TW200607030A - Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints - Google Patents
Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder jointsInfo
- Publication number
- TW200607030A TW200607030A TW093123344A TW93123344A TW200607030A TW 200607030 A TW200607030 A TW 200607030A TW 093123344 A TW093123344 A TW 093123344A TW 93123344 A TW93123344 A TW 93123344A TW 200607030 A TW200607030 A TW 200607030A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder joints
- electromigration
- joule heating
- protecting
- alleviating
- Prior art date
Links
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- H01L2924/04941—TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093123344A TW200607030A (en) | 2004-08-04 | 2004-08-04 | Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints |
US11/068,255 US20060027933A1 (en) | 2004-08-04 | 2005-02-28 | Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093123344A TW200607030A (en) | 2004-08-04 | 2004-08-04 | Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200607030A true TW200607030A (en) | 2006-02-16 |
Family
ID=35756625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093123344A TW200607030A (en) | 2004-08-04 | 2004-08-04 | Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints |
Country Status (2)
Country | Link |
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US (1) | US20060027933A1 (zh) |
TW (1) | TW200607030A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9024441B2 (en) | 2011-12-30 | 2015-05-05 | Industrial Technology Research Institute | Bump structure and electronic packaging solder joint structure and fabricating method thereof |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7947978B2 (en) * | 2005-12-05 | 2011-05-24 | Megica Corporation | Semiconductor chip with bond area |
US7262603B1 (en) * | 2006-06-28 | 2007-08-28 | Lenovo (Singapore) Pte. Ltd | System and method for sensing the formation of tin whiskers |
US7812448B2 (en) * | 2006-08-07 | 2010-10-12 | Freescale Semiconductor, Inc. | Electronic device including a conductive stud over a bonding pad region |
KR100857365B1 (ko) * | 2007-02-28 | 2008-09-05 | 주식회사 네패스 | 반도체 장치의 범프 구조물 |
US20090140401A1 (en) * | 2007-11-30 | 2009-06-04 | Stanley Craig Beddingfield | System and Method for Improving Reliability of Integrated Circuit Packages |
US8022543B2 (en) * | 2008-03-25 | 2011-09-20 | International Business Machines Corporation | Underbump metallurgy for enhanced electromigration resistance |
US7968975B2 (en) | 2008-08-08 | 2011-06-28 | International Business Machines Corporation | Metal wiring structure for integration with through substrate vias |
KR20100079183A (ko) * | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | 반도체 패키지 장치와 그 제조 방법 |
TWI397983B (zh) * | 2008-12-31 | 2013-06-01 | Ind Tech Res Inst | 封裝載板與接合結構 |
JP5316261B2 (ja) * | 2009-06-30 | 2013-10-16 | 富士通株式会社 | マルチチップモジュールおよびプリント基板ユニット並びに電子機器 |
US8581420B2 (en) | 2010-10-18 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Under-bump metallization (UBM) structure and method of forming the same |
US9159687B2 (en) * | 2012-07-31 | 2015-10-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Solder bump for ball grid array |
US11444048B2 (en) * | 2017-10-05 | 2022-09-13 | Texas Instruments Incorporated | Shaped interconnect bumps in semiconductor devices |
US11233024B2 (en) * | 2019-12-23 | 2022-01-25 | Micron Technology, Inc. | Methods for forming substrate terminal pads, related terminal pads and substrates and assemblies incorporating such terminal pads |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6300234B1 (en) * | 2000-06-26 | 2001-10-09 | Motorola, Inc. | Process for forming an electrical device |
US6593649B1 (en) * | 2001-05-17 | 2003-07-15 | Megic Corporation | Methods of IC rerouting option for multiple package system applications |
US6586322B1 (en) * | 2001-12-21 | 2003-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of making a bump on a substrate using multiple photoresist layers |
US7410833B2 (en) * | 2004-03-31 | 2008-08-12 | International Business Machines Corporation | Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
-
2004
- 2004-08-04 TW TW093123344A patent/TW200607030A/zh unknown
-
2005
- 2005-02-28 US US11/068,255 patent/US20060027933A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9024441B2 (en) | 2011-12-30 | 2015-05-05 | Industrial Technology Research Institute | Bump structure and electronic packaging solder joint structure and fabricating method thereof |
Also Published As
Publication number | Publication date |
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US20060027933A1 (en) | 2006-02-09 |
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