TW200628989A - Pattern-forming material and pattern-forming method - Google Patents
Pattern-forming material and pattern-forming methodInfo
- Publication number
- TW200628989A TW200628989A TW094141994A TW94141994A TW200628989A TW 200628989 A TW200628989 A TW 200628989A TW 094141994 A TW094141994 A TW 094141994A TW 94141994 A TW94141994 A TW 94141994A TW 200628989 A TW200628989 A TW 200628989A
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- light
- forming material
- forming
- diffusion
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
- G03F7/0295—Photolytic halogen compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The purpose of the present invention is to provide a pattern-forming material which has improved optical property, and provide a pattern-forming device and a pattern-forming method which may inhibit the distortion of the image formed on the pattern-forming material and efficiently form a defect-free permanent pattern such as wiring pattern and the like with high precision. In other words, the present invention provides a pattern-forming material which has a photosensitive layer on a support having a synthetic resin-made film containing fine particles. The total light transmittance thereof being 80% or more when a light of 405 nm wavelength is irradiated, the angle as diffusion angle between the optical axis of the above irradiated light and the diffusion light is within 2 degrees, and the diffusion light energy relative to the irradiated light energy is within 1% when the above diffusion angle is 1.5 degrees.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004348428A JP2006154622A (en) | 2004-12-01 | 2004-12-01 | Pattern forming material and pattern forming method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200628989A true TW200628989A (en) | 2006-08-16 |
Family
ID=36564968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094141994A TW200628989A (en) | 2004-12-01 | 2005-11-30 | Pattern-forming material and pattern-forming method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006154622A (en) |
TW (1) | TW200628989A (en) |
WO (1) | WO2006059534A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110284139A (en) * | 2018-03-19 | 2019-09-27 | 三星显示有限公司 | Etchant composition and method of fabricating metal pattern and array substrate using the same |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4993458B2 (en) * | 2006-12-04 | 2012-08-08 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition and use thereof |
KR101132057B1 (en) | 2006-12-19 | 2012-04-02 | 히다치 가세고교 가부시끼가이샤 | Photosensitive element |
CN101600995B (en) * | 2007-01-31 | 2012-05-09 | 日立化成工业株式会社 | Photosensitive element |
KR101734425B1 (en) * | 2013-09-24 | 2017-05-11 | 주식회사 엘지화학 | Preparation method for dry film solder resist and film laminate used therein |
WO2015163455A1 (en) * | 2014-04-25 | 2015-10-29 | 日立化成株式会社 | Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package |
JP6227617B2 (en) * | 2014-06-30 | 2017-11-08 | 太陽インキ製造株式会社 | Photosensitive dry film and method for producing printed wiring board using the same |
JP5882510B2 (en) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | Photosensitive dry film and method for producing printed wiring board using the same |
JP2016086000A (en) * | 2014-10-22 | 2016-05-19 | 太陽インキ製造株式会社 | Dry film and printed wiring board |
WO2018179367A1 (en) * | 2017-03-31 | 2018-10-04 | 日立化成株式会社 | Photosensitive element |
JP6299940B1 (en) * | 2017-03-31 | 2018-03-28 | 日立化成株式会社 | Photosensitive element and photosensitive element roll |
JP7040137B2 (en) * | 2018-03-06 | 2022-03-23 | 東レ株式会社 | Biaxially oriented polyester film for dry film resist supports |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62139547A (en) * | 1985-12-13 | 1987-06-23 | Daicel Chem Ind Ltd | Photosensitive laminate body having anti electrostatic property |
JP2697176B2 (en) * | 1989-08-28 | 1998-01-14 | ダイアホイルヘキスト株式会社 | Biaxially oriented polyester film for dry film |
JPH06130657A (en) * | 1991-08-20 | 1994-05-13 | Mitsubishi Rayon Co Ltd | Dry film resist |
JP3789144B2 (en) * | 1994-06-14 | 2006-06-21 | 三菱化学ポリエステルフィルム株式会社 | Laminated polyester film for photoresist |
JPH1039504A (en) * | 1996-07-24 | 1998-02-13 | Nitto Chem Ind Co Ltd | Dry film resist |
JP3820101B2 (en) * | 2000-12-14 | 2006-09-13 | 帝人株式会社 | Biaxially oriented laminated polyester film |
JP2004106322A (en) * | 2002-09-18 | 2004-04-08 | Toray Ind Inc | Laminated polyester film for dry-film photoresist |
JP4096682B2 (en) * | 2002-10-04 | 2008-06-04 | 三菱化学株式会社 | Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same |
JP4305732B2 (en) * | 2003-04-17 | 2009-07-29 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board |
JP2004325596A (en) * | 2003-04-22 | 2004-11-18 | Fuji Photo Film Co Ltd | Dry film photoresist |
JP2004335639A (en) * | 2003-05-06 | 2004-11-25 | Fuji Photo Film Co Ltd | Projection aligner |
JP4244156B2 (en) * | 2003-05-07 | 2009-03-25 | 富士フイルム株式会社 | Projection exposure equipment |
JP4159094B2 (en) * | 2003-10-15 | 2008-10-01 | 東京応化工業株式会社 | Photosensitive resin composition and photosensitive dry film using the same |
JP2005227398A (en) * | 2004-02-10 | 2005-08-25 | Fuji Photo Film Co Ltd | Photosensitive transfer sheet |
JP4515123B2 (en) * | 2004-03-18 | 2010-07-28 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin laminate and use thereof |
JP4485239B2 (en) * | 2004-04-01 | 2010-06-16 | 富士フイルム株式会社 | Pattern formation method |
JP2005292734A (en) * | 2004-04-05 | 2005-10-20 | Fuji Photo Film Co Ltd | Photosensitive transfer sheet and laminate, image pattern forming method, and wiring pattern forming method |
JP4493385B2 (en) * | 2004-04-15 | 2010-06-30 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition and use thereof |
JP2005331695A (en) * | 2004-05-19 | 2005-12-02 | Fuji Photo Film Co Ltd | Photosensitive transfer sheet, photosensitive laminate, image pattern forming method, and wiring pattern forming method |
-
2004
- 2004-12-01 JP JP2004348428A patent/JP2006154622A/en active Pending
-
2005
- 2005-11-24 WO PCT/JP2005/021598 patent/WO2006059534A1/en active Application Filing
- 2005-11-30 TW TW094141994A patent/TW200628989A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110284139A (en) * | 2018-03-19 | 2019-09-27 | 三星显示有限公司 | Etchant composition and method of fabricating metal pattern and array substrate using the same |
CN110284139B (en) * | 2018-03-19 | 2022-05-27 | 三星显示有限公司 | Etchant composition and method of manufacturing metal pattern and array substrate using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2006154622A (en) | 2006-06-15 |
WO2006059534A1 (en) | 2006-06-08 |
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