TW200616134A - Chip carrier tape having number marking of test pads - Google Patents

Chip carrier tape having number marking of test pads

Info

Publication number
TW200616134A
TW200616134A TW093134941A TW93134941A TW200616134A TW 200616134 A TW200616134 A TW 200616134A TW 093134941 A TW093134941 A TW 093134941A TW 93134941 A TW93134941 A TW 93134941A TW 200616134 A TW200616134 A TW 200616134A
Authority
TW
Taiwan
Prior art keywords
test pads
carrier tape
chip carrier
number marking
analysis
Prior art date
Application number
TW093134941A
Other languages
Chinese (zh)
Other versions
TWI263291B (en
Inventor
Sodium Lin
Tung-Bao Lu
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW93134941A priority Critical patent/TWI263291B/en
Publication of TW200616134A publication Critical patent/TW200616134A/en
Application granted granted Critical
Publication of TWI263291B publication Critical patent/TWI263291B/en

Links

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A chip carrier tape having number marking of test pads defines a plurality of package units and includes a plurality of connection leads﹑test pads and number marks. The testing pads are disposed outside the package units and connected with the corresponding connection leads. The number marks are disposed outside the package units for number-indicating the positions of the test pads. When an electrical analysis is processing, it can use the number marks to find those position of fail test pads quickly. Therefore the probability of the analysis errors can be decreased, and also the efficiency and accuracy of the analysis can be enhanced.
TW93134941A 2004-11-15 2004-11-15 Chip carrier tape having number marking of test pads TWI263291B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93134941A TWI263291B (en) 2004-11-15 2004-11-15 Chip carrier tape having number marking of test pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93134941A TWI263291B (en) 2004-11-15 2004-11-15 Chip carrier tape having number marking of test pads

Publications (2)

Publication Number Publication Date
TW200616134A true TW200616134A (en) 2006-05-16
TWI263291B TWI263291B (en) 2006-10-01

Family

ID=37966319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93134941A TWI263291B (en) 2004-11-15 2004-11-15 Chip carrier tape having number marking of test pads

Country Status (1)

Country Link
TW (1) TWI263291B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483361B (en) * 2012-03-23 2015-05-01 Chipmos Technologies Inc Chip packaging substrate and chip packaging structure
TWI579983B (en) * 2016-02-04 2017-04-21 力成科技股份有限公司 Semiconductor package having id code of molding map hidden in leadframe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483361B (en) * 2012-03-23 2015-05-01 Chipmos Technologies Inc Chip packaging substrate and chip packaging structure
US9082710B2 (en) 2012-03-23 2015-07-14 Chipmos Technologies, Inc. Chip packaging substrate and chip packaging structure
TWI579983B (en) * 2016-02-04 2017-04-21 力成科技股份有限公司 Semiconductor package having id code of molding map hidden in leadframe

Also Published As

Publication number Publication date
TWI263291B (en) 2006-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees