TW200605373A - Printed wiring board, production process thereof and semiconductor device - Google Patents

Printed wiring board, production process thereof and semiconductor device

Info

Publication number
TW200605373A
TW200605373A TW094114912A TW94114912A TW200605373A TW 200605373 A TW200605373 A TW 200605373A TW 094114912 A TW094114912 A TW 094114912A TW 94114912 A TW94114912 A TW 94114912A TW 200605373 A TW200605373 A TW 200605373A
Authority
TW
Taiwan
Prior art keywords
wiring pattern
plating layer
metal plating
wiring board
printed wiring
Prior art date
Application number
TW094114912A
Other languages
English (en)
Inventor
Ken Sakata
Hiromu Terada
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200605373A publication Critical patent/TW200605373A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW094114912A 2004-05-10 2005-05-09 Printed wiring board, production process thereof and semiconductor device TW200605373A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004139972A JP4426900B2 (ja) 2004-05-10 2004-05-10 プリント配線基板、その製造方法および半導体装置

Publications (1)

Publication Number Publication Date
TW200605373A true TW200605373A (en) 2006-02-01

Family

ID=35350063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114912A TW200605373A (en) 2004-05-10 2005-05-09 Printed wiring board, production process thereof and semiconductor device

Country Status (5)

Country Link
US (2) US20050274689A1 (zh)
JP (1) JP4426900B2 (zh)
KR (1) KR20060045986A (zh)
CN (1) CN1697592A (zh)
TW (1) TW200605373A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8882953B2 (en) 2009-12-07 2014-11-11 Lg Display Co., Ltd. Method for fabricating cliché, and method for forming thin film pattern by using the same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4880251B2 (ja) 2005-06-21 2012-02-22 オリンパスメディカルシステムズ株式会社 高周波処置具
JP3983786B2 (ja) * 2005-11-15 2007-09-26 シャープ株式会社 プリント配線基板
US20070246158A1 (en) * 2006-04-21 2007-10-25 3M Innovative Properties Company Wiring board, production process thereof and connection method using same
JP5113346B2 (ja) * 2006-05-22 2013-01-09 日立電線株式会社 電子装置用基板およびその製造方法、ならびに電子装置およびその製造方法
JP5138185B2 (ja) * 2006-06-30 2013-02-06 信越ポリマー株式会社 プリント配線基板
US8134084B2 (en) 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
US20080174016A1 (en) * 2006-12-28 2008-07-24 Mitsui Mining & Smelting Co., Ltd. Flexible Printed Wiring Board and Semiconductor Device
KR101457939B1 (ko) 2009-11-02 2014-11-10 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
KR101148099B1 (ko) 2010-10-01 2012-05-23 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
CN102424964B (zh) * 2011-12-23 2014-03-05 广东东硕科技有限公司 一种含巯基化合物的棕化处理液
WO2013168773A1 (ja) * 2012-05-10 2013-11-14 富士フイルム株式会社 導電膜積層体、タッチパネル、配線基板、電子機器、透明両面粘着シート、透明粘着シート
CN113950187A (zh) * 2021-10-27 2022-01-18 杨晓战 平面导热覆铜板及封装多块平面导热覆铜板的封装基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0628941B2 (ja) * 1988-09-20 1994-04-20 株式会社日立製作所 回路基板及びその製造方法
JP2870497B2 (ja) * 1996-08-01 1999-03-17 日本電気株式会社 半導体素子の実装方法
US5796163A (en) * 1997-05-23 1998-08-18 Amkor Technology, Inc. Solder ball joint
CN100521882C (zh) * 1997-12-11 2009-07-29 伊比登株式会社 多层印刷电路板的制造方法
WO1999044403A1 (fr) * 1998-02-26 1999-09-02 Ibiden Co., Ltd. Carte a circuits imprimes multicouche avec structure de trous d'interconnexion pleins
US6462284B1 (en) * 1998-07-01 2002-10-08 Seiko Epson Corporation Semiconductor device and method of manufacture thereof
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8882953B2 (en) 2009-12-07 2014-11-11 Lg Display Co., Ltd. Method for fabricating cliché, and method for forming thin film pattern by using the same

Also Published As

Publication number Publication date
US20050274689A1 (en) 2005-12-15
US20080171138A1 (en) 2008-07-17
CN1697592A (zh) 2005-11-16
JP2005322792A (ja) 2005-11-17
JP4426900B2 (ja) 2010-03-03
KR20060045986A (ko) 2006-05-17

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