CN1823301B - An integrated, in-line bumping and exposure system - Google Patents
An integrated, in-line bumping and exposure system Download PDFInfo
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- CN1823301B CN1823301B CN200480014357.XA CN200480014357A CN1823301B CN 1823301 B CN1823301 B CN 1823301B CN 200480014357 A CN200480014357 A CN 200480014357A CN 1823301 B CN1823301 B CN 1823301B
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Abstract
An integrated, in-line bumping and exposure system for printing plates or other substrates having a photosensitive layer. A linear illumination source or sources are for bumping the photosensitive material with a band of illumination to consume dissolved oxygen within the photosensitive layer. A raster scan optical assembly or an illuminated and re-imaged spatial light modulator array exposes the photosensitive material with a rasterized beam or beams or an array of modulated electromagnetic radiation located downstream of the bumping illumination. A conveyance mechanism is configured to provide relative continuous motion between one or more substrates and the bands of illumination to continuously bump and pattern one portion of the plate or plates while the other portion of the plate or plates is bumped in anticipation of patterning.
Description
Technical field
The present invention relates to a kind of printed panel or the integrated embedded bump on other matrix and system of exposure that is used to have photosensitive layer.
Related application
The application requires the right of priority of No. the 60/474th, 185, the US provisional application submitted on May 29th, 2003.
Background technology
At machine such as computer master making (computer-to-plate) (CTP) in the exposure system, scribble the printed panel of photopolymer resin layer such as rasterisation laser beam or light beam that printer's blanket typically uses modulation and carry out digital imagery, wherein optical arrays by illumination or again the imaging space light modulator arrays produce.Most printer's blanket can not be made in the environment of anaerobic, and can not too much be coated with aerobic barrier layer such as polyvinyl alcohol (PVA).In addition, the oxygen contamination component distributing is on whole photopolymer.In this case, on whole photosensitive resin, have abundant dissolved oxygen DO, and this obstacle photopolymerization.And if remove deoxidation from this printer's blanket, the oxygen in is got back to diffusion in the resin so on every side.
The sidewall slope of stereoscopic sensation, the especially imaging features of the exposure and the back printer's blanket that develops plays extremely important decisive action to the exposure image quality.For the isolated point on this plate, the bottom of broad and narrower and flat top is preferred.The following face method of ultraviolet-sensitive photosensitive polymerization resin by the tradition exposure realizes this: first " crash panel ", promptly, make whole plate be full of ultraviolet equably with by the dissolved oxygen DO of luminosity consumption in whole resin, then expose, thereby polymerize selected feature onboard by imaging.The plate of exposure develops by chemical method, stays the residual image that is attached to the polymer resin on the board substrate.By a time constant, knockout process has caused chemical reaction on unexposed plate, and wherein, this time constant in the measured thick printer's blanket is several seconds.After applying knockout process soon, on every side the oxygen in begin from the surface diffusion get back to the plate.This causes higher near the oxygen concentration in the resin on surface (top of plate) more with respect to matrix (bottom of plate), and therefore at this near surface place, the photopolymerization obstacle is bigger.Therefore, when forming pattern exposure, compare with the top, some base portion (dotbase) is polyaddition more, thereby has produced wideer bottom and narrower top.
For the curved surface CTP system of a success, need make the oxygen concentration on the whole resin xsect be suitable for the pre-exposure system, this system regulates the elapsed time behind bump irradiance and the bump, till pattern exposure.
Be well known that use bump platform separately to come the whole printed panel of pre-exposure, this bump platform comprises ultraviolet ray or near ultraviolet line source, printed panel be transported in the CTP exposure system of the exposure system of traditional base or non-mask form pattern then.For the floodlight pattern exposure combined, this method work got fine for the exposure of floodlight bump, was exposed in whole plate zone, then made the part of plate carry out pattern exposure simultaneously but work as bump, and this method just can not be worked well.Therefore, on delay all positions between bump and the imaging, when constant, best exposure performance and exposure range have been produced at printer's blanket.
Patent the 5th, 455 is here introduced with for referencial use for No. 416, this patent disclosure a kind of pre-exposure equipment, its neutral line LED matrix is carried out pre-exposure to printed panel, and printed panel moves on the conveyer below this device.But how when printed panel reaches is exposed fully, not open in ' 416 patents.
In patent the 6th, 262, in No. 825 (this patent is here also introduced with for referencial use), disclose a kind of device, in this device, laser radiation beam is separated, so that the pattern exposure bundle to be provided, this exposing beam is followed the tracks of the pre-exposure light beam, with the time period between restriction bump and the pattern exposure process.In some aspects, the laser power that the pre-exposure laser beam can be considered to waste, because compare with just pattern exposure is needed, this needs bigger power laser.
In addition, patent the 6th, 262 only discloses a kind of single scanning (backscan) (bump) light beam of stepping back before becoming video beam for No. 825.Making under the situation of printer's blanket, needing a minimum delay to allow to handle the luminosity consumption of oxygen, to reach chemical equilibrium.This step back scanning and imaging beam between limited minimum interval.But too big temporary transient separation can cause excessive oxygen diffusion to be got back in the top layer of resin.In order to carry out plate imaging at a high speed, the single scanning light beam of stepping back is not easy to satisfy this two boundary conditions, and can produce little or non-existent exposure process window.But, stepping back scanning light beam or two light bands for two has potential and adjusts oxygen concentration in the whole resin xsect better, one of them is stepped back scanning light beam or light band and carries a large amount of irradiance consumptions to be dissolved in oxygen in the whole curved surface resin, then after many seconds, another retreat scans light beam or light band carry irradiance in a small amount to consume the oxygen that is dissolved into once more in the curved surface resin top surface.
Summary of the invention
The purpose of this invention is to provide the system and method for the printing forme technology of a kind of integrated embedded bump and exposure, wherein this printing forme has photosensitive layer.
Another object of the present invention provides such system and method: its allows the lower optical exposure source of use cost to clash into, therefore preserved be used for the pattern exposure process may be more expensive luminous power.
Another object of the present invention provides a kind of such system and method, and it is faster than computer master making (CTP) machine of prior art.
Another object of the present invention provides a kind of such system and method, and it can be used in combination with the system that is not the CTP machine.
Another object of the present invention provides a kind of such system and method, and it can be guaranteed to be dissolved in oxygen in the photopolymer matrix, maximum and is consumed, and also is consumed but also can guarantee to spread the oxygen of getting back to photosensitive polymerization resin top layer.
The present invention is realized by following, the linear ultraviolet ray of imaging or non-imaging or near ultraviolet ray lamp or light emitting diode (LED) array provide acceptable, lower-cost method, this method is as the part of embedded CTP system, consume dissolved oxygen DO in scribbling the matrix of photopolymer by luminosity, in this system, the image of printing by by illumination and again the spatialization light modulator arrays of imaging produce the rasterisation laser beam of modulation or light beam or optical arrays and carry out the pattern imaging.The present invention is further realized by following: the photochemical kinetics of knockout process has been stipulated embedded plate induction system exposure method, and these methods are provided at needed delay between bump exposure and the pattern exposure.The present invention also can realize by following these: described bump method preferably is complementary with formation method, to obtain the needed constant or approaching constant delay of optimum picture quality between described bump and pattern exposure.
The invention is characterized in a kind of integrated embedded bump and exposure system that is used to have printed panel or other matrix of photosensitive layer.In one embodiment, this system comprises: linear illumination source, and this light source brings the bump photochromics by illumination, is dissolved in oxygen in the photosensitive layer with consumption; Exposure module such as raster scanning optical module or illumination and the spatialization light modulator arrays of imaging again, the rasterisation light beam by being arranged on impact radiation band downstream part or the electromagnetic radiation array of light beam or the spatial modulation photochromics that exposes; Conveying mechanism, be arranged between the electromagnetic radiation array of described plate and bump light band and rasterisation light beam or modulation relative motion is provided, make a part of clashing into described plate continuously and make the part of having clashed into of described plate form pattern, the other parts of described plate are clashed into simultaneously.
In another embodiment, this system comprises: linear illumination source, and this linear illumination source brings the bump photochromics by illumination, thereby consumes the oxygen that is dissolved in the photosensitive layer; Raster scanning optical module or illumination and the spatialization light modulator arrays of imaging again; The rasterisation light beam by being arranged on impact radiation band downstream part or the electromagnetic radiation array of light beam or the modulation photochromics that exposes; Conveying mechanism, be arranged between the electromagnetic radiation array of plate and bump light band and rasterisation light beam or modulation relative motion is provided, make a part of clashing into this plate continuously, then carry out second bump, make the part of having clashed into of this plate form pattern, another part of this plate is accepted first bump simultaneously.
In another embodiment, this system comprises: linear illumination source, and this linear illumination source brings photochromics on bump two or the more a plurality of matrix by illumination, thereby consumes the oxygen that is dissolved in the photosensitive layer; Raster scanning optical module or illumination and the spatialization light modulator arrays of imaging again, the electromagnetic radiation array by rasterisation light beam or light beam or modulation exposes and is arranged on the photochromics of impact radiation band downstream part; Conveying mechanism, be arranged between the electromagnetic radiation band of matrix and bump light band and rasterisation light beam or modulation relative motion is provided, make and clash into a plate continuously, then carry out second bump, and make the part of having clashed into of this plate form pattern, another plate is accepted its first bump simultaneously.
Light source wavelength typically is ultraviolet source or the near ultraviolet radiation of 244nm to 436nm.In an example, light source has linear modulation on the focal position of spill catoptron.Also tool has plenty of shutter assembly, and this shutter assembly can stop or cover electronically the output of some or all lamps selectively.A conveying mechanism comprises the impression dish, and this impression dish moves described plate below spatialization light modulator arrays linear illumination source and raster scanning assembly or illumination and imaging again.
In another example, light source comprises led array, and wherein many row LED interlock.Typically, diffusion mechanism such as biconvex lens the energy fluid space that makes this array be integrated in the one dimension, simultaneously plate with respect to the relative motion of bump be integrated in with making the energy fluid space with above-mentioned one dimension orthogonal dimension in.In addition, preferably, described biconvex lens has minimum optical power on the direction of described relative motion.
Preferably, conveying mechanism carries out work with continuous speed, is no faster than 2-20 second and is not later than 10-100 second after the bump beginning after the bump beginning, and this continuous velocity is enough to produce pattern exposure.In addition, the width of bump illuminating bundle is preferably more than or the sweep trace that equals to be provided by rasterisation light beam or light beam or the width of imaging space photomodulator institute exposed areas.
Feature of the present invention also is a kind of method, and this method has improved the exposure of photochromics, and this method comprises: the light band that is enough to consume dissolved oxygen DO in photochromics is provided; At the downstream part of bump light band, provide the electromagnetic radiation array of rasterisation light beam or light beam or modulation, so that this material forms pattern; Between the electromagnetic radiation array of material and bump light band and rasterisation light beam or light beam or modulation, provide relative motion; Reach a part of clashing into described plate by the bump light band, and make the part of having clashed into of described plate form pattern by the electromagnetic radiation array of rasterisation light beam or light beam or modulation, another part of described plate is clashed into simultaneously.
Another method that improves the exposure of photochromics comprises: the light band that is enough to consume dissolved oxygen DO in photochromics is provided; At the downstream part of bump light band, provide the electromagnetic radiation array of rasterisation light beam or light beam or modulation, so that this material forms pattern; Between the electromagnetic radiation array of material and bump light band and rasterisation light beam or light beam or modulation, provide relative motion; Reach by the bump illumination and bring a plate that clashes in these plates, then carry out second bump, and the electromagnetic radiation array by rasterisation light beam or modulation makes the part of having clashed into of described plate form pattern, for first bump, bring the other parts of the described plate of exposure by the bump illumination simultaneously.
Another method that improves the exposure of photochromics comprises: the light band that is enough to consume dissolved oxygen DO in photochromics is provided; At the downstream part of bump light band, provide the electromagnetic radiation array of rasterisation light beam or light beam or modulation, so that the photochromics on two or the more a plurality of matrix forms pattern; Between the electromagnetic radiation array of matrix and bump light band and rasterisation light beam or light beam or modulation, provide relative motion; And bring plate of exposure by bump illumination, and then carrying out second bump, and make the part of having clashed into of described plate form pattern by the electromagnetic radiation array of rasterisation light beam or modulation, another plate is accepted first bump simultaneously.
In a preferred embodiment, light band typically wavelength be ultraviolet ray or the near ultraviolet ray of 244nm to 436nm.In an example, light band is from the linear modulation on the focal position that is positioned at the spill reverberator, and has shutter assembly, and this shutter assembly stops or cover electronically the output of some or all lamps selectively.In another example, light band is from led array.Typically, arrange the LED alternative arrangement, and the LED illuminance spreads by biconvex lens more.Described biconvex lens preferably has minimum optical power on direction of relative movement.In another example, imaging len makes linear modulation or led array form pattern by machinery or electronic shield, and image projection to matrix, thereby produce the light band of tool sharp edge, wherein seldom or do not have photoimaging to outside by the boundary that sharp edge limited.
According to the present invention, be used to have the printed panel of photosensitive layer or integrated embedded bump and the exposure system on other matrix comprises: linear modulation, it typically produces wavelength is ultraviolet ray or the near ultraviolet radiation of 244nm to 436nm; Raster scanning optical module or illumination and the spatialization light modulator arrays of imaging again, the electromagnetic radiation array of its rasterisation light beam by being arranged on impact radiation band downstream or light beam or the modulation photochromics that exposes; And conveying mechanism, be arranged between the electromagnetic radiation array of plate and bump light band and rasterisation light beam or modulation relative motion is provided, thereby clash into the part of this plate continuously, and make the part of having clashed into of described plate form pattern, the other parts of this plate or another plate are also clashed into simultaneously simultaneously.
Be used to have the printed panel of photosensitive layer or the integrated embedded bump and the exposure system of other matrix is characterised in that, led array has the LED of multi-row staggered layout, bring the bump photochromics with diffusion mechanism by illumination, thereby consume the dissolved oxygen DO in photosensitive layer; Raster scanning optical module or illumination and the spatialization light modulator arrays of imaging again, the rasterisation light beam in its downstream by being arranged on the impact radiation band or the electromagnetic radiation array of light beam or the modulation photochromics that exposes; And conveying mechanism, be arranged between the electromagnetic radiation array of plate and bump light band and rasterisation light beam or modulation relative motion is provided, thereby clash into the part of this plate continuously, and make the part of having clashed into of described plate form pattern, the other parts of this plate or another plate are also clashed into simultaneously simultaneously.
Be used to have the printed panel of photosensitive layer or another integrated embedded bump and exposure system of other matrix is characterised in that, illumination machinery or electron optic shielding be imaged onto on the matrix producing the light band of sharp edge, thereby the bump photochromics is to consume the dissolved oxygen DO in photosensitive layer; Raster scanning optical module or illumination and the spatialization light modulator arrays of imaging again, the rasterisation light beam in the downstream by being arranged on the impact radiation band or the electromagnetic radiation array of light beam or the modulation photochromics that exposes; And conveying mechanism, be arranged between the electromagnetic radiation array of plate and bump light band and rasterisation light beam or modulation relative motion is provided, thereby clash into the part of this plate continuously, and make the part of having clashed into of described plate form pattern, the other parts of this plate or another plate are also clashed into simultaneously simultaneously.
Be used to have the printed panel of photosensitive layer or another integrated embedded bump and exposure system of other matrix is characterised in that light source clashes into photochromics by light band, thereby consume the dissolved oxygen DO in photosensitive layer; Image optical module, the rasterisation light beam in the downstream by being arranged on the impact radiation band or the electromagnetic radiation array of light beam or the modulation photochromics that exposes; And conveying mechanism, be arranged between the electromagnetic radiation array of plate and bump light band and rasterisation light beam or modulation constant relative motion is provided, thereby clash into the part of this plate continuously, and make the part of having clashed into of described plate form pattern, the other parts of this plate or another plate are also clashed into simultaneously simultaneously.
Another the integrated embedded formula of hitting that is used to have the printed panel of photosensitive layer or other matrix is hit with exposure system and is characterised in that the bump photochromics is brought by illumination in the rectangular illumination source, thereby consumes the dissolved oxygen DO in photosensitive layer; Image optical module, the downstream rasterisation light beam by being arranged on the impact radiation band or the electromagnetic radiation array of light beam or the modulation photochromics that exposes; And conveying mechanism, be arranged in the relative motion that stepping is provided between the electromagnetic radiation array of plate and bump light band and rasterisation light beam or modulation, thereby the part of this plate is clashed in the piecewise, and make the part of having clashed into of described plate form pattern, the other parts of this plate or another plate also are subjected to the segmentation bump simultaneously simultaneously.
A method for optimizing that improves photochromics exposure on the plate comprises: the first by the described plate of the first bump illumination bump fully consumes the dissolved oxygen DO in photochromics; Described first by the described plate of the second bump illumination bump fully consumes the oxygen that is diffused into after first bump in the photochromics, and makes first form pattern and it is exposed.By the second portion of the first bump illumination crash panel, the first of plate carries out second bump and forms pattern simultaneously.Preferably, the time between the imaging and first bump is far longer than the time between the imaging and second bump.Time between first bump and second bump is typically greater than 10 seconds.In one embodiment, produce as led array by identical light source as described in the first bump illumination and second bump throw light on.The first bump light band typically has the luminous power greater than the second bump light band.
According to the present invention, an embedded bump and an exposure system that is used to have the plate of photosensitive layer comprises: the first impact radiation source is used for clashing into photochromics and consumes dissolved oxygen DO at photosensitive layer; The second impact radiation source is used for clashing into photochromics and consumes the oxygen that is diffused into photochromics once more; The source of photochromics is used to expose; And mechanism, be used between plate and the first impact radiation source, the second impact radiation source and exposure source, providing relative motion.In an example, the described first impact radiation source and the second impact radiation source are led array.Typically, the luminous power of first impact radiation is greater than the second impact radiation source.
Description of drawings
Those of ordinary skills from preferred embodiment describe below with accompanying drawing can obtain other purpose, feature and advantage, wherein:
Figure 1A-1E is a schematic top view, and they show in time according to the present invention the snapshot of some performed steps of method;
Fig. 2 A-2E is a schematic top view, and they show the snapshot of some performed steps of according to the present invention another method in time;
Fig. 3 A-3G is a schematic three dimensional views, and they show the snapshot according to some performed steps of method for optimizing of the present invention of CTP system in time, this CTP system printed panel side by side that can expose;
Fig. 4 is the schematic three-dimensional views of an embodiment of system of the present invention;
Fig. 5 is a schematic side elevation, and it shows linear modulation bump assembly shown in Figure 4 in further detail;
Fig. 6 is a schematic three-dimensional views, and it shows an embodiment of system of the present invention;
Fig. 7 is a schematic side elevation, and it shows LED bump assembly shown in Figure 6 in further detail;
Fig. 8 is another highly schematically view, and it shows the combination embodiment of the invention shown in Fig. 6 and 7, that be offset led array and biconvex lens; And
Fig. 9-the 11st is with the corresponding energy flow graph of the combination of Fig. 8 table.
Embodiment
Except following public preferred embodiment or embodiment, the present invention can also be other embodiment, and can realize or carry out in various modes.Therefore, should be understood that the present invention be not limited to be applied to proposed in describing below or accompanying drawing shown in these CONSTRUCTED SPECIFICATION and the layout of part.
According to a method and system of the present invention, by on top layer, producing the printer's blanket that light band 14 clashes into the printing forme 12 of Figure 1A as has photosensitive top layer, thereby consume any dissolved oxygen DO in the photosensitive layer of top.Absorption characteristic according to resin, light band 14 is preferably ultraviolet radiation or the near ultraviolet radiation that scope is 244-436nm, and the led array by UV-lamp or near ultraviolet ray lamp or a generation ultraviolet ray or near ultraviolet ray produces light band 14, and these will be discussed below.
The same shown in Figure 1B-1C, conveying mechanism moves in the bump part 16 of plate 12 plate 12 of light band 14 belows.Therefore, at time T=t
0In the time of (Figure 1A), the bump of part 16 does not also begin, at time T=t
1The time (Figure 1B), the bump of part 16 just begins, and at time T=t
2The time (Fig. 1 C), part 16 is clashed into.Next, at time T=t
3The time (Fig. 1 D), the optical imagery assembly begin by the downstream that is arranged on impact radiation band 14, by illumination and expose photosensitive top layer in the plate 12 that is clashed into of the light beam of imaging space light modulator arrays rasterisation that produce, modulation or electromagnetic energy beam 20 or an array light again.
Therefore, part or all of impingement region 16 carries out the transition to from Fig. 1 C simultaneously and produces contiguous impingement region 18 Fig. 1 D as the imaging of Fig. 1 D mode.Determine regional 18 length by needed time delay, reach chemical equilibrium with the luminosity consumption process that allows oxygen.In order to obtain best picture quality, therefore according to resin formula and/or thickness, the delay between bump beginning and pattern exposure begin approximates t greatly
3-t
1Time, typically must surpass 2-20 second, and typically must be no more than 10-100 second.Usually need to provide the time of minimum to reach balance, still, wait oversizely, the oxygen dissolving around can making is got back in the resin.In addition, for all parts of printer's blanket, delay should be constant, so that all parts of described plate can access performance, scope and the continuity of best exposure.Handle continuously and carry out continuously, wherein just clash into the next neighbouring part 24 of described plate, simultaneously at time T=t to carry out the transition to this mode shown in Fig. 1 E from Fig. 1 D
4The time, during the part 20 shown in Fig. 1 E, part or all that makes part 18 forms pattern, and part 22 is clashed into and formed pattern.
Such as explained above, if after bump, produce exposure too soon, can not produce balance so.In addition, if long time ground produces exposure after the bump balance, oxygen is diffused in the resin again so.
Therefore, according to another method for optimizing, Fig. 2 A shows the bump and the imaging of printed panel greater than the bump light band to 2L.It also shows the method that applies first and second bumps, wherein first bump has consumed a large amount of oxygen that are dissolved in the whole printer's blanket, and second bump has consumed the oxygen that penetrates the resin top layer, wherein, and inherent delay after and just before pattern exposure, apply second and clash into.This process can be considered to accurately adjust oxygen distribution and distribute to obtain best exposed feature.In Fig. 2 A, conveying mechanism moves plate 12 below the rectangle first bump light band 26.Preferably, this light band has gem-pure edge, and forms by laser beam or light beam or illumination machinery or electron optics mask are imaged onto on the plate surface 12.It near light band 26 the second bump light band of choosing wantonly 27.Before pattern exposure, to carry out first when light band 26 and clash into, this first bump typically is not less than 2-20 second and typically is no more than 10-100 during second, and light band 27 was carried out the second optional bump before pattern exposure.Than short distance, typically separating 0.1 to 6.0 inch position along the direction of motion of described plate 12 is light band 28 second bump after the light band 27.This is the zone that forms image energy stream, wherein this formation image energy stream impinges upon on the surface 12 of described plate, and by by illumination and creating of the modulation that produces of imaging space light modulator arrays again with rasterisation light beam or electromagnetic energy beam or row's light.
The same shown in Fig. 2 A-2B, conveying mechanism moves plate 12 and the bump part 30 (Fig. 2 B) that is positioned at the first bump light band, 26 belows, the whole striated section 32 of clashing into Fig. 2 C simultaneously.In Fig. 2 C, whole striated section 32 is clashed into.In Fig. 2 D, plate 12 or light band 26-28 are guided (index) to the striped 38 of contiguous not bump.In Fig. 2 E, conveying mechanism moves the plate 12 of light band 26-28 and striped 38 belows, bump part 34 below light band 26, simultaneously striped 40, part 36 (are diffused into speed in the curved surface resin according to oxygen by second clashing into, the energy stream of this second bump is 0% to 100% first Impact energy stream) below light band 27, expose, and soon afterwards, below light band 28, form pattern.In Fig. 2 F, whole striated section 38 is subjected to first bump, and whole striated section 40 is subjected to second bump, forms pattern by first exposure energy then.In Fig. 2 G, plate 12 or light band 26-28 are directed to the contiguous not bump striated section 44 of not clashing into striated section 42 and vicinity.In Fig. 2 H, conveying mechanism moves plate 12 below light band 26-28 and striated section 46, bump part 42 below the first bump light band 26, below light band 26, clash into striped 48, part 44 simultaneously, simultaneously below light band 27, striped 46, part 44 (are diffused into speed in the curved surface resin according to oxygen once more by second bump, the energy stream of this second bump is 0% to 100% first Impact energy stream) expose, and soon afterwards, below light band 28, form pattern.In Fig. 2 I, whole striated section 46 is clashed into, and whole striated section 48 forms pattern by first exposure energy.In Fig. 2 J, plate 12 or light band 27-28 are directed in the contiguous bump striated section 52.In Fig. 2 K, conveying mechanism moves plate 12 below light band 27 and striated section 52, part 50 (is diffused into speed in the curved surface resin (flexo resin) according to oxygen once more by second bump, the energy stream of this second bump is 0% to 100% first Impact energy stream) expose, soon afterwards, below light band 28, form pattern.In Fig. 2 I, whole striated section 46 is clashed into, and whole striated section 46 forms pattern.Bigger plate exposes by additional bump and imaging session.
A method according to the present present invention and system, Fig. 3 A show to 3G and are used for clashing into and the imaging preferred steps of printed panel side by side in typical newspaper CTP system.In Fig. 3 A, two unexposed printed panels 100 and 102 are supported on the vacuum platen 104, and two unexposed plates 106 and 108 are transported on the exposure desk with wait in queuing.After on being placed into impression dish 104, plate 100 and 102 continuous velocities that produced with laser grating output scanning device 112 under the effect of impact that bump light 110 and raster scanning light band are produced move.Other exposure module that photochromics is exposed with electromagnetic radiation can be used, and responds radiation ultraviolet, visual or far infrared as spatial light modulator by light.With 0% to 100% of required total bump power, be typically 80% power and clash into (first bump) plate 102.Simultaneously, be right after after passing through the pattern exposure of laser grating output scanning device 112, the plate 100 that is clashed in previous circulation is subjected to bump (second bump) again.In an embodiment shown in this accompanying drawing, the grating pattern exposure falls behind about 3 inches of second bump along the direction of plate transfer movement.Second bump is 0% to 100% of required total bump power, but typically less than 25% of the first bump power.In Fig. 3 B, the plate 100 of bump and imaging leaves exposure desk and is transported in the plate treatment bench.In Fig. 3 C, unexposed plate 106 is transported to the vacuum platen 104 from the importation.In Fig. 3 D, opposite among bump and pattern exposure and Fig. 3 A.Clash into (first bump) plate 106 with 0% to 100% of required total bump power.Simultaneously, the plate 102 that is clashed into by bump light 110 in previous circulation (Fig. 3 B) is subjected to bump (second bump) again, and then carries out pattern exposure by laser grating output scanning device 112 immediately.In Fig. 3 E, the plate 102 of bump and imaging leaves exposure desk and is transported in the plate treatment bench.In Fig. 3 F, unexposed plate 106 is transported to the vacuum platen 104 from the importation.And in Fig. 3 G, on vacuum platen 104, repeating whole circulation with new plate 106 and 108, plate 116 and 118 is waited in line simultaneously.Therefore, it shows, staggered plate carrying method combines with bump that replaces and formation method, for automatic UV photopolymer curved surface CTP system, can produce the highest productive capacity.
In an embodiment shown in the Figure 4 and 5, provide the conveying mechanism of relative motion to comprise vacuum platen 130 being scanned between video beam or a plurality of one-tenth video beam of plate and impact radiation band and modulation, this vacuum platen 130 is automatically moved along the direction shown in the vector 132.This direction of motion becomes horizontal with the length of the cruciform band of impact radiation.Produce ultraviolet ray bump band by linear modulation assembly 140 as the long arc metal-halide lamp, the exposure module optical module represents that with 142 it is positioned at the below of fixture 144.Typically, the unshowned UV laser instrument that combines with optical module produces the grating light beam, perhaps can the usage space photomodulator.In the embodiment of Fig. 5, lamp 146 is arranged on the focal position of the concave mirror 148 in the housing 150.Electric mechanical shutter assembly 152 has two shadow shields that separate, therefore under two plates are placed on situation on the impression dish 130, the side that shadow shield is shown in an open position allows a plate to be clashed into, and the opposite side of shadow shield in the closed position can prevent that the light of roaming from exposing housing 150, and can prevent other plate that exposes inadvertently.In this case, plate is clashed into and formed pattern like that shown in Fig. 2 A-2L, and another plate is subjected to clashing into fully, but does not have imaging, till the imaging of first plate is finished, and after imaging 142 moves in the position on second plate.Shutter assembly 152 is useful, closes linear modulation bump assembly 140 because the time span of heating linear modulation 140 can prevent electricity.In other words, between the exposure of plate separately, linear modulation bump assembly 140 is not closed.
In another embodiment shown in Fig. 6 and 7, LED bump assembly 160 by Fig. 6 provides the bump light band, this LED bump assembly 160 comprises the led array 162 of Fig. 7, and this led array 162 is seated on the circuit board installing plate 164 of diffusion mechanism such as lens arra 166 tops.Simultaneously heat radiator 168 can be set.Preferably, as shown in fig. 8, arrange led array 162 alternative arrangement more, desirable overlapping to produce.LED among every row separates equably, and the number of the column of led array has been set the width of bump.For this non-imaging bump, the bump width is greater than the width of image scanning line.LED spacing and row's number is determined by the stream of the ideal capacity on the target.For the non-uniform lighting that discontinuous characteristic produced to led array is proofreaied and correct, if especially this array is arranged near the printed panel 112 that clashed into, the biconvex lens 166 of Fig. 8 is arranged on array 162 and between the plate on the imaging plane so.Therefore biconvex lens 166 is oriented on the direction of motion 170 of printed panel does not have luminous energy, spreads perpendicular to the radiation of the direction of motion 172 of printed panel and assembles.Before led array being carried out any extra electro-optical accurate adjustment, the level fluctuation in the energy flow field that the spacing of lenticular lens array and size have been determined to launch.When exposure is undesirable, each LED is controlled, control each row of LED perhaps minimumly, allow electronics to close (shuttering) led array, the control mean energy flows is accurately adjusted balance and is run through the energy stream of optical field and first, second bump band shown in Figure 2.
When printed panel 112 moves to led array when below, expose during accumulation (gatherings) energy in many rows of led array flows in any one position on the plate.This energy stream preferably accumulates on two axles, thereby typically produces the non-uniformity less than 5% in bidimensional energy flow field.Typical high sensitive ultraviolet-sensitive printer's blanket is that 365nm needs about 2-20mJ/cm under the situation between the 436nm at wavelength
2The Impact energy stream of (millijoule/square centimeter), when from applying when beginning bump when measuring, on the typical thick curved surface photosensitive polymerization of 15mil resin, the oxygen that reduces stops effect to continue about 10-100 second, and begin to spend 2-20 second at least to applying pattern exposure from knockout process.
Fig. 9 is the energy flow graph of imaging plane/printed panel of four contiguous LED.Figure 10 by after the lenticular lens array 166, the energy flow graph of imaging plane/printed panel of four contiguous LED.Figure 11 is the energy flow graph that reaches after passing through lenticular lens array 166 at the imaging plane/printed panels after the pre-polymerization motion, four contiguous LED of printed panel.
Typically, conveying mechanism 130 among Fig. 4 and Fig. 6 carries out work with continuous speed, be enough to produce exposure by the rasterisation light beam that produces by spatialization light modulator arrays illumination and imaging again or an array light, but according to the photosensitive polymerization resin, for each part of plate, this speed in second, is clashed into afterwards 5-20 second but be no faster than first at 10-60.
In another embodiment, after the lens 166 of Fig. 8 is image lens, the image of this image lens projection rectangle shielding, this shielding is thrown light on by uniform with identical ultraviolet ray or near ultraviolet line source and is had the light band that limits the edge clearly on the plane of delineation to be created in, and these edge co are on the surface of printed panel or matrix.The bump at edge allows the seamless cover tile (tiling) of subimage to form bigger image clearly, therefore allows some the wideer board to explosure of light band that sent than bump.
In another embodiment, the back of biconvex lens 166 is spatial light modulators, rather than top rectangular shield, thereby allow the electro-optical modulation of ultraviolet ray or near ultraviolet ray light source, be defined as the light band at edge clearly to be created in to have on the plane of delineation, these edge co are on the surface of printed panel or matrix.
Therefore, the inventive method of the exposure of raising photochromics comprises: one or more light band is provided, and this light band is enough to consume the oxygen that is dissolved in the printed panel photosensitive layer; Provide by illumination and the modulation that spatial light modulator array produced and light beam rasterisation or electromagnetic radiation beams or an array light of imaging again; In the downstream of bump light band, be provided between the optical arrays of the plate that scribbles photochromics and light beam light band and modulation and rasterisation or spatial light modulation relative motion is provided; Reach a part of bringing crash panel or adjoining plate with wide illumination, and make the part that is impacted form pattern, throw light on bump simultaneously and bring another part of crash panel or adjoining plate with the light beam of the rasterisation of modulating or the optical arrays of spatial light modulation.In this method, each part or each plate of plate are clashed into, and come imaging with continuous process afterwards in an independent machine.
In the prior art, ' No. 825 patent disclosures bump, and the imaging after the bump, but need to use laser beam, this laser beam is divided into two different bundles, thereby causes the expense of system higher, because the higher lasing light emitter of required power.' No. 416 patent disclosures linear LED matrix make printed panel carry out pre-exposure, but not open not relevant in proper order anything with suggestion.Comprise in all possible situation: whole printed panel is all clashed into, and is transported to then in the pattern exposure machine.
In the present invention, on the contrary, provide bump and exposure system in gathering, embedded, this system has used the lower optical exposure source of expense to clash into, and therefore having preserved more expensive luminous energy potentially forms the pattern exposure process.The embedded exposure of newspaper printing hectograph is quicker, because the structure of plate induction system is interlocked bump and imaging process.The plate image quality is higher, because before pattern exposure, the pre-exposure system of two phase place makes oxygen concentration be adapted to whole resin xsect.
Therefore, the present invention has adopted linear modulation (linearlamp) in the nonimaging optics structure, as long arc metal-halide lamp or led array, thereby comes crash panel with UV or nearly UV light before pattern exposure.Laser raster scanner by modulation or by illumination and again the optical arrays that forms of the spatialization light modulator arrays of imaging come imaging.Energy stream footprint typically has edge very unsharp, distortion.
In addition, lamp (as linearity or point source, length or short arc etc.) or led array are used for imaging arrangement, thereby clash into gem-pure edge.For for the plate of this bump part, this is favourable, because bigger plate need expose in the mode of striped or segmentation in piece continuously.The distortion edge has clashed into by light pollution the neighbouring part of printing forme, and edge bump permission clearly is by the bigger percussion figure of seamless cover tile formation of knockson image.
The present invention has adopted plate chemistry individual delays between bump and pattern exposure, thereby for the luminosity consumption of oxygen provides the time, to arrive chemical equilibrium.The present invention makes linear modulation be coupled in the linear sweep or zone bump is coupled in the sector scanning, observing from the requirement of the constant delay that strikes first exposure, thereby realizes the uniform image quality.Make input and output staggered under the situation of two or more a plurality of printed panels having, thus the delay that between bump and pattern exposure, allows plate to rely on.When suitable or when needing, apply first and second bumps: first bump consumption is dissolved in a large amount of oxygen on the whole printer's blanket, and inherent delay after and just before pattern exposure, applied second clash into and consumed the oxygen that is diffused into the resin top layer.This has carried out the oxygen distribution accurate adjustment, distributes thereby obtain best exposed feature.
Biconvex lens is by optics and assemble LED Impact energy stream statically, and this energy stream is perpendicular to the direction of relative movement of bump and plate.The bump and the relative motion of plate are along slow scan direction mechanically, dynamically focused energy flows.
Bump separately allows the different bumps and the wavelength of pattern exposure with imaging source.If the pattern exposure source is very expensive laser, the bump source and the pattern exposure source that separate so are favourable, and wherein luminous power needs very big.
Do not illustrate in other accompanying drawing although show concrete feature of the present invention in some drawings, this is for convenience, because each feature can combine with any one further feature or whole further feature according to the present invention.Here employed term " comprises ", " having " and " having " should be broadly, understand all sidedly, and is not limited to any physical interconnections.And disclosed any embodiment is not as unique possible embodiment among the application.
Those of ordinary skills can produce other embodiment, and these embodiment fall into following protection scope of the present invention.
Claims (48)
1. an integrated embedded bump and exposure system is used to have the printed panel of photosensitive layer, and this system comprises:
Linear illumination source, this light source brings the bump photosensitive layer by illumination, to consume the dissolved oxygen DO in photosensitive layer;
Exposure module comprises the raster scanning optical module, is used to use the electromagnetic radiation that is set directly at bump light band downstream part that photosensitive layer is exposed; And
Conveying mechanism, being arranged to provide relative motion between plate and light band and electromagnetic radiation, thus the part of crash panel and make the part of having clashed into of plate form pattern continuously, the other parts of described plate are clashed into simultaneously.
2. the system as claimed in claim 1 is characterized in that, light source is that wavelength is the source ultraviolet, visual or infrared radiation of 200nm to 1100nm.
3. system as claimed in claim 2 is characterized in that, described light source is included in spill reflector focal point locational ultraviolet, visual or ultrared emission lamp or lamp array.
4. system as claimed in claim 3, this system also includes the shutter assembly of the output that selectively stops lamp.
5. the system as claimed in claim 1 is characterized in that, described exposure module is the raster scanning optical module, and this raster scanning optical module responds ultraviolet ray, visual or ultrared laser optically.
6. the system as claimed in claim 1 is characterized in that, described conveying mechanism comprises the impression dish, and this impression dish moves the plate below described linear illumination source and exposure module.
7. system as claimed in claim 2 is characterized in that described light source comprises led array.
8. system as claimed in claim 7 is characterized in that, many rows of described LED are staggered and arrange.
9. system as claimed in claim 7 is characterized in that described light source comprises diffusion mechanism.
10. system as claimed in claim 9 is characterized in that described diffusion mechanism is a biconvex lens, is used for spatially assembling the energy stream of this array.
11. system as claimed in claim 10 is characterized in that, described biconvex lens is oriented to along the direction of relative motion has minimum luminous power.
12. the system as claimed in claim 1 is characterized in that, described conveying mechanism carries out work with the speed that continues.
13. the system as claimed in claim 1 is characterized in that, described conveying mechanism carries out work with such speed, and this speed is enough to produce exposure in second at the 10-100 of bump for each part of described plate.
14. the system as claimed in claim 1 is characterized in that, described conveying mechanism carries out work with such speed, and this speed is enough to produce exposure in the time of the 2-20 second that is no faster than bump for each part of described plate.
15. the system as claimed in claim 1 is characterized in that, the width of described primary beam is greater than or equal to the width of the sweep trace that exposure module provides.
16. the system as claimed in claim 1 is characterized in that describedly, exposure module comprises the raster scanning optical module.
17. the system as claimed in claim 1 is characterized in that, described exposure module comprises spatial light modulator.
18. a raising comprises the method for exposure of the printed panel of photosensitive layer, this method comprises:
The bump light band that is enough to consume the dissolved oxygen DO in photosensitive layer is provided;
Directly the downstream part at described bump light band provides the electromagnetic radiation that comprises the raster scanning optical module, so that this photosensitive layer imaging;
Between photosensitive layer and bump light band and electromagnetic radiation, provide relative motion; And
Bring a part of clashing into described printed panel by described bump illumination, and make the part imaging of having clashed into, clash into another part of described printed panel simultaneously by this bump light band by described electromagnetic radiation.
19. method as claimed in claim 18 is characterized in that, described light band is that wavelength is 200nm to ultraviolet, the visual or infrared radiation of 1100nm.
20. method as claimed in claim 18 is characterized in that, described light band is from ultraviolet, the visual or ultrared emission lamp on the focal position that is positioned at the spill catoptron.
21. method as claimed in claim 20 also includes the shutter assembly of the output that selectively stops lamp.
22. method as claimed in claim 18 is characterized in that, described light band is from led array.
23. method as claimed in claim 22 is characterized in that, many rows of described LED are staggered and arrange.
24. method as claimed in claim 22 also comprises the described LED illumination of diffusion.
25. method as claimed in claim 22 is characterized in that, biconvex lens is used to spatially make the energy stream aggregation of led array.
26. method as claimed in claim 22 is characterized in that, the diffuse optical fan diffuser is used to make the energy stream aggregation of led array in the space.
27. method as claimed in claim 25 is characterized in that, described biconvex lens is oriented to along the direction of relative motion has minimum luminous power.
28. method as claimed in claim 18 is characterized in that, described relative motion is carried out with the speed that continues.
29. method as claimed in claim 18 is characterized in that, carries out described relative motion with such speed, this speed is enough to produce exposure in second at the 10-100 of bump for each part of described plate.
30. method as claimed in claim 18 is characterized in that, carries out described relative motion with such speed, this speed is enough to produce exposure in the time of the 2-20 second that is no faster than bump for each part of described plate.
31. a method that improves the exposure of the photosensitive layer on the printed panel, this method comprises:
Bring a part of clashing into this printed panel by the bump illumination, this bump light band is enough to consume the dissolved oxygen DO in photosensitive layer;
Make the part imaging of having clashed into by the raster scanning optical module; And
Clash into another part of this plate by the bump light band with continuous process, in the time of bump that therefore a part of plate takes place, another part of this plate carries out imaging.
32. an integrated embedded bump and an exposure system is used to have the printed panel of photosensitive layer, this system comprises:
Linear illumination source comprises linear modulation, and it is ultraviolet or the visual or ultrared radiation of 200nm to 1100nm that this linear modulation produces wavelength, thereby brings the bump photosensitive layer by illumination, consumes the dissolved oxygen DO in photosensitive layer;
Raster scanning optical module or based on the exposure module of spatial light modulator, the light beam of the rasterisation by being set directly at bump light band downstream or the electromagnetic radiation array of light beam or the spatial modulation photosensitive layer that exposes; And
Conveying mechanism, be arranged between the electromagnetic radiation array of the light beam of plate and light band and rasterisation or light beam or spatial modulation relative motion is provided, thereby clash into the part of this plate continuously, and make the part imaging of having clashed into of described plate, another part of this plate is also clashed into simultaneously simultaneously.
33. an integrated embedded bump and an exposure system is used to have the printed panel of photosensitive layer, this system comprises:
Led array, this led array have the LED and the diffusion mechanism of multi-row staggered layout, and this diffusion mechanism brings the bump photosensitive layer by illumination, thereby consume the dissolved oxygen DO in photosensitive layer;
Raster scanning optical module or based on the exposure module of spatial light modulator, the rasterisation light beam by being set directly at bump light band downstream or the electromagnetic radiation array of light beam or the spatial modulation photosensitive layer that exposes; And
Conveying mechanism, be arranged between the electromagnetic radiation array of plate and light band and rasterisation light beam or light beam or spatial modulation relative motion is provided, thereby clash into the part of this plate continuously, and make the part imaging of having clashed into of described plate, the other parts of this plate are also just clashed into simultaneously.
34. an integrated embedded bump and an exposure system is used to have the printed panel of photosensitive layer, this system comprises:
Linear illumination source brings the bump photosensitive layer by illumination, thereby consumes the dissolved oxygen DO in photosensitive layer;
Raster scanning optical module or based on the exposure module of spatial light modulator, the rasterisation light beam by being set directly at impact radiation band downstream or the electromagnetic radiation array of light beam or the spatial modulation photosensitive layer that exposes; And
Conveying mechanism, with the speed that continues carry out work and be arranged on plate and the electromagnetic radiation array of light band and rasterisation light beam or light beam or spatial modulation between relative continuous motion is provided, thereby clash into the part of this plate continuously, and make the part imaging of having clashed into of described plate, the other parts of this plate are also clashed into simultaneously simultaneously.
35. a method that improves the photosensitive material layer exposure on the printed panel, this method comprises:
Bring the first of crash panel to consume dissolved oxygen DO in photochromics fully by the first bump illumination;
Bring the described first of crash panel to consume first fully by the second bump illumination and clash into the oxygen that is diffused into once more afterwards in the photochromics; And
Make the described first imaging that is exposed to the described first bump light band and the second bump light band by the raster scanning optical module.
36. method as claimed in claim 35 also comprises: bring the second portion of crash panel by the first bump illumination, the first of described plate accepts the described second bump light band and carries out imaging simultaneously.
37. method as claimed in claim 35 is characterized in that, the time between the imaging and the first bump illumination is greater than the time between the imaging and the second bump illumination.
38. method as claimed in claim 37 is characterized in that, the time between the first bump illumination and the second bump illumination was greater than 5 seconds.
39. method as claimed in claim 35 is characterized in that, the first and second bump light bands produce from identical light source.
40. an embedded bump and an exposure system that is used to have the printed panel of photosensitive layer, this system comprises:
The first impact radiation source is used to clash into photochromics, thereby consumes the dissolved oxygen DO in photosensitive layer;
The second impact radiation source is used to clash into photochromics, thereby consumes the oxygen that is diffused into once more in the photochromics;
The source of photochromics is used for exposing; And
Mechanism is used for providing relative motion between plate and the first impact radiation source, the second impact radiation source and exposure source.
41. method as claimed in claim 40 is characterized in that, the first impact radiation source and the second impact radiation source are led array.
42. method as claimed in claim 41 is characterized in that, the luminous power of first impact radiation is greater than the luminous power of second impact radiation.
43. system as claimed in claim 40 is characterized in that, the first impact radiation source and the second impact radiation source are ultraviolet, visual or ultrared emission lamps.
44. system as claimed in claim 43 is characterized in that, the luminous power of first impact radiation is greater than the luminous power of second impact radiation.
45. system as claimed in claim 43 is characterized in that, the luminous power of first impact radiation is less than or equal to the luminous power of second impact radiation.
46. system as claimed in claim 40 is characterized in that, the first impact radiation source is ultraviolet, visual or ultrared emission lamp, and the second impact radiation source is ultraviolet, visual or ultrared emitting laser.
47. system as claimed in claim 46 is characterized in that, the luminous power of first impact radiation is greater than the luminous power of second impact radiation.
48. system as claimed in claim 43 is characterized in that, the luminous power of first impact radiation is less than or equal to the luminous power of second impact radiation.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47418503P | 2003-05-29 | 2003-05-29 | |
| US60/474,185 | 2003-05-29 | ||
| US10/853,539 | 2004-05-25 | ||
| US10/853,539 US6903809B2 (en) | 2003-05-29 | 2004-05-25 | Integrated, in-line bumping and exposure system |
| PCT/US2004/016840 WO2004111725A2 (en) | 2003-05-29 | 2004-05-28 | An intergrated, in-line bumping and exposure system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1823301A CN1823301A (en) | 2006-08-23 |
| CN1823301B true CN1823301B (en) | 2011-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200480014357.XA Expired - Fee Related CN1823301B (en) | 2003-05-29 | 2004-05-28 | An integrated, in-line bumping and exposure system |
| CN 200480014281 Pending CN1826275A (en) | 2003-05-29 | 2004-05-28 | Substrate handling system |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480014281 Pending CN1826275A (en) | 2003-05-29 | 2004-05-28 | Substrate handling system |
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| Country | Link |
|---|---|
| CN (2) | CN1823301B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100593469C (en) * | 2007-02-12 | 2010-03-10 | 深圳市大族激光科技股份有限公司 | Modularization exposure system |
| KR100988897B1 (en) * | 2008-08-18 | 2010-10-20 | 주식회사 탑 엔지니어링 | Optic chuck for array tester |
| CN104298078A (en) * | 2009-05-14 | 2015-01-21 | 4233999加拿大股份有限公司 | System for and method of providing high resolution images using monolithic arrays of light emitting diodes |
| KR101288457B1 (en) * | 2011-11-08 | 2013-07-26 | 주식회사 탑 엔지니어링 | Array test apparatus |
| US9937703B2 (en) * | 2013-09-30 | 2018-04-10 | Flint Group Germany Gmbh | Device and method for the in-line production of flexographic printing plates |
| JP6002261B2 (en) * | 2015-03-11 | 2016-10-05 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | Light irradiation device |
-
2004
- 2004-05-28 CN CN200480014357.XA patent/CN1823301B/en not_active Expired - Fee Related
- 2004-05-28 CN CN 200480014281 patent/CN1826275A/en active Pending
Non-Patent Citations (1)
| Title |
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| JP特开平1-101536A 1989.04.19 |
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| CN1823301A (en) | 2006-08-23 |
| CN1826275A (en) | 2006-08-30 |
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