TW200608873A - Processor heat sink retention module and assembly - Google Patents

Processor heat sink retention module and assembly

Info

Publication number
TW200608873A
TW200608873A TW094116298A TW94116298A TW200608873A TW 200608873 A TW200608873 A TW 200608873A TW 094116298 A TW094116298 A TW 094116298A TW 94116298 A TW94116298 A TW 94116298A TW 200608873 A TW200608873 A TW 200608873A
Authority
TW
Taiwan
Prior art keywords
frame elements
heat sink
retention module
assembly
footprint
Prior art date
Application number
TW094116298A
Other languages
English (en)
Inventor
Stephen Damian Delprete
Donald Phillip Amaral
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of TW200608873A publication Critical patent/TW200608873A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094116298A 2004-05-19 2005-05-19 Processor heat sink retention module and assembly TW200608873A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/848,975 US7133288B2 (en) 2004-05-19 2004-05-19 Processor heat sink retention module and assembly

Publications (1)

Publication Number Publication Date
TW200608873A true TW200608873A (en) 2006-03-01

Family

ID=35374927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116298A TW200608873A (en) 2004-05-19 2005-05-19 Processor heat sink retention module and assembly

Country Status (3)

Country Link
US (1) US7133288B2 (zh)
CN (1) CN100463149C (zh)
TW (1) TW200608873A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465887B (zh) * 2012-01-05 2014-12-21 Acer Inc 電子裝置

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI262379B (en) * 2005-02-21 2006-09-21 Delta Electronics Inc Head dissipating module and clamping member thereof
TW200701871A (en) * 2005-06-24 2007-01-01 Micro Star Int Co Ltd Heat dissipation device
US7265980B2 (en) * 2005-08-01 2007-09-04 Asia Vital Component Co., Ltd. Frame of a heat sink for a CPU in a computer
US7385826B2 (en) * 2005-12-28 2008-06-10 International Business Machines Corporation Method to secure a heat sink
US20070246637A1 (en) * 2006-04-12 2007-10-25 Lotes Co., Ltd. Seat of heat dissipating device
US7292443B1 (en) * 2006-10-03 2007-11-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink mounting assembly
US20080084662A1 (en) * 2006-10-05 2008-04-10 Giga-Byte Technology Co., Ltd. Heat-dissipating device
US7518875B2 (en) * 2006-12-14 2009-04-14 International Business Machines Corporation Securing heat sinks to a device under test
US7606032B2 (en) * 2007-05-01 2009-10-20 Asia Vital Components Co., Ltd. Structural screw secure device for a radiator assembly
US7742301B2 (en) * 2007-12-18 2010-06-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating assembly
US20090284931A1 (en) * 2008-05-15 2009-11-19 International Business Machines Corporation Nested fin integral heat sink assembly for multiple high power electonic circuit board modules
US8422229B2 (en) * 2009-06-25 2013-04-16 Oracle America, Inc. Molded heat sink and method of making same
CN101990390A (zh) * 2009-08-06 2011-03-23 富准精密工业(深圳)有限公司 扣具及应用该扣具的散热装置组合
US7957149B2 (en) * 2009-08-19 2011-06-07 International Business Machines Corporation Top actuated, force limiting heatsink retention system
CN102076204A (zh) * 2009-11-19 2011-05-25 鸿富锦精密工业（深圳）有限公司 散热装置及使用该散热装置的电子装置
US8139361B2 (en) * 2009-12-16 2012-03-20 International Business Machines Corporation Apparatus and method for attaching selected components to a printed circuit board
JP4635101B1 (ja) * 2009-12-25 2011-02-23 株式会社東芝 冷却装置、および電子機器
CN102300421A (zh) * 2010-06-23 2011-12-28 鸿富锦精密工业（深圳）有限公司 电子装置壳体
CN102469705A (zh) * 2010-11-03 2012-05-23 鸿富锦精密工业（深圳）有限公司 电子装置壳体
CN102765065B (zh) * 2011-05-05 2014-10-08 纬创资通股份有限公司 用来夹持散热片的夹钳治具
TWI669480B (zh) * 2019-01-22 2019-08-21 奇鋐科技股份有限公司 固定結構之承載單元及散熱總成之固定結構

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5307239A (en) * 1992-10-08 1994-04-26 Unisys Corporation Electromechanical module with small footprint and post-solder attachable/removable heat sink frame
US6055159A (en) * 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
TW505254U (en) * 1999-09-23 2002-10-01 Foxconn Prec Components Co Ltd Heat sink module having air guiding device
US6542367B2 (en) * 2001-05-31 2003-04-01 Intel Corporation Securing heat sinks
US6519153B1 (en) * 2001-08-08 2003-02-11 Intel Corporation Heat sink retention frame
US6419008B1 (en) * 2001-11-13 2002-07-16 Nextronics Engineering Corp. CPU cooling device with a mounting mechanism
TW578981U (en) * 2001-11-30 2004-03-01 Foxconn Prec Components Co Ltd Heat dissipating assembly
TW582568U (en) * 2001-12-12 2004-04-01 Hon Hai Prec Ind Co Ltd Fixing apparatus of back-plate
US6525941B1 (en) * 2001-12-27 2003-02-25 Tai-Sol Electronics Co., Ltd. Heat dissipating device with a pressing member that is rotatable to urge a fan module toward a circuit board
US6570763B1 (en) * 2002-02-12 2003-05-27 Hon Hai Precision Ind. Co., Ltd. Heat sink securing means
TW562166U (en) * 2002-02-22 2003-11-11 Hon Hai Prec Ind Co Ltd Assembly of back plate fixing device
TW584218U (en) * 2002-06-06 2004-04-11 Hon Hai Prec Ind Co Ltd Mounting device for heat sink
TW590243U (en) * 2002-06-28 2004-06-01 Hon Hai Prec Components Co Ltd Lateral slide resisting structure for heat sink
US6574109B1 (en) * 2002-07-03 2003-06-03 Hon Hai Precision Ind. Co., Ltd. Retainer device for heat sink assembly
TW536121U (en) * 2002-07-26 2003-06-01 Hon Hai Prec Ind Co Ltd Retaining device
US6704976B1 (en) * 2002-08-27 2004-03-16 Wan-Tien Chen Fastener for a heat-radiator
TW545885U (en) * 2002-11-29 2003-08-01 Hon Hai Prec Ind Co Ltd Heat dissipation assembly
US6854993B1 (en) * 2004-01-05 2005-02-15 Hon Hai Precision Ind. Co., Ltd IC socket assembly with improved heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465887B (zh) * 2012-01-05 2014-12-21 Acer Inc 電子裝置

Also Published As

Publication number Publication date
US20050259399A1 (en) 2005-11-24
US7133288B2 (en) 2006-11-07
CN1716585A (zh) 2006-01-04
CN100463149C (zh) 2009-02-18

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