TW200605967A - Wiring board, manufacturing method thereof, and electronic appliance - Google Patents

Wiring board, manufacturing method thereof, and electronic appliance

Info

Publication number
TW200605967A
TW200605967A TW094119670A TW94119670A TW200605967A TW 200605967 A TW200605967 A TW 200605967A TW 094119670 A TW094119670 A TW 094119670A TW 94119670 A TW94119670 A TW 94119670A TW 200605967 A TW200605967 A TW 200605967A
Authority
TW
Taiwan
Prior art keywords
wiring
wiring layer
layer
board
manufacturing
Prior art date
Application number
TW094119670A
Other languages
English (en)
Other versions
TWI277459B (en
Inventor
Hideo Imai
Kazuaki Sakurada
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200605967A publication Critical patent/TW200605967A/zh
Application granted granted Critical
Publication of TWI277459B publication Critical patent/TWI277459B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW094119670A 2004-07-08 2005-06-14 Wiring board, manufacturing method thereof, and electronic appliance TWI277459B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004201882A JP2006024768A (ja) 2004-07-08 2004-07-08 配線基板、配線基板の製造方法および電子機器

Publications (2)

Publication Number Publication Date
TW200605967A true TW200605967A (en) 2006-02-16
TWI277459B TWI277459B (en) 2007-04-01

Family

ID=35540131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119670A TWI277459B (en) 2004-07-08 2005-06-14 Wiring board, manufacturing method thereof, and electronic appliance

Country Status (5)

Country Link
US (2) US20060005994A1 (zh)
JP (1) JP2006024768A (zh)
KR (1) KR100633669B1 (zh)
CN (1) CN1719966A (zh)
TW (1) TWI277459B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070281091A1 (en) * 2006-05-31 2007-12-06 Cabot Corporation Polyimide insulative layers in multi-layered printed electronic features
KR100768234B1 (ko) * 2006-06-07 2007-10-17 삼성에스디아이 주식회사 유기 발광 디스플레이 장치
KR100819876B1 (ko) * 2006-09-19 2008-04-07 삼성전기주식회사 합금배선기판 및 그 제조방법
KR101281163B1 (ko) * 2006-11-21 2013-07-02 삼성디스플레이 주식회사 와이어 그리드 편광자 제조방법
JP2008238531A (ja) * 2007-03-27 2008-10-09 Brother Ind Ltd 画像形成装置
KR101148679B1 (ko) * 2010-12-21 2012-05-25 삼성전기주식회사 다층 인쇄회로기판 및 그의 제조방법
CN103763854A (zh) * 2014-01-18 2014-04-30 上海美维电子有限公司 印刷线路板及其制造方法
CN106538074B (zh) * 2014-03-25 2020-03-06 斯特拉塔西斯公司 用在制造跨层图案的方法及系统
WO2016072011A1 (ja) * 2014-11-07 2016-05-12 富士機械製造株式会社 配線形成方法
CN107614265A (zh) 2015-03-25 2018-01-19 斯特拉塔西斯公司 导电油墨原位烧结的方法和系统
CN105057667A (zh) * 2015-09-02 2015-11-18 华中科技大学 一种3d打印机构
US11721858B2 (en) 2020-12-11 2023-08-08 Kesavan Moses Srivilliputhur SuCCoR: a super critical cooling regulator to mitigate heating of batteries and other devices
WO2023209960A1 (ja) * 2022-04-28 2023-11-02 株式会社Fuji 設計方法、設計プログラム、および回路基板作製方法

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FR2560281B1 (fr) * 1984-02-24 1986-09-19 Nord Mediterranee Chantiers Installation pour l'extraction de minerais des fonds marins
US6378199B1 (en) * 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
JPH0923063A (ja) 1995-07-07 1997-01-21 Hitachi Ltd 多層配線回路基板の製造方法
JPH11163499A (ja) 1997-11-28 1999-06-18 Nitto Boseki Co Ltd プリント配線板の製造方法及びこの製造方法によるプリント配線板
JP3980801B2 (ja) * 1999-09-16 2007-09-26 株式会社東芝 三次元構造体およびその製造方法
JP2002162652A (ja) * 2000-01-31 2002-06-07 Fujitsu Ltd シート状表示装置、樹脂球状体、及びマイクロカプセル
TW586231B (en) * 2001-07-24 2004-05-01 Seiko Epson Corp Transfer method, methods of manufacturing thin film devices and integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, manufacturing methods of IC card and electronic appliance
JP2003037363A (ja) 2001-07-25 2003-02-07 Denso Corp 多層基板用素板の製造方法、その製造方法により製造された多層基板用素板を用いた多層基板の製造方法および多層基板用素板
CN1222918C (zh) * 2001-08-27 2005-10-12 佳能株式会社 布线基板及使用该布线基板的图象显示装置
JP4125153B2 (ja) * 2002-02-20 2008-07-30 キヤノン株式会社 半導体装置及びそれを用いた液体吐出装置
JP4572501B2 (ja) 2002-02-27 2010-11-04 コニカミノルタホールディングス株式会社 有機薄膜トランジスタの製造方法
JP4272854B2 (ja) * 2002-07-10 2009-06-03 キヤノン株式会社 半導体装置及びそれを用いた液体吐出装置
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Also Published As

Publication number Publication date
KR100633669B1 (ko) 2006-10-11
TWI277459B (en) 2007-04-01
US20060005994A1 (en) 2006-01-12
CN1719966A (zh) 2006-01-11
US20080115351A1 (en) 2008-05-22
JP2006024768A (ja) 2006-01-26
US7676913B2 (en) 2010-03-16
KR20060049955A (ko) 2006-05-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees