조장치

Publications (2)

Publication Number Publication Date
TW200620421A true TW200620421A (en) 2006-06-16
TWI453800B TWI453800B (zh) 2014-09-21

Family

ID=36260374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136806A TWI453800B (zh) 2004-10-28 2005-10-21 用於製造顯示裝置之設備

Country Status (5)

Country Link
US (1) US8157916B2 (zh)
JP (1) JP4942985B2 (zh)
KR (1) KR101121417B1 (zh)
CN (1) CN1766157B (zh)
TW (1) TWI453800B (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI341872B (en) * 2006-08-07 2011-05-11 Ind Tech Res Inst Plasma deposition apparatus and depositing method thereof
KR101301642B1 (ko) * 2007-03-07 2013-08-29 주성엔지니어링(주) 가열수단을 가지는 가스분사장치와 이를 포함하는기판처리장치
KR101394481B1 (ko) * 2007-10-30 2014-05-13 주성엔지니어링(주) 가스 분사 장치 및 이를 이용한 유기 박막 증착 장치
KR101363395B1 (ko) * 2007-10-31 2014-02-21 주성엔지니어링(주) 가스 분사 장치 및 이를 이용한 유기 박막 증착 장치와유기 박막 증착 방법
KR101173645B1 (ko) * 2007-12-31 2012-08-20 (주)에이디에스 가스 분사 유닛 및 이를 구비하는 박막 증착 장치
US20120090546A1 (en) * 2009-03-26 2012-04-19 Snu Precision Co., Ltd Source supplying unit, method for supplying source, and thin film depositing apparatus
JP5620146B2 (ja) * 2009-05-22 2014-11-05 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
JP5623786B2 (ja) * 2009-05-22 2014-11-12 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
US8882920B2 (en) * 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) * 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101074792B1 (ko) * 2009-06-12 2011-10-19 삼성모바일디스플레이주식회사 박막 증착 장치
KR101117719B1 (ko) * 2009-06-24 2012-03-08 삼성모바일디스플레이주식회사 박막 증착 장치
KR101127575B1 (ko) * 2009-08-10 2012-03-23 삼성모바일디스플레이주식회사 증착 가림막을 가지는 박막 증착 장치
JP5328726B2 (ja) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
US20110052795A1 (en) * 2009-09-01 2011-03-03 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8876975B2 (en) * 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) * 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101673017B1 (ko) 2010-07-30 2016-11-07 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
WO2012081476A1 (ja) * 2010-12-14 2012-06-21 シャープ株式会社 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
US20130269613A1 (en) * 2012-03-30 2013-10-17 Applied Materials, Inc. Methods and apparatus for generating and delivering a process gas for processing a substrate
US9279185B2 (en) * 2012-06-14 2016-03-08 Asm Technology Singapore Pte Ltd Feed-through apparatus for a chemical vapour deposition device
US9388494B2 (en) 2012-06-25 2016-07-12 Novellus Systems, Inc. Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region
KR102017744B1 (ko) 2012-12-12 2019-10-15 삼성디스플레이 주식회사 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법
KR101448046B1 (ko) * 2012-12-28 2014-10-15 엘아이지에이디피 주식회사 유기발광소자 제조장치
US9399228B2 (en) 2013-02-06 2016-07-26 Novellus Systems, Inc. Method and apparatus for purging and plasma suppression in a process chamber
JP5837962B1 (ja) * 2014-07-08 2015-12-24 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびガス整流部
US10954597B2 (en) * 2015-03-17 2021-03-23 Asm Ip Holding B.V. Atomic layer deposition apparatus
US9758868B1 (en) 2016-03-10 2017-09-12 Lam Research Corporation Plasma suppression behind a showerhead through the use of increased pressure
KR20220035192A (ko) 2019-07-17 2022-03-21 램 리써치 코포레이션 기판 프로세싱을 위한 산화 프로파일의 변조
CN114269966A (zh) * 2019-09-19 2022-04-01 株式会社富士金 气化供给装置
CN116555733B (zh) * 2023-05-17 2024-07-05 拓荆科技(上海)有限公司 一种高温喷淋装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914515A (en) * 1973-07-16 1975-10-21 Rca Corp Process for forming transition metal oxide films on a substrate and photomasks therefrom
GB8328858D0 (en) * 1983-10-28 1983-11-30 Atomic Energy Authority Uk Metal vapour deposition
JPH0758036A (ja) * 1993-08-16 1995-03-03 Ebara Corp 薄膜形成装置
JP3452617B2 (ja) * 1993-12-10 2003-09-29 真空冶金株式会社 ガスデポジション装置
KR100197649B1 (ko) * 1995-09-29 1999-06-15 김영환 박막 증착장치
US5950925A (en) * 1996-10-11 1999-09-14 Ebara Corporation Reactant gas ejector head
JP3579278B2 (ja) * 1999-01-26 2004-10-20 東京エレクトロン株式会社 縦型熱処理装置及びシール装置
DE10007059A1 (de) * 2000-02-16 2001-08-23 Aixtron Ag Verfahren und Vorrichtung zur Herstellung von beschichteten Substraten mittels Kondensationsbeschichtung
TW576873B (en) * 2000-04-14 2004-02-21 Asm Int Method of growing a thin film onto a substrate
US6572706B1 (en) * 2000-06-19 2003-06-03 Simplus Systems Corporation Integrated precursor delivery system
US6886491B2 (en) * 2001-03-19 2005-05-03 Apex Co. Ltd. Plasma chemical vapor deposition apparatus
US6513451B2 (en) 2001-04-20 2003-02-04 Eastman Kodak Company Controlling the thickness of an organic layer in an organic light-emiting device
DE10128091C1 (de) * 2001-06-11 2002-10-02 Applied Films Gmbh & Co Kg Vorrichtung für die Beschichtung eines flächigen Substrats
US6619304B2 (en) * 2001-09-13 2003-09-16 Micell Technologies, Inc. Pressure chamber assembly including non-mechanical drive means
KR100358727B1 (ko) * 2002-04-01 2002-10-31 에이엔 에스 주식회사 기상유기물 증착방법과 이를 이용한 기상유기물 증착장치
US6749906B2 (en) * 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
US6863736B2 (en) * 2002-05-29 2005-03-08 Ibis Technology Corporation Shaft cooling mechanisms
JP2004143521A (ja) * 2002-10-24 2004-05-20 Sony Corp 薄膜形成装置
KR100483834B1 (ko) * 2003-01-06 2005-04-20 삼성전자주식회사 회전식 가열부를 구비한 급속 열처리 장치
JP2005082880A (ja) * 2003-09-11 2005-03-31 Shoka Kagi Kofun Yugenkoshi 有機ｅｌ発光装置の成膜設備

Also Published As

Publication number Publication date
JP2006124837A (ja) 2006-05-18
KR101121417B1 (ko) 2012-03-15
US8157916B2 (en) 2012-04-17
CN1766157A (zh) 2006-05-03
TWI453800B (zh) 2014-09-21
CN1766157B (zh) 2010-08-25
US20060090705A1 (en) 2006-05-04
JP4942985B2 (ja) 2012-05-30
KR20060037513A (ko) 2006-05-03

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