TW200610037A - Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions - Google Patents

Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions

Info

Publication number
TW200610037A
TW200610037A TW093126919A TW93126919A TW200610037A TW 200610037 A TW200610037 A TW 200610037A TW 093126919 A TW093126919 A TW 093126919A TW 93126919 A TW93126919 A TW 93126919A TW 200610037 A TW200610037 A TW 200610037A
Authority
TW
Taiwan
Prior art keywords
ultra
fabricating
transistor device
semiconductor transistor
gate structure
Prior art date
Application number
TW093126919A
Other languages
English (en)
Other versions
TWI240962B (en
Inventor
Yun-Ren Wang
Ying-Wei Yen
Shu-Yen Chan
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW93126919A priority Critical patent/TWI240962B/zh
Application granted granted Critical
Publication of TWI240962B publication Critical patent/TWI240962B/zh
Publication of TW200610037A publication Critical patent/TW200610037A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7842Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW93126919A 2004-09-06 2004-09-06 Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions TWI240962B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93126919A TWI240962B (en) 2004-09-06 2004-09-06 Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93126919A TWI240962B (en) 2004-09-06 2004-09-06 Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions

Publications (2)

Publication Number Publication Date
TWI240962B TWI240962B (en) 2005-10-01
TW200610037A true TW200610037A (en) 2006-03-16

Family

ID=37013000

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93126919A TWI240962B (en) 2004-09-06 2004-09-06 Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions

Country Status (1)

Country Link
TW (1) TWI240962B (zh)

Also Published As

Publication number Publication date
TWI240962B (en) 2005-10-01

Similar Documents

Publication Publication Date Title
CN100452400C (zh) 沟槽应变抬升源/漏结构及其制造方法
US7288443B2 (en) Structures and methods for manufacturing p-type MOSFET with graded embedded silicon-germanium source-drain and/or extension
KR101703096B1 (ko) 반도체 장치의 제조방법
JP2009514220A5 (zh)
US20180108574A1 (en) Finfet device and fabrication method thereof
TW200636873A (en) Semiconductor fabrication process including recessed source/drain regions in an SOI wafer
JP2006517343A5 (zh)
TW200611331A (en) Method of forming improved rounded corners in sti features
US20130285117A1 (en) CMOS WITH SiGe CHANNEL PFETs AND METHOD OF FABRICATION
US20120292637A1 (en) Dual Cavity Etch for Embedded Stressor Regions
JP3821707B2 (ja) 半導体装置の製造方法
JP2009535844A5 (zh)
CN102903639A (zh) Mos晶体管、具有应力层的衬底及其形成方法
US6875680B1 (en) Methods of manufacturing transistors using dummy gate patterns
CN102931232A (zh) Nmos晶体管及其形成方法
CN102931233B (zh) Nmos晶体管及其形成方法
CN102237396B (zh) 半导体器件及其制造方法
EP1353369A3 (en) Method for producing semiconductor device
TW200723406A (en) Method for fabricating trench metal oxide semiconductor field effect transistor
TW200610037A (en) Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions
CN102915971A (zh) 一种半导体器件的制造方法
CN103378151B (zh) 一种降低负载效应的硅锗结构及其形成方法
CN102983173A (zh) 具有槽型结构的应变nmosfet及其制作方法
CN102903635B (zh) Mos晶体管的制造方法
US7727829B2 (en) Method of forming a semiconductor device having a removable sidewall spacer

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees