TW200616134A - Chip carrier tape having number marking of test pads - Google Patents
Chip carrier tape having number marking of test padsInfo
- Publication number
- TW200616134A TW200616134A TW093134941A TW93134941A TW200616134A TW 200616134 A TW200616134 A TW 200616134A TW 093134941 A TW093134941 A TW 093134941A TW 93134941 A TW93134941 A TW 93134941A TW 200616134 A TW200616134 A TW 200616134A
- Authority
- TW
- Taiwan
- Prior art keywords
- test pads
- carrier tape
- chip carrier
- number marking
- analysis
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A chip carrier tape having number marking of test pads defines a plurality of package units and includes a plurality of connection leads﹑test pads and number marks. The testing pads are disposed outside the package units and connected with the corresponding connection leads. The number marks are disposed outside the package units for number-indicating the positions of the test pads. When an electrical analysis is processing, it can use the number marks to find those position of fail test pads quickly. Therefore the probability of the analysis errors can be decreased, and also the efficiency and accuracy of the analysis can be enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93134941A TWI263291B (en) | 2004-11-15 | 2004-11-15 | Chip carrier tape having number marking of test pads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93134941A TWI263291B (en) | 2004-11-15 | 2004-11-15 | Chip carrier tape having number marking of test pads |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200616134A true TW200616134A (en) | 2006-05-16 |
TWI263291B TWI263291B (en) | 2006-10-01 |
Family
ID=37966319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93134941A TWI263291B (en) | 2004-11-15 | 2004-11-15 | Chip carrier tape having number marking of test pads |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI263291B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI483361B (en) * | 2012-03-23 | 2015-05-01 | Chipmos Technologies Inc | Chip packaging substrate and chip packaging structure |
TWI579983B (en) * | 2016-02-04 | 2017-04-21 | 力成科技股份有限公司 | Semiconductor package having id code of molding map hidden in leadframe |
-
2004
- 2004-11-15 TW TW93134941A patent/TWI263291B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI483361B (en) * | 2012-03-23 | 2015-05-01 | Chipmos Technologies Inc | Chip packaging substrate and chip packaging structure |
US9082710B2 (en) | 2012-03-23 | 2015-07-14 | Chipmos Technologies, Inc. | Chip packaging substrate and chip packaging structure |
TWI579983B (en) * | 2016-02-04 | 2017-04-21 | 力成科技股份有限公司 | Semiconductor package having id code of molding map hidden in leadframe |
Also Published As
Publication number | Publication date |
---|---|
TWI263291B (en) | 2006-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |