TW200613359A - Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition - Google Patents

Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition

Info

Publication number
TW200613359A
TW200613359A TW094128679A TW94128679A TW200613359A TW 200613359 A TW200613359 A TW 200613359A TW 094128679 A TW094128679 A TW 094128679A TW 94128679 A TW94128679 A TW 94128679A TW 200613359 A TW200613359 A TW 200613359A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
phenol
manufacturing
novel
resin
Prior art date
Application number
TW094128679A
Other languages
English (en)
Chinese (zh)
Inventor
Ichirou Ogura
Yoshiyuki Takahashi
Kazuo Arita
Kunihiro Morinaga
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of TW200613359A publication Critical patent/TW200613359A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/11Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
    • C07C37/20Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms using aldehydes or ketones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW094128679A 2004-08-23 2005-08-23 Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition TW200613359A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004242210 2004-08-23

Publications (1)

Publication Number Publication Date
TW200613359A true TW200613359A (en) 2006-05-01

Family

ID=35967463

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128679A TW200613359A (en) 2004-08-23 2005-08-23 Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition

Country Status (2)

Country Link
TW (1) TW200613359A (ja)
WO (1) WO2006022251A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486408B (zh) * 2009-10-20 2015-06-01 Nippon Kayaku Kk 紫外線硬化型硬塗層樹脂組成物、使用該組成物之硬塗層膜及硬塗層成形物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03221516A (ja) * 1990-01-29 1991-09-30 Dainippon Ink & Chem Inc エポキシ樹脂の製造方法とエポキシ樹脂組成物
JPH08193110A (ja) * 1995-01-13 1996-07-30 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JPH10237158A (ja) * 1997-02-28 1998-09-08 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP3944765B2 (ja) * 2001-01-30 2007-07-18 大日本インキ化学工業株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486408B (zh) * 2009-10-20 2015-06-01 Nippon Kayaku Kk 紫外線硬化型硬塗層樹脂組成物、使用該組成物之硬塗層膜及硬塗層成形物

Also Published As

Publication number Publication date
WO2006022251A1 (ja) 2006-03-02

Similar Documents

Publication Publication Date Title
EA200800597A1 (ru) Композиции отвержденного меркаптаном эпоксидного полимера и способы производства и применения таких композиций
DE602007005002D1 (de) Modifizierte hydrocarbylphenol-aldehydharze als klebrigmacher und diese enthaltende kautschukzusammensetzungen
MY146603A (en) Expoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel expoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
MXPA05012793A (es) Resinas fenolicas silano-modificadas y sus aplicaciones.
WO2010024642A3 (en) Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition
ATE377059T1 (de) Polysilazanmodifizierte polyaminhärtungsmittel für epoxidharze
TW200613358A (en) Curing agent for epoxy resins and epoxy resin composition
TW201129625A (en) Chain curable resin composition and fiber-reinforced composite material
MY173397A (en) Liquid hardeners for hardening epoxide resins (i)
WO2011059633A3 (en) Polyoxazolidone resins
WO2009001658A1 (ja) 一液型シアネート-エポキシ複合樹脂組成物
ATE409712T1 (de) Epoxidharz zusammensetzung
TW200706593A (en) Molding composition and method, and molded article
TW200801081A (en) Novel phenolic resin, its preparation and its use
TW200710160A (en) Hardenable epoxy resin composition
TW200732366A (en) Thermosetting resin composition
MY155689A (en) Resin composition for encapsulating semiconductor and semiconductor device
MX2012000750A (es) Metodo para manufacturar una composicion de poliester que tiene propiedades al impacto mejoradas.
WO2009038097A1 (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物
WO2008143314A1 (ja) 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物
SI2307360T1 (sl) Postopek za izdelavo oblikovanih teles z uporabo meĺ anice aminov z derivati gvanidina
ATE446175T1 (de) Verfahren zur herstellung eines bauteils aus recyceltem material
MX2013012319A (es) Resinas de poliamidoamina-epihalohidrina, metodo de fabricacion y usos de las mismas.
WO2009060576A1 (ja) 粉末状エポキシ樹脂用潜在性硬化剤の製造方法、その方法によって得られた粉末状エポキシ樹脂用潜在性硬化剤、及びそれを用いた硬化性エポキシ樹脂組成物
TW200613359A (en) Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition