TW200608837A - Work neutralizing method and apparatus thereof - Google Patents

Work neutralizing method and apparatus thereof

Info

Publication number
TW200608837A
TW200608837A TW094114600A TW94114600A TW200608837A TW 200608837 A TW200608837 A TW 200608837A TW 094114600 A TW094114600 A TW 094114600A TW 94114600 A TW94114600 A TW 94114600A TW 200608837 A TW200608837 A TW 200608837A
Authority
TW
Taiwan
Prior art keywords
work
electric field
holding body
neutralizing method
air
Prior art date
Application number
TW094114600A
Other languages
Chinese (zh)
Inventor
Yoshikazu Ohtani
Noriyuki Takefushi
Yasuyuki Koga
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200608837A publication Critical patent/TW200608837A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

A work composed of any substance, regardless of whether it is insulator, semiconductor or conductor, is neutralized without an airflow change nor limiting an installation area of an apparatus. In an atmospheric air or in a prescribed low vacuum wherein a work (W) is separated from a surface (1c) of a work holding body (1), a voltage of conductors (1a, 1b) provided on the work holding body (1) is changed to induce an electric field in the vicinity of the work (W). Thus, in the electric field part, a part of the ambient gas, such as air, is instantaneously ionized to neutralize the charges left on the work (W).
TW094114600A 2004-05-07 2005-05-05 Work neutralizing method and apparatus thereof TW200608837A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004138631 2004-05-07

Publications (1)

Publication Number Publication Date
TW200608837A true TW200608837A (en) 2006-03-01

Family

ID=35320472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114600A TW200608837A (en) 2004-05-07 2005-05-05 Work neutralizing method and apparatus thereof

Country Status (5)

Country Link
JP (1) JPWO2005109489A1 (en)
KR (1) KR20070009523A (en)
CN (1) CN1771592A (en)
TW (1) TW200608837A (en)
WO (1) WO2005109489A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449472B (en) * 2007-04-04 2014-08-11 Sanki Company Ltd Removal device and method of part feeder

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4573763B2 (en) * 2005-12-01 2010-11-04 信越ポリマー株式会社 Adsorption device
KR101213103B1 (en) 2006-06-30 2013-01-09 엘지디스플레이 주식회사 bonding device and fa brication method of Light emitting device using thereof
JP4661716B2 (en) * 2006-07-24 2011-03-30 株式会社日立プラントテクノロジー Board bonding equipment
WO2008114337A1 (en) * 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. Vacuum bonding method and vacuum bonding device
JP5663126B2 (en) * 2007-08-09 2015-02-04 リンテック株式会社 Work conveying method and apparatus having work delivery mechanism
JP5074125B2 (en) * 2007-08-09 2012-11-14 リンテック株式会社 Fixing jig and workpiece processing method
JP2011514681A (en) * 2008-03-14 2011-05-06 ダウ・コーニング・コーポレイション Photovoltaic module and method for forming the same
KR101125430B1 (en) * 2009-09-04 2012-03-28 주식회사 디엠에스 Workpiece de-chucking device of plasma reactor for dry-cleaning the inside of chamber and electro static chuck during de-chucking workpiece, and workpiece de-chucking method of the same
JP6226563B2 (en) * 2013-05-28 2017-11-08 リンテック株式会社 Electrostatic holding device and method for removing object to be held from electrostatic holding device
JP6154665B2 (en) * 2013-05-28 2017-06-28 リンテック株式会社 Electrostatic holding device and method for removing object to be held from electrostatic holding device
JP5654155B1 (en) * 2014-04-04 2015-01-14 信越エンジニアリング株式会社 Work bonding machine
JP6419635B2 (en) * 2014-04-23 2018-11-07 株式会社アルバック Holding device, vacuum processing device
JP6471606B2 (en) * 2015-02-23 2019-02-20 Ａｇｃ株式会社 Laminate peeling apparatus, peeling method, and electronic device manufacturing method
JP6468462B2 (en) * 2015-02-23 2019-02-13 Ａｇｃ株式会社 Laminate peeling apparatus, peeling method, and electronic device manufacturing method
JP2016171291A (en) * 2015-03-16 2016-09-23 株式会社ディスコ Decompression processing apparatus
JP6649689B2 (en) * 2015-03-16 2020-02-19 株式会社ディスコ Decompression processing apparatus and wafer holding method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112745A (en) * 1987-10-27 1989-05-01 Fujitsu Ltd Wafer separating method in semiconductor manufacturing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449472B (en) * 2007-04-04 2014-08-11 Sanki Company Ltd Removal device and method of part feeder

Also Published As

Publication number Publication date
CN1771592A (en) 2006-05-10
WO2005109489A1 (en) 2005-11-17
KR20070009523A (en) 2007-01-18
JPWO2005109489A1 (en) 2008-03-21

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