TW200609251A - Thermosetting composition, halation preventing film of solid state imaging device and its forming method, and solid state imaging device - Google Patents
Thermosetting composition, halation preventing film of solid state imaging device and its forming method, and solid state imaging deviceInfo
- Publication number
- TW200609251A TW200609251A TW094109436A TW94109436A TW200609251A TW 200609251 A TW200609251 A TW 200609251A TW 094109436 A TW094109436 A TW 094109436A TW 94109436 A TW94109436 A TW 94109436A TW 200609251 A TW200609251 A TW 200609251A
- Authority
- TW
- Taiwan
- Prior art keywords
- imaging device
- solid state
- state imaging
- thermosetting composition
- compound
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 7
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 4
- 238000003384 imaging method Methods 0.000 title abstract 3
- 239000007787 solid Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 4
- 150000008065 acid anhydrides Chemical class 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 229920001577 copolymer Polymers 0.000 abstract 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 150000002148 esters Chemical group 0.000 abstract 1
- -1 ethylene ether compound Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 125000000999 tert-butyl group Chemical class [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 abstract 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 abstract 1
- 150000003555 thioacetals Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/60—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing nitrogen in addition to the carbonamido nitrogen
- C08F220/603—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing nitrogen in addition to the carbonamido nitrogen and containing oxygen in addition to the carbonamido oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004096087A JP4671016B2 (ja) | 2004-03-29 | 2004-03-29 | 熱硬化性組成物、固体撮像素子のハレーション防止膜およびその形成方法、ならびに固体撮像素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200609251A true TW200609251A (en) | 2006-03-16 |
Family
ID=35049311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094109436A TW200609251A (en) | 2004-03-29 | 2005-03-25 | Thermosetting composition, halation preventing film of solid state imaging device and its forming method, and solid state imaging device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4671016B2 (zh) |
| KR (1) | KR101098079B1 (zh) |
| CN (1) | CN100500768C (zh) |
| TW (1) | TW200609251A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4963920B2 (ja) * | 2005-10-03 | 2012-06-27 | 株式会社日本触媒 | 非晶性熱可塑性樹脂、及び、押し出しフィルム又はシート |
| JP2007332200A (ja) * | 2006-06-13 | 2007-12-27 | Jsr Corp | 熱硬化性樹脂組成物、固体撮像素子のハレーション防止膜の形成方法、固体撮像素子のハレーション防止膜、ならびに固体撮像素子 |
| CN103608396B (zh) * | 2011-07-07 | 2016-08-17 | 日产化学工业株式会社 | 树脂组合物 |
| WO2023243516A1 (ja) * | 2022-06-14 | 2023-12-21 | デンカ株式会社 | 反応性硬化剤 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001019721A (ja) * | 1999-07-09 | 2001-01-23 | Nippon Shokubai Co Ltd | 硬化性樹脂組成物 |
| JP3951302B2 (ja) * | 2002-11-29 | 2007-08-01 | Ｊｓｒ株式会社 | 熱硬化性組成物、固体撮像素子のハレーション防止膜およびその形成方法、ならびに固体撮像素子 |
-
2004
- 2004-03-29 JP JP2004096087A patent/JP4671016B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-25 TW TW094109436A patent/TW200609251A/zh unknown
- 2005-03-28 KR KR1020050025344A patent/KR101098079B1/ko active IP Right Grant
- 2005-03-29 CN CNB2005100595643A patent/CN100500768C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1676549A (zh) | 2005-10-05 |
| JP2005281445A (ja) | 2005-10-13 |
| KR20060044820A (ko) | 2006-05-16 |
| JP4671016B2 (ja) | 2011-04-13 |
| CN100500768C (zh) | 2009-06-17 |
| KR101098079B1 (ko) | 2011-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1057859A3 (en) | Radiation sensitive resin composition and use of the same in an interlaminar insulating film | |
| JP6477504B2 (ja) | 接着剤組成物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子 | |
| KR101821004B1 (ko) | 액침 상층막 형성용 조성물 및 중합체 | |
| KR910018502A (ko) | 열경화성 수지 조성물 | |
| JP2011053652A (ja) | 上塗りフォトレジストと共に使用するのに好適なコーティング組成物 | |
| TW200609251A (en) | Thermosetting composition, halation preventing film of solid state imaging device and its forming method, and solid state imaging device | |
| CN111587402B (zh) | 抗蚀剂组合物和抗蚀剂膜 | |
| TW200728910A (en) | Radiation sensitive resin composition, interlayer-insulated film, microlens, and the method for forming them | |
| DK1357140T3 (da) | Acrylatcopolymerer og deraf opnåelige permanentklæbemasser til sammenklæbning af lavenergetiske overflader | |
| WO2016109532A1 (en) | Photoimageable compositions containing thermal base generators | |
| JP2016099374A (ja) | 感光性エレメント、レジストパターン付き基材の製造方法、プリント配線板の製造方法、及びタッチパネルの製造方法 | |
| JP2011037981A (ja) | 樹脂組成物及び樹脂組成物を使用して作製した半導体装置 | |
| KR20200012766A (ko) | 화학 증폭형 포지티브형 감광성 수지 조성물, 주형이 부착된 기판의 제조 방법, 및 도금 조형물의 제조 방법 | |
| JP2000119472A5 (zh) | ||
| WO2015076309A1 (ja) | 硬化性組成物、硬化物、カメラモジュール、および撮像装置の製造方法 | |
| WO2009116401A1 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板 | |
| JP6675820B2 (ja) | アクリル樹脂組成物及び電子部品 | |
| JP6547632B2 (ja) | 接着剤組成物、接着剤組成物から得られる樹脂硬化物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子 | |
| TW200510932A (en) | Radiation-sensitive resin composition, interlayer insulating film, microlens and their manufacturing method | |
| KR101476498B1 (ko) | 아크릴레이트 수지 및 이를 포함하는 화학증폭형 포지티브 포토레지스트 조성물 | |
| KR20150136530A (ko) | 광 소성용 열가소성 수지 필름 기재, 이를 사용한 도전 회로 기판 및 그의 제조 방법 | |
| JP2009108186A (ja) | 樹脂組成物及び樹脂組成物を使用して作製した半導体装置 | |
| TWI819083B (zh) | 壓印用硬化性組成物、圖案的製造方法、半導體元件的製造方法及硬化物 | |
| KR20130119911A (ko) | 액상 수지 조성물 및 반도체 장치 | |
| US20070172756A1 (en) | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed wiring board |