TW200606083A - Apparatus for replacing gas in storage container and method for replacing gas therewith - Google Patents

Apparatus for replacing gas in storage container and method for replacing gas therewith

Info

Publication number
TW200606083A
TW200606083A TW094113219A TW94113219A TW200606083A TW 200606083 A TW200606083 A TW 200606083A TW 094113219 A TW094113219 A TW 094113219A TW 94113219 A TW94113219 A TW 94113219A TW 200606083 A TW200606083 A TW 200606083A
Authority
TW
Taiwan
Prior art keywords
gas
storage container
main body
replacing gas
container main
Prior art date
Application number
TW094113219A
Other languages
English (en)
Inventor
Ryuichi Nakano
Yukihiro Hyobu
Yoshihisa Okamoto
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004142727A external-priority patent/JP2005327815A/ja
Priority claimed from JP2004153025A external-priority patent/JP2005340243A/ja
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of TW200606083A publication Critical patent/TW200606083A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094113219A 2004-05-12 2005-04-26 Apparatus for replacing gas in storage container and method for replacing gas therewith TW200606083A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004142727A JP2005327815A (ja) 2004-05-12 2004-05-12 収納容器のガス置換装置およびそれを用いたガス置換方法
JP2004153025A JP2005340243A (ja) 2004-05-24 2004-05-24 収納容器のガス置換装置およびそれを用いたガス置換方法

Publications (1)

Publication Number Publication Date
TW200606083A true TW200606083A (en) 2006-02-16

Family

ID=34935477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113219A TW200606083A (en) 2004-05-12 2005-04-26 Apparatus for replacing gas in storage container and method for replacing gas therewith

Country Status (5)

Country Link
US (1) US7314068B2 (zh)
EP (1) EP1596430B1 (zh)
KR (1) KR20060047775A (zh)
DE (1) DE602005001721T2 (zh)
TW (1) TW200606083A (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134495B2 (ja) * 2008-10-16 2013-01-30 東京エレクトロン株式会社 処理装置及び処理方法
JP5410794B2 (ja) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 基板処理装置
JP5606174B2 (ja) * 2010-01-27 2014-10-15 株式会社日立国際電気 基板処理装置、基板処理方法、半導体装置の製造方法および反応室の閉塞方法。
JP5780626B2 (ja) * 2010-09-07 2015-09-16 学校法人中部大学 超伝導送電システム
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
CN105849887B (zh) * 2013-12-13 2019-12-17 布鲁克斯Ccs股份有限公司 再循环衬底容器清除系统和方法
CN103711937B (zh) * 2014-01-09 2016-06-01 北京七星华创电子股份有限公司 一种半导体设备的微环境排气控制装置
KR102164544B1 (ko) * 2014-01-22 2020-10-12 삼성전자 주식회사 가스 충진부를 구비하는 웨이퍼 스토리지 장치를 포함하는 반도체 제조 장치
KR20160063017A (ko) * 2014-11-26 2016-06-03 권오성 진공 포장 장치
US9550219B2 (en) * 2014-12-29 2017-01-24 Daifuku Co., Ltd. Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same
CN109314075B (zh) * 2016-06-08 2023-02-21 村田机械株式会社 容器保管装置及容器保管方法
KR101928199B1 (ko) * 2017-06-26 2019-02-26 오영호 물을 이용하여 미세먼지를 제거하는 습식 공기 정화장치 및 정화방법
US10964570B2 (en) * 2018-12-03 2021-03-30 Samsung Electronics Co., Ltd. Semiconductor wafer storage system and method of supplying fluid for semiconductor wafer storage
US11854848B2 (en) * 2020-11-03 2023-12-26 Taiwan Semiconductor Manufacturing Company Ltd. Air processing system for semiconductor container

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
US5238503A (en) * 1991-04-09 1993-08-24 International Business Machines Corporation Device for decontaminating a semiconductor wafer container
JPH0574921A (ja) 1991-09-13 1993-03-26 Hitachi Ltd ケース
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
JP3506210B2 (ja) 1998-05-06 2004-03-15 三菱住友シリコン株式会社 ウェーハ収納方法
JP3925762B2 (ja) 1999-04-26 2007-06-06 株式会社Ｓｕｍｃｏ ウェーハ収納方法およびこれに用いられるウェーハケース
JP2001298076A (ja) * 2000-04-12 2001-10-26 Sony Corp 基板搬送コンテナ
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
JP2002184831A (ja) * 2000-12-11 2002-06-28 Hirata Corp Ｆｏｕｐオープナ

Also Published As

Publication number Publication date
EP1596430A1 (en) 2005-11-16
US7314068B2 (en) 2008-01-01
US20050252571A1 (en) 2005-11-17
DE602005001721T2 (de) 2007-12-06
DE602005001721D1 (de) 2007-09-06
KR20060047775A (ko) 2006-05-18
EP1596430B1 (en) 2007-07-25

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