TW200603256A - Process for forming permanent pattern - Google Patents

Process for forming permanent pattern

Info

Publication number
TW200603256A
TW200603256A TW094108909A TW94108909A TW200603256A TW 200603256 A TW200603256 A TW 200603256A TW 094108909 A TW094108909 A TW 094108909A TW 94108909 A TW94108909 A TW 94108909A TW 200603256 A TW200603256 A TW 200603256A
Authority
TW
Taiwan
Prior art keywords
laser beam
compensating
modulated
photosensitive layer
patterns
Prior art date
Application number
TW094108909A
Other languages
Chinese (zh)
Inventor
Takashi Takayanagi
Yuichi Wakata
Hiromi Ishikawa
Yuji Shimoyama
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200603256A publication Critical patent/TW200603256A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The object of the present invention is to provide processes for forming permanent patterns that may produce highly fine and precise permanent patterns with higher efficiency such as interlayer insulating films and protective films e.g. solder resist patterns in printed wiring boards including package substrates. In order to attain the object, a process for forming a permanent pattern is provided that comprises modulating a laser beam irradiated from a laser source, compensating the modulated laser beam, exposing a photosensitive layer by means of the modulated and compensated laser beam, and developing the photosensitive layer, wherein the photosensitive layer is formed on a substrate by use of a photosensitive composition comprising a binder, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent, the modulating is performed by a laser modulator which comprises plural imaging portions each capable of receiving the laser beam and outputting the modulated laser beam, and the compensating is performed by transmitting the modulated laser beam through plural microlenses each having a non-spherical surface capable of compensating the aberration due to distortion of the output surface of the imaging portion, and the plural microlenses are arranged to a microlens array.
TW094108909A 2004-03-26 2005-03-23 Process for forming permanent pattern TW200603256A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004093700 2004-03-26
JP2005054488A JP2005311305A (en) 2004-03-26 2005-02-28 Permanent pattern forming method

Publications (1)

Publication Number Publication Date
TW200603256A true TW200603256A (en) 2006-01-16

Family

ID=35056456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108909A TW200603256A (en) 2004-03-26 2005-03-23 Process for forming permanent pattern

Country Status (3)

Country Link
JP (1) JP2005311305A (en)
TW (1) TW200603256A (en)
WO (1) WO2005093793A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419202B (en) * 2011-12-06 2013-12-11 Univ Nat Taiwan Method for producing a thin single crystal silicon having large surface area
TWI476106B (en) * 2012-06-27 2015-03-11

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007156011A (en) * 2005-12-02 2007-06-21 Fujifilm Corp Photosensitive resin composition for photo spacer, substrate with spacer, method for producing the same and liquid crystal display device
JP2009014745A (en) * 2006-03-16 2009-01-22 Fujifilm Holdings Corp Photosensitive composition, photosensitive film, photosensitive layered product, method of forming permanent pattern, and printed wiring board
CN112842604B (en) * 2019-11-27 2022-12-06 香港理工大学深圳研究院 Optogenetics experiment method and system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07261388A (en) * 1994-03-25 1995-10-13 Hitachi Chem Co Ltd Production of photosensitive resin composition, photosensitive element using the same and plating resist
JP3391896B2 (en) * 1994-06-15 2003-03-31 東京応化工業株式会社 Heat resistant photosensitive resin composition
JP3496674B2 (en) * 1997-11-28 2004-02-16 日立化成工業株式会社 Photocurable resin composition and photosensitive element using the same
JP4036550B2 (en) * 1998-11-25 2008-01-23 日本化薬株式会社 Radiation sensitive polyester resin and negative resist composition using the same
JP2001040174A (en) * 1999-07-29 2001-02-13 Nippon Kayaku Co Ltd Resin composition, solder resist resin composition and hardened products therefrom
JP2004006440A (en) * 2002-04-10 2004-01-08 Fuji Photo Film Co Ltd Laser apparatus, exposure head, and exposure device
JP2003337426A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
JP2003337425A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
JP2003337427A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
JP2004062156A (en) * 2002-06-07 2004-02-26 Fuji Photo Film Co Ltd Exposure head and exposure apparatus
JP4450689B2 (en) * 2003-07-31 2010-04-14 富士フイルム株式会社 Exposure head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419202B (en) * 2011-12-06 2013-12-11 Univ Nat Taiwan Method for producing a thin single crystal silicon having large surface area
TWI476106B (en) * 2012-06-27 2015-03-11

Also Published As

Publication number Publication date
JP2005311305A (en) 2005-11-04
WO2005093793A1 (en) 2005-10-06

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