TW200619844A - Pattern-forming material, pattern-forming device, and pattern-forming method - Google Patents

Pattern-forming material, pattern-forming device, and pattern-forming method

Info

Publication number
TW200619844A
TW200619844A TW094129908A TW94129908A TW200619844A TW 200619844 A TW200619844 A TW 200619844A TW 094129908 A TW094129908 A TW 094129908A TW 94129908 A TW94129908 A TW 94129908A TW 200619844 A TW200619844 A TW 200619844A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
forming material
cushion layer
forming method
Prior art date
Application number
TW094129908A
Other languages
Chinese (zh)
Inventor
Masayuki Iwasaki
Yoshiharu Sasaki
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200619844A publication Critical patent/TW200619844A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces

Abstract

The purpose of the present invention is to provide a pattern-forming material which may efficiently form a pattern-forming material having irregularity follow-up property coexistent with high resolution and a defect-free high precision pattern-forming material, a pattern-forming device having said pattern-forming material, and a pattern-forming method using the above pattern-forming material. Therefore, provided are a pattern-forming material characterized in that it has a cushion layer and a photosensitive layer provided on a support in this sequence, wherein the cushion layer has a total light transmittance of 86% or more and a haze value of 10% or less, a pattern-forming device having said pattern-forming material and an pattern-forming method using said pattern-forming material for exposure.
TW094129908A 2004-09-01 2005-08-31 Pattern-forming material, pattern-forming device, and pattern-forming method TW200619844A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004254907A JP2007327979A (en) 2004-09-01 2004-09-01 Pattern forming material, pattern formation apparatus, and pattern forming method

Publications (1)

Publication Number Publication Date
TW200619844A true TW200619844A (en) 2006-06-16

Family

ID=36000039

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129908A TW200619844A (en) 2004-09-01 2005-08-31 Pattern-forming material, pattern-forming device, and pattern-forming method

Country Status (3)

Country Link
JP (1) JP2007327979A (en)
TW (1) TW200619844A (en)
WO (1) WO2006025389A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8632952B2 (en) 2007-11-20 2014-01-21 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive resin cured matter, photosensitive resin film, photosensitive resin film cured matter and optical waveguide obtained by using the same
CN102365584B (en) 2009-01-29 2014-07-30 迪吉福来克斯有限公司 Process for producing a photomask on a photopolymeric surface
JP5782162B2 (en) * 2014-05-29 2015-09-24 三菱製紙株式会社 Photosensitive film for sandblasting
WO2020054075A1 (en) * 2018-09-14 2020-03-19 日立化成株式会社 Transfer-type photosensitive film, method for forming resin cured film, and method for producing sensor substrate with resin cured film

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720309A (en) * 1992-12-16 1995-01-24 Nippon Paper Ind Co Ltd Transfer material for photopolymer, color filter using the same and production thereof
JPH1172908A (en) * 1997-08-29 1999-03-16 Hitachi Chem Co Ltd Photosensitive element and production of color filter
JP2000250222A (en) * 1999-02-26 2000-09-14 Hitachi Chem Co Ltd Colored image forming photosensitive film and production of colored image using same
JP2002311208A (en) * 2001-04-17 2002-10-23 Jsr Corp Curing composition for antireflection film and antireflection film which uses the same
JP4731787B2 (en) * 2002-04-10 2011-07-27 富士フイルム株式会社 Exposure head and exposure apparatus
JP2003307845A (en) * 2002-04-17 2003-10-31 Hitachi Chem Co Ltd Photosensitive film for forming circuit and method for manufacturing printed-wiring board

Also Published As

Publication number Publication date
WO2006025389A1 (en) 2006-03-09
JP2007327979A (en) 2007-12-20

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