TW200604238A - Curable resin composition, overcoats, and process for formation thereof - Google Patents

Curable resin composition, overcoats, and process for formation thereof

Info

Publication number
TW200604238A
TW200604238A TW094105898A TW94105898A TW200604238A TW 200604238 A TW200604238 A TW 200604238A TW 094105898 A TW094105898 A TW 094105898A TW 94105898 A TW94105898 A TW 94105898A TW 200604238 A TW200604238 A TW 200604238A
Authority
TW
Taiwan
Prior art keywords
overcoats
curable resin
resin composition
formation
average molecular
Prior art date
Application number
TW094105898A
Other languages
English (en)
Other versions
TWI385192B (zh
Inventor
Toru Kajita
Atsushi Baba
Hiroshi Shiho
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200604238A publication Critical patent/TW200604238A/zh
Application granted granted Critical
Publication of TWI385192B publication Critical patent/TWI385192B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/20—Manufacture of shaped structures of ion-exchange resins
    • C08J5/22—Films, membranes or diaphragms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW094105898A 2004-05-06 2005-02-25 A hardening resin composition, a protective film, and a method for forming the same TWI385192B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004137105 2004-05-06

Publications (2)

Publication Number Publication Date
TW200604238A true TW200604238A (en) 2006-02-01
TWI385192B TWI385192B (zh) 2013-02-11

Family

ID=35320194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105898A TWI385192B (zh) 2004-05-06 2005-02-25 A hardening resin composition, a protective film, and a method for forming the same

Country Status (5)

Country Link
JP (1) JP5163847B2 (zh)
KR (1) KR101087309B1 (zh)
CN (1) CN100506877C (zh)
TW (1) TWI385192B (zh)
WO (1) WO2005108458A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735778B (zh) * 2017-04-27 2021-08-11 日商日本化藥股份有限公司 反應性多元羧酸化合物、使用該化合物的活性能量線硬化型樹脂組成物、該組成物的硬化物及該硬化物的用途

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7696292B2 (en) 2003-09-22 2010-04-13 Commonwealth Scientific And Industrial Research Organisation Low-polydispersity photoimageable acrylic polymers, photoresists and processes for microlithography
JP4688697B2 (ja) * 2006-03-03 2011-05-25 東洋合成工業株式会社 ジチオエステル誘導体及び連鎖移動剤並びにこれを用いたラジカル重合性重合体の製造方法
JP5296309B2 (ja) * 2006-12-15 2013-09-25 株式会社フジシールインターナショナル プラスチックフィルム用活性エネルギー線硬化性樹脂組成物及びプラスチックラベル
JP5224030B2 (ja) * 2007-03-22 2013-07-03 Ｊｓｒ株式会社 熱硬化性樹脂組成物、保護膜および保護膜の形成方法
WO2013035206A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用シール剤組成物
JP6130110B2 (ja) * 2012-08-15 2017-05-17 大阪有機化学工業株式会社 エポキシ系共重合体
KR101748409B1 (ko) * 2014-07-30 2017-06-16 주식회사 엘지화학 편광자 보호 필름용 수지 조성물, 편광자 보호 필름, 및 이를 포함하는 편광판
JP6963215B2 (ja) * 2016-07-28 2021-11-05 日産化学株式会社 樹脂組成物
CN107390420A (zh) * 2017-08-02 2017-11-24 京东方科技集团股份有限公司 一种彩膜基板及显示装置
CN109422987B (zh) * 2017-08-30 2021-03-09 京东方科技集团股份有限公司 平坦层用组合物、其制备方法、平坦层材料及显示装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1028433C (zh) * 1989-02-01 1995-05-17 北京大学 光固化组合物及其制备方法和用途
JPH0733855A (ja) * 1993-07-21 1995-02-03 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JP3484808B2 (ja) * 1995-03-24 2004-01-06 Ｊｓｒ株式会社 層間絶縁膜形成用感放射線性樹脂組成物並びに層間絶縁膜およびその製造方法
JP2000290348A (ja) * 1999-04-12 2000-10-17 Toagosei Co Ltd 硬化性樹脂組成物
JP2002302532A (ja) * 2001-04-03 2002-10-18 Nippon Synthetic Chem Ind Co Ltd:The 光硬化性樹脂組成物及びその用途
WO2003037945A1 (fr) * 2001-10-29 2003-05-08 Kaneka Corporation Copolymere sequence a base d'acrylonitrile et compositions de resines thermoplastiques
JP4394870B2 (ja) * 2002-09-17 2010-01-06 株式会社カネカ 粘接着組成物、該粘接着組成物を用いた粘接着テープまたはシートおよびホットメルト型アクリル系粘接着剤
FR2848556B1 (fr) * 2002-12-13 2006-06-16 Bio Merieux Procede de polymerisation radicalaire controlee
AU2004303587A1 (en) * 2003-12-23 2005-07-07 The University Of Leeds Polymerisation using chain transfer agents
JP2007100020A (ja) * 2005-10-07 2007-04-19 Jsr Corp 硬化性樹脂組成物、保護膜およびその形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735778B (zh) * 2017-04-27 2021-08-11 日商日本化藥股份有限公司 反應性多元羧酸化合物、使用該化合物的活性能量線硬化型樹脂組成物、該組成物的硬化物及該硬化物的用途

Also Published As

Publication number Publication date
JPWO2005108458A1 (ja) 2008-03-21
KR20070012451A (ko) 2007-01-25
CN100506877C (zh) 2009-07-01
KR101087309B1 (ko) 2011-11-25
TWI385192B (zh) 2013-02-11
JP5163847B2 (ja) 2013-03-13
CN1898291A (zh) 2007-01-17
WO2005108458A1 (ja) 2005-11-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees