WO2008143314A1 - 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物 - Google Patents

液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物 Download PDF

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Publication number
WO2008143314A1
WO2008143314A1 PCT/JP2008/059420 JP2008059420W WO2008143314A1 WO 2008143314 A1 WO2008143314 A1 WO 2008143314A1 JP 2008059420 W JP2008059420 W JP 2008059420W WO 2008143314 A1 WO2008143314 A1 WO 2008143314A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
bisphenol
type epoxy
resin
type
Prior art date
Application number
PCT/JP2008/059420
Other languages
English (en)
French (fr)
Inventor
Masataka Nakanishi
Kenichi Kuboki
Katsuhiko Oshimi
Takao Sunaga
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to CN2008800166724A priority Critical patent/CN101679600B/zh
Priority to KR1020097022662A priority patent/KR101407434B1/ko
Priority to JP2009515268A priority patent/JP5386352B2/ja
Publication of WO2008143314A1 publication Critical patent/WO2008143314A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

本発明は、ビスフェノールＦ、ビスフェノールＡ、フェノールアラルキル樹脂及びトリスフェノールメタン型樹脂からなる群から選ばれる少なくとも３種のフェノール体の混合物とエピハロヒドリンとを反応させて得られる液状エポキシ樹脂、又は（ａ）ビスフェノールＦ、ビスフェノールＡ、フェノールアラルキル樹脂及びトリスフェノールメタン型樹脂からなる群から選ばれる少なくとも２種のフェノール体の混合物とエピハロヒドリンとを反応させて得られる混合エポキシ樹脂、及び（ｂ）ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂及びトリスフェノールメタン型エポキシ樹脂からなる群から選ばれる少なくとも１種のエポキシ樹脂、の混合物であって、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂及びトリスフェノールメタン型エポキシ樹脂からなる群から選ばれる少なくとも３種のエポキシ樹脂を含む液状エポキシ樹脂組成物についてである。
PCT/JP2008/059420 2007-05-24 2008-05-22 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物 WO2008143314A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800166724A CN101679600B (zh) 2007-05-24 2008-05-22 液态环氧树脂、环氧树脂组合物及固化物
KR1020097022662A KR101407434B1 (ko) 2007-05-24 2008-05-22 액상 에폭시 수지, 에폭시 수지 조성물 및 경화물
JP2009515268A JP5386352B2 (ja) 2007-05-24 2008-05-22 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-137665 2007-05-24
JP2007137665 2007-05-24

Publications (1)

Publication Number Publication Date
WO2008143314A1 true WO2008143314A1 (ja) 2008-11-27

Family

ID=40032007

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059420 WO2008143314A1 (ja) 2007-05-24 2008-05-22 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物

Country Status (5)

Country Link
JP (1) JP5386352B2 (ja)
KR (1) KR101407434B1 (ja)
CN (1) CN101679600B (ja)
TW (1) TWI425019B (ja)
WO (1) WO2008143314A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623942B2 (en) 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator
US8653160B2 (en) 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
JP2016037546A (ja) * 2014-08-07 2016-03-22 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
KR20200033842A (ko) * 2017-07-21 2020-03-30 디아이씨 가부시끼가이샤 에폭시 수지, 및 이것을 포함하는 에폭시 수지 조성물, 그리고 상기 에폭시 수지 조성물을 사용한 경화물

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421269B (zh) * 2009-12-29 2014-01-01 Swancor Ind Co Ltd Epoxy resin composition
CN102344547B (zh) * 2011-07-11 2013-03-06 山东圣泉化工股份有限公司 浅色苯酚芳烷基树脂及其制备方法
CN110891998B (zh) * 2017-07-14 2022-06-10 Dic株式会社 环氧树脂、及包含其的环氧树脂组合物、以及使用了前述环氧树脂组合物的固化物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02219812A (ja) * 1989-02-21 1990-09-03 Hitachi Ltd 熱硬化性樹脂組成物及びそれを用いたコイル、パネル
JPH02311513A (ja) * 1989-05-26 1990-12-27 Mitsui Petrochem Ind Ltd 耐熱難燃性エポキシ樹脂組成物
JPH03722A (ja) * 1989-05-29 1991-01-07 Mitsui Petrochem Ind Ltd 耐熱難燃性エポキシ樹脂組成物
JPH0317117A (ja) * 1989-06-15 1991-01-25 Mitsui Petrochem Ind Ltd 耐熱性エポキシ樹脂組成物
JPH059269A (ja) * 1991-07-03 1993-01-19 Dow Chem Nippon Kk 電気積層板用エポキシ樹脂組成物
JPH09151299A (ja) * 1995-11-30 1997-06-10 Nissan Motor Co Ltd コーティング用エポキシ樹脂組成物
JP2001064355A (ja) * 1999-08-31 2001-03-13 Sumitomo Chem Co Ltd エポキシ樹脂の製造方法
JP2005226004A (ja) * 2004-02-13 2005-08-25 Nippon Steel Chem Co Ltd エポキシ樹脂の製造方法、エポキシ樹脂組成物及び硬化物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2017613A1 (en) * 1989-05-29 1990-11-29 Kiyomi Yasuda Heat-resistant, flame-retardant epoxy resin compositions

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02219812A (ja) * 1989-02-21 1990-09-03 Hitachi Ltd 熱硬化性樹脂組成物及びそれを用いたコイル、パネル
JPH02311513A (ja) * 1989-05-26 1990-12-27 Mitsui Petrochem Ind Ltd 耐熱難燃性エポキシ樹脂組成物
JPH03722A (ja) * 1989-05-29 1991-01-07 Mitsui Petrochem Ind Ltd 耐熱難燃性エポキシ樹脂組成物
JPH0317117A (ja) * 1989-06-15 1991-01-25 Mitsui Petrochem Ind Ltd 耐熱性エポキシ樹脂組成物
JPH059269A (ja) * 1991-07-03 1993-01-19 Dow Chem Nippon Kk 電気積層板用エポキシ樹脂組成物
JPH09151299A (ja) * 1995-11-30 1997-06-10 Nissan Motor Co Ltd コーティング用エポキシ樹脂組成物
JP2001064355A (ja) * 1999-08-31 2001-03-13 Sumitomo Chem Co Ltd エポキシ樹脂の製造方法
JP2005226004A (ja) * 2004-02-13 2005-08-25 Nippon Steel Chem Co Ltd エポキシ樹脂の製造方法、エポキシ樹脂組成物及び硬化物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
US8653160B2 (en) 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation
US8623942B2 (en) 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator
JP2016037546A (ja) * 2014-08-07 2016-03-22 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
KR20200033842A (ko) * 2017-07-21 2020-03-30 디아이씨 가부시끼가이샤 에폭시 수지, 및 이것을 포함하는 에폭시 수지 조성물, 그리고 상기 에폭시 수지 조성물을 사용한 경화물
EP3656799A4 (en) * 2017-07-21 2020-12-16 DIC Corporation EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING IT, AND CURED OBJECT OBTAINED FROM THE SAID EPOXY RESIN COMPOSITION
KR102425937B1 (ko) 2017-07-21 2022-07-28 디아이씨 가부시끼가이샤 에폭시 수지, 및 이것을 포함하는 에폭시 수지 조성물, 그리고 상기 에폭시 수지 조성물을 사용한 경화물

Also Published As

Publication number Publication date
KR101407434B1 (ko) 2014-06-13
KR20100021998A (ko) 2010-02-26
JPWO2008143314A1 (ja) 2010-08-12
CN101679600B (zh) 2012-07-18
TWI425019B (zh) 2014-02-01
TW200909467A (en) 2009-03-01
CN101679600A (zh) 2010-03-24
JP5386352B2 (ja) 2014-01-15

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