TW200600460A - Copper plating material, and copper plating method - Google Patents

Copper plating material, and copper plating method

Info

Publication number
TW200600460A
TW200600460A TW093136740A TW93136740A TW200600460A TW 200600460 A TW200600460 A TW 200600460A TW 093136740 A TW093136740 A TW 093136740A TW 93136740 A TW93136740 A TW 93136740A TW 200600460 A TW200600460 A TW 200600460A
Authority
TW
Taiwan
Prior art keywords
oxide powder
copper oxide
peak intensity
copper plating
copper
Prior art date
Application number
TW093136740A
Other languages
English (en)
Other versions
TWI267494B (en
Inventor
Shiroshi Matsuki
Original Assignee
Tsurumisoda Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004181810A external-priority patent/JP4113519B2/ja
Application filed by Tsurumisoda Co Ltd filed Critical Tsurumisoda Co Ltd
Publication of TW200600460A publication Critical patent/TW200600460A/zh
Application granted granted Critical
Publication of TWI267494B publication Critical patent/TWI267494B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electrolytic Production Of Metals (AREA)
TW093136740A 2004-06-18 2004-11-29 Copper plating material, and copper plating method TWI267494B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004181810A JP4113519B2 (ja) 2003-06-18 2004-06-18 銅メッキ材料及び銅メッキ方法

Publications (2)

Publication Number Publication Date
TW200600460A true TW200600460A (en) 2006-01-01
TWI267494B TWI267494B (en) 2006-12-01

Family

ID=35706094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136740A TWI267494B (en) 2004-06-18 2004-11-29 Copper plating material, and copper plating method

Country Status (3)

Country Link
KR (1) KR100650488B1 (zh)
CN (2) CN1709797B (zh)
TW (1) TWI267494B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6619718B2 (ja) * 2016-10-14 2019-12-11 株式会社荏原製作所 基板のめっきに使用される酸化銅粉体、該酸化銅粉体を用いて基板をめっきする方法、該酸化銅粉体を用いてめっき液を管理する方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100109A (ja) * 1989-09-12 1991-04-25 Mitsubishi Gas Chem Co Inc 微細銅粉の製造法
JPH0613435A (ja) * 1992-06-24 1994-01-21 Hitachi Cable Ltd キャリアテープ及びその製造方法
CN1084895A (zh) * 1992-09-30 1994-04-06 武汉市冶炼科研所 氨浸沉淀法处理低品位铜渣或氧化铜矿的工艺
JPH11310864A (ja) * 1998-04-28 1999-11-09 Kobe Steel Ltd コーティング層との密着性に優れた銅箔
KR100743844B1 (ko) * 1999-12-01 2007-08-02 도와 마이닝 가부시끼가이샤 구리 분말 및 구리 분말의 제조 방법
US6866765B2 (en) * 2000-07-07 2005-03-15 Hitachi Metals, Ltd. Electrolytic copper-plated R-T-B magnet and plating method thereof
TW539652B (en) * 2000-09-04 2003-07-01 Tsurumi Soda Kk Material for copper electroplating, method for manufacturing same and copper electroplating method
JP4033616B2 (ja) * 2000-09-04 2008-01-16 鶴見曹達株式会社 銅メッキ材料の製造方法
KR20020064482A (ko) * 2001-02-01 2002-08-09 선진하이엠(주) 전해 및 무전해 구리도금용 산화구리 용해 및 공급장치
JP2004519557A (ja) * 2001-02-23 2004-07-02 株式会社荏原製作所 銅めっき液、めっき方法及びめっき装置

Also Published As

Publication number Publication date
KR20050120566A (ko) 2005-12-22
CN102633289A (zh) 2012-08-15
KR100650488B1 (ko) 2006-11-29
CN1709797A (zh) 2005-12-21
TWI267494B (en) 2006-12-01
CN1709797B (zh) 2015-05-27

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