WO2005078776A8 - Pattern forming process - Google Patents

Pattern forming process Download PDF

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Publication number
WO2005078776A8
WO2005078776A8 PCT/JP2005/002112 JP2005002112W WO2005078776A8 WO 2005078776 A8 WO2005078776 A8 WO 2005078776A8 JP 2005002112 W JP2005002112 W JP 2005002112W WO 2005078776 A8 WO2005078776 A8 WO 2005078776A8
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
pattern forming
compensating
modulated
photosensitive layer
Prior art date
Application number
PCT/JP2005/002112
Other languages
French (fr)
Other versions
WO2005078776A1 (en
Inventor
Yuichi Wakata
Masanobu Takashima
Hiromi Ishikawa
Yuji Shimoyama
Original Assignee
Fuji Photo Film Co Ltd
Yuichi Wakata
Masanobu Takashima
Hiromi Ishikawa
Yuji Shimoyama
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd, Yuichi Wakata, Masanobu Takashima, Hiromi Ishikawa, Yuji Shimoyama filed Critical Fuji Photo Film Co Ltd
Priority claimed from JP2005035041A external-priority patent/JP2005258431A/en
Publication of WO2005078776A1 publication Critical patent/WO2005078776A1/en
Publication of WO2005078776A8 publication Critical patent/WO2005078776A8/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The object of the present invention is to provide pattern forming processes that may form permanent patterns such as a wiring pattern with high fineness and preciseness, and sufficient efficiency due to suppressing the image deformation formed on pattern forming materials. In order to attain the object, a pattern forming process is provided that comprises modulating a laser beam irradiated from a laser source, compensating the modulated laser beam, and exposing a photosensitive layer by the modulated and compensated laser beam, wherein the photosensitive layer is disposed on a support to form a pattern forming material, the modulating is performed by a laser modulator that comprises plural imaging portions each capable of receiving the laser beam and outputting the modulated laser beam, and the compensating is performed by transmitting the modulated laser beam through plural microlenses each having a non-spherical surface capable of compensating the aberration due to distortion of the output surface of the imaging portion, and the plural microlenses are arranged to a microlens array.
PCT/JP2005/002112 2004-02-12 2005-02-07 Pattern forming process WO2005078776A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004-035792 2004-02-12
JP2004035792 2004-02-12
JP2005035041A JP2005258431A (en) 2004-02-12 2005-02-10 Pattern forming process

Publications (2)

Publication Number Publication Date
WO2005078776A1 WO2005078776A1 (en) 2005-08-25
WO2005078776A8 true WO2005078776A8 (en) 2009-02-12

Family

ID=34857699

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/002112 WO2005078776A1 (en) 2004-02-12 2005-02-07 Pattern forming process

Country Status (4)

Country Link
KR (1) KR20060111692A (en)
CN (1) CN100433254C (en)
TW (1) TW200530754A (en)
WO (1) WO2005078776A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070114267A (en) * 2005-03-25 2007-11-30 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. Pretreatment compositions
JP2007078894A (en) * 2005-09-12 2007-03-29 Fujifilm Corp Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus, and pattern forming method
EP2196855A1 (en) * 2008-12-10 2010-06-16 CST GmbH Exposure head and method for producing printing plates
KR102173148B1 (en) * 2015-02-04 2020-11-02 동우 화인켐 주식회사 Photosensitive resin comopsition, photocurable pattern formed from the same and image display comprising the pattern
CN110431486B (en) * 2017-03-16 2022-03-15 株式会社尼康 Control device and control method, exposure device and exposure method, device manufacturing method, data generation method, and computer-readable medium
CN110196531B (en) * 2019-06-03 2020-12-11 珠海市能动科技光学产业有限公司 Dry film photoresist

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0991959B1 (en) * 1996-02-28 2004-06-23 Kenneth C. Johnson Microlens scanner for microlithography and wide-field confocal microscopy
JP2003276247A (en) * 2002-03-26 2003-09-30 Oki Data Corp Optical printing head, production method therefor and imaging apparatus
JP4731787B2 (en) * 2002-04-10 2011-07-27 富士フイルム株式会社 Exposure head and exposure apparatus
CN1297836C (en) * 2002-06-07 2007-01-31 富士胶片株式会社 Exposure head and exposure apparatus
KR100648904B1 (en) * 2002-07-10 2006-11-24 후지 샤신 필름 가부시기가이샤 Display device
US7110082B2 (en) * 2003-06-24 2006-09-19 Asml Holding N.V. Optical system for maskless lithography

Also Published As

Publication number Publication date
CN1918696A (en) 2007-02-21
CN100433254C (en) 2008-11-12
KR20060111692A (en) 2006-10-27
TW200530754A (en) 2005-09-16
WO2005078776A1 (en) 2005-08-25

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