TW200611420A - Integrated circuit package and fabrication method thereof - Google Patents
Integrated circuit package and fabrication method thereofInfo
- Publication number
- TW200611420A TW200611420A TW094122693A TW94122693A TW200611420A TW 200611420 A TW200611420 A TW 200611420A TW 094122693 A TW094122693 A TW 094122693A TW 94122693 A TW94122693 A TW 94122693A TW 200611420 A TW200611420 A TW 200611420A
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- circuit package
- die
- substrate
- fabrication method
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/947,592 US7138300B2 (en) | 2004-09-22 | 2004-09-22 | Structural design for flip-chip assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200611420A true TW200611420A (en) | 2006-04-01 |
TWI267203B TWI267203B (en) | 2006-11-21 |
Family
ID=36074566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094122693A TWI267203B (en) | 2004-09-22 | 2005-07-05 | Integrated circuit package and fabrication method thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US7138300B2 (zh) |
TW (1) | TWI267203B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101278393A (zh) * | 2005-09-29 | 2008-10-01 | 日本电气株式会社 | 半导体封装、衬底、使用这种半导体封装或衬底的电子器件和用于校正半导体封装翘曲的方法 |
US8212352B2 (en) * | 2007-03-28 | 2012-07-03 | Stats Chippac Ltd. | Integrated circuit package system with heat sink spacer structures |
US11710672B2 (en) * | 2019-07-08 | 2023-07-25 | Intel Corporation | Microelectronic package with underfilled sealant |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4583283A (en) | 1982-03-26 | 1986-04-22 | Motorola, Inc. | Electrically isolated semiconductor power device |
US4561040A (en) | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4914551A (en) | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
JPH0228351A (ja) | 1988-07-18 | 1990-01-30 | Hitachi Ltd | 半導体装置 |
US5057909A (en) | 1990-01-29 | 1991-10-15 | International Business Machines Corporation | Electronic device and heat sink assembly |
US5148266A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5151388A (en) | 1991-05-07 | 1992-09-29 | Hughes Aircraft Company | Flip interconnect |
US5459027A (en) * | 1991-06-28 | 1995-10-17 | Fuji Photo Film Co., Ltd. | Silver halide photographic light-sensitive material |
JP2845022B2 (ja) | 1992-04-06 | 1999-01-13 | 日本電気株式会社 | 半導体装置 |
US5311402A (en) | 1992-02-14 | 1994-05-10 | Nec Corporation | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
JPH05235098A (ja) | 1992-02-21 | 1993-09-10 | Fujitsu Ltd | フリップチップ実装方法 |
US5289337A (en) | 1992-02-21 | 1994-02-22 | Intel Corporation | Heatspreader for cavity down multi-chip module with flip chip |
US5371404A (en) * | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
US5459352A (en) | 1993-03-31 | 1995-10-17 | Unisys Corporation | Integrated circuit package having a liquid metal-aluminum/copper joint |
US5579249A (en) * | 1993-11-01 | 1996-11-26 | Texas Instruments Incorporated | System for modeling an integrated chip package and method of operation |
US5650918A (en) | 1993-11-25 | 1997-07-22 | Nec Corporation | Semiconductor device capable of preventing occurrence of a shearing stress |
US5497027A (en) | 1993-11-30 | 1996-03-05 | At&T Global Information Solutions Company | Multi-chip module packaging system |
US5753529A (en) | 1994-05-05 | 1998-05-19 | Siliconix Incorporated | Surface mount and flip chip technology for total integrated circuit isolation |
MY112145A (en) | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
US5521406A (en) | 1994-08-31 | 1996-05-28 | Texas Instruments Incorporated | Integrated circuit with improved thermal impedance |
JPH0878584A (ja) | 1994-09-06 | 1996-03-22 | Hitachi Ltd | 電子パッケージ |
US5504652A (en) | 1994-09-16 | 1996-04-02 | Apple Computer, Inc. | Unitary heat sink for integrated circuits |
US5767578A (en) | 1994-10-12 | 1998-06-16 | Siliconix Incorporated | Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation |
US5610442A (en) | 1995-03-27 | 1997-03-11 | Lsi Logic Corporation | Semiconductor device package fabrication method and apparatus |
US5621615A (en) | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
US5744869A (en) | 1995-12-05 | 1998-04-28 | Motorola, Inc. | Apparatus for mounting a flip-chip semiconductor device |
US5789810A (en) | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
US5723369A (en) | 1996-03-14 | 1998-03-03 | Lsi Logic Corporation | Method of flip chip assembly |
US5801072A (en) | 1996-03-14 | 1998-09-01 | Lsi Logic Corporation | Method of packaging integrated circuits |
JP2806362B2 (ja) | 1996-06-03 | 1998-09-30 | 日本電気株式会社 | 半導体装置の製造方法 |
US5726079A (en) * | 1996-06-19 | 1998-03-10 | International Business Machines Corporation | Thermally enhanced flip chip package and method of forming |
JP2853666B2 (ja) | 1996-07-16 | 1999-02-03 | 日本電気株式会社 | マルチチップモジュール |
US5736785A (en) | 1996-12-20 | 1998-04-07 | Industrial Technology Research Institute | Semiconductor package for improving the capability of spreading heat |
US5891753A (en) * | 1997-01-24 | 1999-04-06 | Micron Technology, Inc. | Method and apparatus for packaging flip chip bare die on printed circuit boards |
US5773877A (en) | 1997-02-07 | 1998-06-30 | Ford Motor Company | Plastic encapsulated IC package and method of designing same |
US5986885A (en) | 1997-04-08 | 1999-11-16 | Integrated Device Technology, Inc. | Semiconductor package with internal heatsink and assembly method |
US6507116B1 (en) * | 1997-04-24 | 2003-01-14 | International Business Machines Corporation | Electronic package and method of forming |
US6104093A (en) * | 1997-04-24 | 2000-08-15 | International Business Machines Corporation | Thermally enhanced and mechanically balanced flip chip package and method of forming |
US6285078B1 (en) | 1997-11-25 | 2001-09-04 | Intel Corporation | Thermal spreader cap and grease containment structure for semiconductor device |
US5903436A (en) | 1997-12-30 | 1999-05-11 | Intel Corporation | Emulative lid/heatspreader for processor die attached to an organic substrate |
US7082033B1 (en) | 1998-02-13 | 2006-07-25 | Micron Technology, Inc. | Removing heat from integrated circuit devices mounted on a support structure |
US6118177A (en) * | 1998-11-17 | 2000-09-12 | Lucent Technologies, Inc. | Heatspreader for a flip chip device, and method for connecting the heatspreader |
US6723369B2 (en) * | 1999-05-27 | 2004-04-20 | James M. Burgess | Carbonated beverage for strengthening acid resistancy of teeth |
JP2002033411A (ja) * | 2000-07-13 | 2002-01-31 | Nec Corp | ヒートスプレッダ付き半導体装置及びその製造方法 |
US6512295B2 (en) * | 2001-03-01 | 2003-01-28 | International Business Machines Corporation | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses |
US6459144B1 (en) * | 2001-03-02 | 2002-10-01 | Siliconware Precision Industries Co., Ltd. | Flip chip semiconductor package |
TW529112B (en) | 2002-01-07 | 2003-04-21 | Advanced Semiconductor Eng | Flip-chip packaging having heat sink member and the manufacturing process thereof |
US6750552B1 (en) * | 2002-12-18 | 2004-06-15 | Netlogic Microsystems, Inc. | Integrated circuit package with solder bumps |
-
2004
- 2004-09-22 US US10/947,592 patent/US7138300B2/en not_active Expired - Fee Related
-
2005
- 2005-07-05 TW TW094122693A patent/TWI267203B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI267203B (en) | 2006-11-21 |
US7138300B2 (en) | 2006-11-21 |
US20060063300A1 (en) | 2006-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |