TW200535928A - Advanced multi-pressure workpiece processing - Google Patents

Abstract

Workpiece processing uses a transfer chamber in cooperation with a process chamber. The workpiece is to be heated to a treatment temperature, at a preheating pressure, and subsequently exposed to a plasma at a treatment pressure, which is less than the preheating pressure, yet very rapid pressure increases can be induced in the process chamber in transitioning from the treatment pressure to the preheating pressure. The transfer chamber pressure can be maintained at the treatment pressure, the preheating pressure or raised to a selected pressure to backfill the process chamber to the preheating pressure. A backfill arrangement can selectively induce rapid pressure in the process chamber. A bypass arrangement provides selective pressure communication between the transfer and process chamers and can be used for backfilling the process chamber from the transfer chamber.

Description

200535928 IX. Description of the invention: [Technical field to which the invention belongs]-This application claims priority from US application patent serial number 60 / 534,495, which was issued on January 7th, 2003, West 7C, and incorporates all of them here. Reference. [Previous technology] The present invention is generally related to the field of processing—a variety of workpieces, and more economically, a system or method that uses a more than one pressure to perform an overall process on the workpiece. For example, when manufacturing a workpiece such as a semiconductor wafer, the overall process usually uses different pressures at different points to perform the best tasks. One example of such a money-making process is disclosed in U.S. Patent No. 6,409,932 (hereinafter referred to as the 932 patent). In particular, in the second paragraph of the% 2 patent, procedures of seven previous fields are disclosed, known as the atmospheric-vacuum-atmosphere process (aphere4o_vacuum | atmosphere AVA) process. This process / Secondary manufacturing = chamber heating-the wafer reaches the expected process temperature, and then the process chamber is pumped to reduce it to: the expected process pressure, the plasma is added to the wafer, and the process is small-small The hole force returned to atmospheric pressure while the wafer was exchanged with another wafer. Such a process is useful, for example, when removing the photoresist etchant from the wafer. The 932 patent uses a well-known principle, and its heat conversion efficiency increases with gas pressure. After attempting to increase the excessive production of wafers, the AVA system in the prior art can be used, the No. 932 patent, a load / no load pressure to reduce the pressure in the process chamber, and then the intermediate pressure is used to heat the wafer in a process chamber. The load / no load need not be atmospheric pressure, but nevertheless must be equal to this intermediate pressure. Regarding this point, after careful consideration and reduction, in view of the arguments and cognitions of the present invention: The limitations and problems in the 932th supplement will be regarded as further limiting the increase in the production of the system. It is recognized in other previous fields that the heating effect is performed under a medium pressure connection with the conversion chamber. In other words, under any-the intermediate pressure or the process pressure, the processing object is transferred between the conversion chamber and the process chamber. It is recognized here that in these previous domain systems, the pressure change of the process room demand imposes significant restrictions on the system throughput, which will be further reviewed in the appropriate arguments below. When the present invention considers removing the pre-system and the problem, it still provides a better step forward. ALICE-D: \ PATENT \ PU-068-0008 6 200535928. [Summary of the Invention] It is described in a system for processing at least-a workpiece,-a device, and a method. The system includes at least a viewing room and a process room, and the amount of money in the conversion room is reduced, and the dust force of the processing room in the processing room can be changed separately, and the workpiece can be changed in the conversion room and the processing room. Between moves. The system further includes a reaction gas adjustment arrangement for providing a reaction gas to the process chamber, at least in a plasma processing reaction at a specific flow rate, and capable of providing the maximum flow rate of the reaction gas.

In the towel-her point of the present invention, 'the conversion chamber is moved and the process has the same processing pressure, the cap and the workpiece are added to the plasma processing process. The reading is turned from the conversion chamber to the process chamber under the processing pressure. It should be conveyed—processing temperature, and raising the process chamber = pressure = work, at a pressure increase rate to reach a preheating pressure. As a result, at least—partially using the additional weight line “flowing people at the flow rate”. Without increasing the pressure in the conversion chamber, the overall input rate into the process chamber is greater than the maximum A flow rate. Reduce the process surface force to the processing pressure. At least close to the Jianli of the machinery and the red and green parts in the process of electricity. In the clear another point of view 'the conversion chamber pressure and the process chamber pressure and preheating pressure system' -Processing temperature. Working together, the pressure in the conversion chamber and the μ to the same pressure will be used to 'transfer the workpiece from the rotation age_process chamber ^ in the process chamber under P thermal pressure' to reach the processing temperature of the workpiece. Reduce the surface force to the processing pressure = ㈣ at least below the preheating pressure. Under the processing pressure and the processing temperature, the edge workpiece is exposed to the electrolysis process. Then the process chamber pressure reaches -preheating pressure. As a result, the conversion chamber is not increased. The additional process chamber gas is used to flow in at -input rate. If the entry rate is greater than the maximum, the workpiece will be converted to the workpiece under the preheating pressure; = the input speed is in a continuous application, a backfill storage tank is arranged, in order to select the pressure of the toilet, 'use to select the backfill process. Chamber pressure from the process pressure to the pre-honing force. Still in another aspect of the present invention, the pressure is isolated from the process chamber, and the threshold value of the pressure of the room is greater than the pressure of Lai, and the temperature of the component is close to the temperature of the bribe. The most ALICE-D: \ PATENT \ PU-068-0008 200535928 At the beginning, it should be at least under the miscellaneous force, the processing pressure is less than the force of the shaft heat chamber program chamber, so the selected pressure is backfilled. Process room, at least ^ ^ pre-,,,, moving. Total_Miscellaneous up to the pressure of the job, under the preheating-force of the process room, 'preheat the workpiece to the inside 2ΪΓ for money change force separation _ emotion staring, lower _ pressure of ageing process . At least under the pressure of the force and the processing temperature, the exposure to the electricity is not the same as the other-general point of the date, and the operating chamber pressure is reduced, and

= Niu Shi 2 is between the heterogeneous age and the remaining chamber, so that the process chamber towel is exposed to the pre-stress force, which is used to increase the temperature of the workpiece up to the processing temperature, so the workpiece is added in the process chamber. In the-treatment process, at least below the treatment pressure below the preheating pressure, _ after the treatment temperature, 'in the sense, it is less than the A gas pressure, but greater than the pressure value of the pressure of j, which produces an over The working pressure of the most A process chamber pressure, and the use of: the pressure rise rate 'results in not increasing the pressure of the conversion chamber, at least using-part of the extra' process chamber gas, inflow at an input rate. In the continuous financial observation of the present invention, in order to reflect the majority of the workpieces, at least the process = force 'is operated and the first sensitive part is made between the conversion chamber and the process chamber. Thus, in the process chamber, the The workpiece is exposed to a preheating pressure to heat the first workpiece to a processing temperature. Therefore, in the process chamber, the first workpiece is placed in a processing process at least under a processing pressure of small = preheating pressure After almost reaching the processing temperature, in a certain sense, apply j to atmospheric pressure, but the preheating force value greater than the processing pressure produces a maximum impurity pressure exceeding the preheating pressure. By successively operating the turning age pressure and the processing force to process the workpieces, and collectively moving each successive piece of the workpiece between the conversion chamber and the manufacturing difficulties, the pressure rises, and the county is in secret. Under the pressure of this job, 'at least some of the extra process room gas is used, and the flow rate is at a loss rate.纟 —In one feature, most workpieces can be converted and processed simultaneously. ^ In the step-by-step perspective of the present invention, the explanation-bypass configuration is provided as an option to provide pressure communication between the = switch to and the money process chamber, so that the pressure generated between them is equal. Use to pass the workpiece between the conversion room and the process room. In a characteristic of ALICE-D: \ PATENT \ PU-068-0008 8 200535928, the '-tube concept' raises the pressure of the conversion chamber up to the selected value, including the process chamber's processing pressure at a small selected value, and the same Ground is less than-preheating ground, where _: reached a processing temperature. Afterwards, by opening at least the conversion chamber and the process chamber ... backfilling the process chamber, in a sense, it makes the process chamber pressure and the process the same, close to the preheating pressure, as The next use is to force spray the workpiece. In another aspect, the bypass configuration is used to provide a pressure point between the conversion chamber and the process chamber, and the process chamber solves the test force, and does not need to be isolated.

= -In the implementation, at least one workpiece is processed in the-system, according to the overall multi-step process, 'The workpiece is preheated to a processing temperature at the preheating pressure of Spear King to Zhongli, and then in the process room' with- The processing pressure exposes the workpiece to the plasma t, and at least at the processing temperature, 'the processing pressure is less than _ Zhongli, such as listening to money force in the whole process of the shirt copy: ς 中' and determined by the processing pressure Raise, at least to the preheat pressure-point. The system further includes a process gas adjustment configuration, at least when the guard is exposed to the electrical nozzle at a specific flow rate, to provide a process gas to the process chamber, and to provide the process gas at a maximum flow rate, Provide-configure to increase the processing power to the process power, and in the multi-step overall process, 'at least-or-time the pre-delivery force is reached, in order to provide-additional process chamber gas flows in at a flow rate, depending on the process The overall input rate of the room is greater than the maximum. [Embodiment] The description of the order description can enable the production and application of the original skills in this field. It is provided in the context of the special invitation and its essentials. cake. In view of the specific implementation of the various changes described, it will be easy to recognize from these techniques in this field, and ^ Chu Tong _ Ke Ke works in other specific practical towels. Thief, this fortune is not intended to limit the presentation of the mind, body and mind, but conforms to the broadest scope, consistent with the principles and characteristics described here. The intention is that the schema is mixed with scale and is an actual table. Figure -A is -Schematic "In a front view, it is-a semiconductor workpiece process system according to the present invention: a specific embodiment, usually indicated by the reference number (⑹. When the system (10) enters a & amp The system implemented in the present invention will understand that the present invention can be used with various systems, and the implementation of the present drawings is not intended to be a limitation. As can be seen, the present invention can be applied to any New Zealand system with at least Appropriate and at least in the remaining chambers, ALICE-D: \ PATENT \ PU-068-00〇8 9 200535928 has the ability to separate pressure changes. #Of course, between this conversion and control room, it must be aimed at The conversion part will be equipped with the system in accordance with many alternative features, which is consistent with the implementation of the present invention, and it is usually connected to a high raw material capacity platform including, for example, one or more workpieces The use of dual-workpiece process positions and one or more load valves. Consider US Patent No. 6,315,512 as an example, which describes such features and incorporates the entirety thereof as a reference. It will be used in this field A primitive Skills can be easily adapted to a system with: This feature, following the overall disclosure of this application, is used as the practice of the present invention. Special mention is made of similar reference numbers used in similar projects, where possible, throughout this Revealing. Concerning Figure -A, the system (10) includes a conversion room 02), where only a part is displayed, in which a robot (14) is placed. The robot includes an arm (18) and an end effector (paddle) (20) moved by the arm /). For the purpose of this example, it will be explained that the system 2 (ίο) removes a photoresist layer or model (22) from a semiconductor workpiece (30) (thickness is not suspended) The original skills recognized that this system is beneficial to the application of other processes, but it does not concern the chemistries' depletion, atomic layer deposition, and electrical miscellaneous processes. Different pressures are applied at different process points. On the artifact. As mentioned before, for the purpose of this example, a plasma processing chamber having a plasma source ii) is provided. For example, for example, an inductive light plasma source (ICP) source is provided. The plasma source (34) is used to generate a plasma (36), which is used for removing the photoresist side agent. Other suitable plasma sources include, but are not limited to, microwave sources, ECR plasma sources, and capacitive (parallel plate) plasma sources. Special mention is made of the processing chamber or process chamber, It can be expressed as a configuration for storing a workpiece connected to a processing source, for example, a source. Electro-hydraulic to (34) can be used as an example process window to implement plasma. For example, for example: Process pressure: 0.2 to 20 taur (the effect is best when close to 1 taur is found) Private radio frequency power (per workpiece) 500 to 5,000 watts (close to 3, 〇 found) 〇〇w The best effect) Process gas: Partially mixed or all according to the following gas: # 〇2 Flow: 1000-20,000 (the best effect is found when 5,000-10,000sccm) 10 ALICE-D: \ PATENT \ PU-〇 68-O〇〇2005 200535928 • Ar, He, N2 flow: separation or mixing 50-5000sccm (the best effect is found at 500sccm) • H2, D2, HD flow: separation or mixing 1, 00〇_2, 〇〇〇sccm (The effect is best when it is found to be close to 10,000) • Gas formation (4-10% Hr) ·· 1, 〇〇〇-1 5,000sccm (the effect is best when it is found to be close to 10,000) • Hydrogen gas (low molecular weight): For example, CH4, C2H4, C2H6, C3H8, C4H10, etc. Flow 1,000-10,000sccm (CH4 in Near 5,000sccm

The best flow rate effect) Contains carbon halide gas ·· For example CF4, C2F6, C3F8, C4F6, C-C4F8, CHF3, ch2f2, CH3F, C2HF5, C2H2F4, C1CF3, C12CF2, etc.-Flow rate is less than 300sccm • N2O flow: 50- 5000sccm • NH3 flow: 50-5000sccm Remove the photoresist etchant during the drying process. It can be seen that during the plasma exposure, the speed of the light-side agent will increase with the rotation temperature. For example, adding workpieces up to 1 'is expected to be between 15 ° C and 3500c, in order to achieve higher workpiece production.

And there is a description about FIG. A, the workpiece (30) is supported on the carrier (38). This should reach the expected temperature. Due to the forced increase of the temperature of «, its load and the two Γ 'will actually turn the carrier at a temperature of -111. Alternatively, two Vs can be pulled before the overall cycle. Lower window c to boots. The value is close to 30, and the value is 4 or below; in order to comply with the additional Λ Le & Table 8 has an effect, although it can be used lower, caused by. Any suitable slurry can be used and / or the thermal energy limit of the material / device 1 lifter pin (40) disk machine I such as, for example, a suitable roller. Envoy

For the purpose of using the lifter pins to an appropriate position = 1, the actuator (20) and the carrier (38) are placed on top of each other: the workpiece is moved (not shown), and the end is shown to cry (", 2. The unloading pin (40) is in a retracted position (0) retracted into the conversion chamber ⑼, so that the workpiece (30) supports AUCE-D: \ PATENT \ PU-068-0〇08 11 200535928 On the carrier (38).-The passageway ⑼ is defined in the conversion room ⑼ and the process room 如此 '' between such robots (⑷ can be transferred to this part.-Isolation valve ⑼ For example, the use case-vacuum isolation gate valve or gap Valve to choose to completely or partially close the sleeve ⑷), (for example, 'provide pressure communication for balancing purposes between two chambers.) In this example, the compound operation is used to open the valve in that direction ( 44), which is indicated by the arrow (45), has a twist to the right in its transfer of money. In the process chamber, the money-exhaust port (46) manufactures an always empty state 'in cooperation with the appropriate configuration. The direction of the exhaust gas indicated by the arrow Outflow. '

The plasma chamber or grab (34) includes a gas diffuser (50) that receives gas input from the process (52) and a backfill configuration (54). The latter is in-backfill input (56), provide _input = diffuser '⑼', pay special attention to the input ⑼ can be connected with another-"τ" Xijiji, so that the molecular single-lactate input, in order to prevent the double round Demand for human diffuser (5 ()). The term "backfill" is used to describe the situation in which the low pressure is brought to a high pressure, and-initially, the force of the force is passed ^^. Special attention is paid to the design of the diffusion n in the electrical surface (34), which evenly distributes the pressure; 1 reduces the availability of electrical destruction into the gas diffuser (50) and the gas pipeline (52) and 52 lowest. The process gas generally includes a Wei-body mixture, which is beneficial to the electropolymerization. Although the gas can also be introduced by the process gas input (52), it can be used as the workpiece (30) to select a strong and increase the β degree. In this regard, the process gas is controlled by the ㈣ (f flow control relay) 6 ^ section plate between the workpiece and the actual mixing room of the workpiece, which supplies high-precision adjustment gas eyesight of the process gas input in order to control the electric power. Qualities. When the MFC provides such precise control, the flow rate is quite slow. Furthermore, devices such as this MFC are characterized by a maximum flow rate value, which is usually very slow. So ‘recognize that a clear-cut restriction is enforced, and the only thing about this _ is by passing people off. The backfilling of the insomnia leads to (66) successive connections—backfilling the stabilization chamber (68). The detailed volume and operation of the backfill configuration (54) will be provided below:. At present, 'sufficient to find backfill input (56), read (66), backfill chamber ⑽ at the same time ^ connecting pipes, to promote rapid pressure rise in the process chamber ，, for example, from-low "= pressure reaches-higher workpiece The thermal pressure is carried out independently, which is combined with the process gas by j 2). A backfill line ⑺) is guided to the backfill chamber ⑽ by a backfill supply valve (72). An appropriate supply line (74) and-backfill The input link of the supply valve 。. The backfill gas ㈤ is indicated by the —arrow. The paste-pressure sensor monitors the pressure in the backfill chamber (68) 1 AL ^ CE-D: \ PATENT \ PU-068-0 (12 200535928 来 β 儿Before cooperating with the backfill of the supply valve (72), a specified starting pressure can be reached in the backfill chamber. Alternatively, a controlled pressure situation can be ensured in the backfill chamber, and a mass flow can be used The controller (not shown) measures the gas flowing into the backfilling chamber over a known period of time. Cognition In this field, a person with original technology can easily implement this backfilling configuration in view of the overall disclosure. The gas diffuser (79) is placed in the plasma (34) and process chamber (32), for the purpose of increasing the consistency of the process, however, the gas diffuser is not necessary tm °-Dan I 罝, early alone or with the process gas] ^ 1 ^ (6〇) Cooperation, consider the process room ascent rate that can produce more than 15 mm per second. In fact, consider the average ascent rate of more than 15 tau or more per second. ≫ The idea at this stage is related to Figure-B, which graphically Describe a modified system implementation, which is generally indicated by reference number (80). System ⑽) is similar to system ⑽) in Figure _A. ^ No need to backfill configuration ⑼, and use -Single_input Gas thinning is not shown). ^, Description-ground bypass configuration (82), as an option, the pull force is connected between the conversion chamber ⑼ = process chamber 。. The bypass configuration ⑽ includes pipeline ⑽ and-bypass valve ⑽ To do this, donate between the sharp process room and the conversion room, depending on the pressure presenting all the components of (82), so that the two rooms can -n _ rate, implement rapid pressure equalization. In fact, you can test The piety rate winter can be enforced by less than 1 _ and _ Nen Kochi subscription limit, less than 4 seconds. Of course, the needle The change of the same force has been == ::: ================================================================================================================================================================: For example, you can use-pressure sensor and, ^^ control. OR or-blocking valve to communicate with the conversion room.-Intermittent stop ALiCE-D: \ PATENT \ PU-〇68-〇〇0i 13 200535928 Now return to the second diagram and the second report where the system 其中 is used. The second diagram A is connected to 'now will be described-the main model is represented by the reference number (10), and the process chart illustrates the various steps of this model, Normal formula. Pay special attention to the pressure and temperature values of the workpiece relative to the time. Such values ^ are graphical, including the third figure, which illustrates the specific time, and the second figure, except that the following __ = becomes a limitation, and only Presentation for a practical example. The formula (ioia) describes the relative time in the process room (3): the change ΐ shows the change in the temperature of the workpiece relative to time. .) I wish the chamber ⑼ '=: where Γ is called-the processing pressure, and at the same time, ㈣ is marked in the ㈣ ㈣ I "to 10 Taoer and can be 1 Taoer. Initially, a workpiece is removed from the conversion chamber (12) door Kai ^ K32) and placed on the vehicle (38). At the end, if not fully opened, = the separation between the two chambers / _ (44) (as shown by the arrow (56)). Off _ ^^ = =, _ Valve, lift inspection (44) extends above the top surface of the vehicle (assuming that--the lift / extend position). Also regarding the isolation / open valve in the open state, we will talk about the plant, Check the end effector (20) of the machine arm (8), and insert it into the process chamber. After the position of ^ renfeng # to the desired position above the 6h lift, the end effector makes the workpiece (the machine two Placed on the ^ Z axis to control the end effector) to lower on the lift inspection. Then cry the workpiece (on the top of the 20 Γ Λ inspection) 'The robot arm extracts the end action L from the process room to open the door (° 4 ^ ^ _ Choi end a wheel _ fully return chamber, closing the compartment of the movable work surface = 2 = County, New York, having towel technology poured her step (iv), mode shift completion of step (100) (1〇3) T, Said first mesh piece bit ===== = peak), reduce the two - / member / dish degree butoxy 〆 second floor see FIG.) 'Under t〇 time, because the I ... completely before heating temperature rises, -Once the temperature of the workpiece starts to rise from Ding 0, the workpiece is heated with the cutting tool and heating tools, which is between 3 and the thief. The rising: 14 ALICE iD: \ PATENT \ PU-068-0008 200535928 The conversion process of thermal energy transfer from the n Λ body to the button. The next step is to apply the pressure in the process chamber (32), so the plasma chamber (34) quickly moves from P0.

In the third figure, a preheating force of 1V is achieved by adding the gas, which makes the range between 25 and 250 Tao, and can be fully applied to accelerate the heating rate of the workpiece. —Very fast rise 'As shown in the second figure, from 7 to 10 p0 to p1, it can be generated by the use of the second (54) in the time interval of 10 to. It is expected that a preheating pressure of approximately 60 Taur is sufficient and most of the benefits under the force are derived from the improved heating rate, and it is clearly understood that it will be obtained by a force. In other words, explicitly increasing the pressure over time requires more time and lowering the pressure later to reduce production. By opening the return valve (66) ′ in this process chamber so that the pressure rises so quickly that from the backfill storage chamber ⑽), there is a press fabric under a more n pressure. Note that the storage room is usually very close to the process room. In this regard, under a sufficient pressure, a volume of a sufficient gas is made according to the size of the storage chamber (68), so that the process / plasma chamber is combined to the expected pressure. It is worth paying special attention to, as for all the concrete practices here, minimizing the tritium accumulation can directly contribute to the enhancement of the rate of pressure increase. There are at least two ways to implement this rapid pressure rise. The third figure illustrates a backfill equalization technique, in which the backfill pressure is raised in advance, or _selected pressure value & is set (for details, see t of Equation 101b). Based on this pressure value, a part is in the body of the backfill chamber and the process chamber, so that the two chambers are balanced to the preheat pressure & at t1, and then the valve is opened (66). That is, a, the patterns 101 and ⑺ will meet at ^. The backfill valve (66) is closed and then equalized. On the same day, t3 is restored until the pressure in the filling chamber rises to L. When b is shown as 65 Tauer for the convenience of explanation, it can be understood that this value can be measured in many ways and will be explained below, and the use of this value is not expected to be heard. Such as the alternative technology, which is not shown in the third diagram, but it is easily understood from the first A diagram. The backfill pressure can clearly rise to a value higher than the Psei value, so that the backfill chamber always remains high. The value of P1. When the process chamber reaches p], the backfill valve (66) is closed in order to stop the backfilling. That is, once the pressure in the process chamber rises to the pin thermal pressure, the backfill valve (66) is closed. In the technical part, the supply valve (72) can be opened and the backfill valve (66) is closed, and the backfill storage chamber (68) is filled again to a desired pressure. According to various factors including indoor volume and flow rate, the flow rate can produce ALICE-D: \ PATENT \ PU-068-0〇08 15 200535928 2 in fast-changeable technology. 2 Fast-phase pressure rise. In any case, Yunxian—technology, as required in the overall process specification, can be generated in the process room-rapid motion rise. In particular, in the overall process planning, at any point in time, any of these techniques can be applied. When using a backfill room (1, it is expected that the process room will be guided by the industry. Rise. In-actual implementation. It achieves the flow rate of% Tauer per second. It has the best effect from a pressure rise of 15 _ per second to more than 15G _. 104 In step 104,-once the temperature of the cylinder is close to the temperature of the vehicle), fast To reduce the Qinda in the process room-the process is directed to the photoresist side agent Wei side step. The third figure illustrates that from the time t] to the second time. At 't2', the process chamber pressure is rapidly reduced so that the job fire returns to zero. The virial power p0 for the plasma exposure step can be extended from 0 to 10 Tao in a range of motion. This processing piety is reached at t3. Similarly when the temperature of the workpiece is close to the expected relationship with two: f, for example, for example, it is slightly lower than that in i rlfI ^... Electric water to (34). For example, this can be held at a time of two 'f less than one part of the interval, while also including ... 4. Special mention is made of the inducement of this process step, as mentioned, due to the arrival of the π clothing sign, using a fixed time, with the first measurement of ##, the test can be performed first or the combination of the two can be presented. Qian Ke and the two-way ventricular ovum reached the expected processing pressure, which will ignite for the electric convergence-stability_hour: 1, the age network began to rotate to -point, here_, where the stop is at t5 at time = Start: The third figure shows that the temperature of the plasma piece rises slightly in -10 seconds. However, the temperature rise of the red pieces produced by the plasma was minimized during the duration of the plasma exposure by _t5. The use of ') makes the storm in step 108, the ancient μ — the pulp is generated through the Cheng room, ^ 3 to stop Wei ’s pulp from touching, the money used for electricity can be equal, as required == ° _ Cheng room __ between the pressure chamber of the workpiece change chamber and the pressure chamber of the workpiece conversion chamber can open the sakizaki process chamber and the conversion pull away the lifting pickup and lift the reading at the top of the editing tool AUCE-D: \ PATENT \ PU-068 -0i 200535928 on the surface. Gushan 1 in step 110 ', as long as both valves (44) are opened and the lifting bolt (4〇) is opened, w (2〇) can be pulled into the process chamber, and the workpiece is converted back to the conversion chamber ( ⑴. Then step 102 transfers another workpiece into the processing chamber and repeats the above steps.

W and t gas to achieve-fast workpiece heating rate, composed of-one or more of the following gases f, the composition of the composition ㈣_gang workpiece heating rate · Ar, He, H2, D2, HD, HF, 〇2, N, ΜΗ, A κ ru ^ 3 N2 0 '-a low molecular weight hydrocarbon gas (example e;;: 2H4'C2H6'QH8' ^ C1CP Sept,?; C'C4Fs' CHF3'C2HF2'CH ^ 'c2hp5 ^ c2h2f4. The rate U 2 π uses a specific gas environment to accelerate the heating and / or cooling of the workpiece at a rate of 1 to preheat the gas'. One of the benefits of this paste. At a low time, at the same time In order to increase the number of workpieces that can be produced per hour, the preheating effect of the workpiece should be recognized. It can be used to enhance the cooling interval, as described below. Li Tong (: 回 Γ 士) Figures 4 and 5 are related to Figure -A. A second model can be explained in detail. Figure 4 is a flowchart showing the rh test numbers (200) of this model. The three pictures are == __ formula. —Scheme ⑽) illustrates the process room (32 2 and == 日 ΓΓ) said _room (68) on time and time _ response, and a diagram (204) states the workpiece temperature Correspondence of time. In this second p, f, the conversion chamber (12) is continuously operated in a continuous manner. Before the plasma exposure in the pre-, cha, and cha-li, it is used in the process chamber for 0 times, during the workpiece heating period. Fully described in the above example, for example, to give some ideas on the a_k and material two models to complete the cooperation, and _ this M can be, the purpose of private * ugly temporary. Moreover, 'should understand this material, while still = ==== Following each other's peer-to-peer r: _) operation === 's. The process chamber (plan, while the workpiece is placed on the carrier (38) from the conversion chamber (12) to the combat equipment (38). When the process chamber is completely in ALiCE-D: \ PATEN-RPU-068 -0008 17 200535928 When its #near the carrier (38) under thermal pressure, the workpiece will undergo an -enhancement effect, and then descend on the carrier. Therefore, the workpiece temperature rises from τ at time t0. Time ㈣ τ2. In step 208, 'About the workpiece reached the processing temperature D2 at time h, reduce the pressure in the process chamber (32)' from Pa to the processing temperature & In this example, the Achieved in time. _ The aforementioned pre-reduction mixture, as mentioned, can be used in both the conversion room and the process room at the same time, for reasons of reading and not yet described. In other cases, with a diffuser ⑼, appropriate Introduce these gases into the process chamber. In order to complete the workpiece ^ preheating purpose, Saki enhances the temperature from ㈣t2, the rate of rise, for a certain kind of wire, this time interval is short.… In step WO, the plasma After the gas is introduced into the process chamber and the plasma is ignited, it is produced at P0. The chamber (32) starts plasma exposure at the time. The duration of the exposure of the plasma is up to ^. Then the plasma gas introduction is stopped. Step 212 is completed to raise the process chamber pressure to P !, which can be performed by using the preheated gas mixture and ^ «The Xuan workpiece is lifted from the carrier (38). As mentioned, the backfill configuration (54) can be used to execute-rapid pressure rise, as explained below. In particular, in the process chamber pressure scheme (applied), The pressure rises from U to P within the time of U t6. During this time, the pressure in the backfill chamber S (202b) decreases. Then the pressure in this section of the backfill chamber decreases, and the backfill valve (66) closes. As shown in the figure (dove), before ^, the expected dust force of & or higher can be stored in the backfill chamber. The ground pressure can obviously increase the backfill chamber pressure higher than ~, so the backfill chamber material is often Pressure higher than Pl. In this case, the main difference in the backfilling force scheme (202b) is the pressure above Rise & not only provides—a steeper whistle and = a linear rise in force, from ΜΡι, As steeper as the diagram (overhang), it slides more linearly from From Pi to Pi. Moreover, at time t6, the patterns (202a) and (202b) will not be merged asymptotically, but they are often close to like a linear slope function. In addition, a fine-fill configuration can be used to guide The pre-decreased mixture can be customized to be mixed with other gases in the process chamber to produce a desired gas mixture. Then according to step 214, the workpiece is transferred from the process chamber (32) to the conversion under the preheat pressure. Room (12). The system mentioned that due to its exposure to the preheating dust, it will enhance the cooling of the ALICE-D: \ PATENT \ PU-〇68-〇〇〇8 18 200535928 pieces. Lai Zai, and can be cooled in this way, before leaving the conversion chamber (] 2), go to = conversion chamber. Calculate the cooling effect of the workpiece, and even + i xi 30 additional C. Can help each other on this hot part. Xie Keming and the compound are cooling the workpiece and the additive. Through the cooling of _ = force = ^ pieces to provide a higher degree of elasticity to cool the red pieces, ^ pass "4 pieces of cold material rate, such as ambiguity-the expected person passes from the ΛΛβ pieces ^ which pass and leave the conversion room . Furthermore, ’A but, θ compound = provides a chance to determine the average cooling capacity of the cooling parameter ~

When the S conversion room and the process room are at the same time, (216) the process room while repeating the foregoing sequence. ^ With regard to the fifth and sixth figures, the present description—the third mode, the first system (80) can be used. In this third mode, the conversion room (, 龅, to reduce the setpoint value Pse, that is, to operate in the whole; = ^ = MFCM) is used to raise the conversion room to the setpoint value. System "two materials _ force concept, _ the remaining room, there is no second mode equal on this #, = two shows the situation (sche) and (employment) in the fifth figure. That is, the process to check It is presented by _ formula (2G2a), and the shop change room _ style (pass) is presented, and the description of the steps will be given. The sixth figure shows various steps, which constitute the third mode, usually by the parameter (300 ). Pay attention again to some views of this mode, which are fully described in the above example, for example, the use of 'lifting inspection (40) and actuator arm ⑽, and for short-term purposes, do not circulate the isolation valve (44 ). ^ Mention -B again, the spirit of this third mode is to use the set pressure in the conversion room 'backfill the process room in a sense ⑶) in order to make the process room and the conversion room equal , At least close to the preheating pressure. That is, the process chamber pressure rises from the processing pressure to the preheating pressure P1, and the pressure in the conversion chamber (12) falls from the set pressure to the preheating pressure P]. Because the backfill of the first A diagram The chamber (68) can be used in this way. As mentioned above, The same applies to the measurement of the set pressure in the backfill chamber. When the aforementioned backfill technology is used, a suitable value can be determined for the set pressure, at least a favorable approximation. If the pressure used for preheating is greater than the pressure used in plasma treatment (replace In other words, Pl >> p〇), for example, for a single ALICE-D: \ PATENT \ PU-068-0008 19 200535928 Think of the gas according to the wave's law · C 1) Psel Vtc ^ py 1 v The volume of tot and the fine stress of ㈣1 are the most mechanical forces in the conversion chamber (ie, the combined volume of the outside process chamber. Pay particular attention to any contribution in this process chamber, for example, under i Taoer '), in order to simplify Purpose can be ignored, and-Zheng La should set the value

Na 25 fine __ force, of which 65 Taoer to 10 嶋 version of τ, need to shoot 1 _ at this component force _ is-typical surface force. In terms of implementation, increase the pressure in the process chamber, and increase the pressure in the rapid addition, ^ alone near Jin Tao, if the volume ratio of the gas environment is 10 times more than this, the The pressure is set to 65 Taoer, so: Intro:: Taoer ^: __ 'The pressure between the two chambers is resistant' ..., the proportion of the difference in the gas environment between Λ and Λ and the needle parts in the process chamber Heat Na, f should not rely on the force, only the conversion room. The higher set pressure and larger volume of the 16 gas% conversion is used "quickly, raised in the system" to reach the expected preheat pressure, as the rapid heating of the 111 pieces. Of course this The discussion here is equally applicable to the number of the backfill chamber (68) in the first figure. In the next paragraph, the technology of the backfill homogenization.: Regarding the first figure B and the fifth figure, it is consistent with most of the workpieces that are processed. As can be seen, it is initially assumed in step 304 that the conversion chamber and the process chamber (32) are equal to the preheating pressure P1 and a workpiece is located at the processing position in the process chamber. Therefore, the isolation valve (44) and the The bypass (86) is closed and the workpiece (30) is preheated at a temperature of T0 at time t0, and reaches a temperature of Ding 2 at time t2. Month 'J proceeds to step 306. Once the valve is closed, the processing chamber (12 ) Returns to the set pressure psd. Again, the pattern of the pressure in the conversion chamber is similar to that of the backfill chamber pattern (202b) in Figure 5. ° These are the same, at least from a practical point of view , If the volume of the backfill chamber and the volume of the conversion chamber are close to the flow velocity Although this non-essential condition and many modifications can be made by those skilled in the field 20 ALICE-D: \ PATENT \ PU-068-0008 200535928, #is disclosed here as a whole. However, for the sake of brevity, we will It is assumed that the graph (2G2b) in the fifth figure shows the change in the pressure of the conversion chamber over the entire period of time. Therefore, starting soon after to and using MFC (92) to make the conversion chamber at a suitable rate, This recording compression can be performed, and closed at any appropriate time :, ▲ It must be changed to reach the set value before the 4 process chamber needs to be raised from the processing pressure to the preheating pressure ...

… The workpiece reaches the processing temperature within the relevant time limit. The drawing (Shi) in the fifth figure illustrates the force (step 3G8) from time P1 to time ㈣p. reduce. With the decrease of the exhausting force, the response at the exit of the 适 # is light on the pump side, which is not shown in this figure, but can be represented by the exhaust gas outlet (46) in the first Α diagram. Within the relevant time limit, the process chamber (32) reaches p0, as described below. In the step, you can hit Wei Jie with one person, one person, and one person, and start the removal of light. This unloading interval operates until time t5 in the fifth figure. Action Secret = 'About the termination of the removal interval within the time limit in step 312, backfilled by plasma gas flow [202 U' Processing chamber (32) from the conversion chamber 〇2) 'so that the pressure graph in the processing chamber ^ a' Generates a rapid rise in pre-key forces from everywhere. This yf force rises to reach the preheating pressure at t6 in the day after 202 ° 3. The pressure map generated in the process chamber pressure drop ^ ^ pressure rise 'response in the switch room pressure scheme (2G2b) from ~ to ρ /, and then appear from u t6. It should be considered that the increase of female power is the first: == 己 = must conform-the other one (82) is explicitly configured for this purpose. That is, export, two. Need "2 valves (86) are all manufactured in accordance with the size, and the rate of this flow will not be" any limit is greater than 1 = conduit '. When the length of the conduit includes any time between them, the person who will skill will be revealed here_ 2 Stop reading flow. One in this field is considered to have original settings. Demystifying "No output and the point of view of conveying, the ability to implement the bypass distribution system = medium :: 2 = 2 will depend on the relative volume of the conversion chamber and process chamber.

The configuration of the backfill chamber in the figure is achievable, which is equal to or greater than that of the -A meaning that the bypass configuration. Jian ΓΓ because of the higher conductivity transmission and components. The special note and the position of the vacuum pump exit are displayed in these various patterns. Naturally, ALICE-D: \ PATENT \ PU.〇68.〇〇〇8 21 200535928 is shown in a graph, but Ke Jian is _. Moreover, Ling Wei ^ the device of visual choice. That is, the assembleable isolation valve (44) conforms to the expected flow rate. As still another alternative example, the backfill flow_distribution can be provided in combination with the bypass configuration and the partition. As a consequence of the higher flow rates, during this backfilling step, considerations are provided to avoid particle introduction and / or obstruction, as with any other high-speed flow step. Therefore, the σ position, static and can be assembled in this way. In step 314, the processing workpiece is removed from the processing chamber (32), and another workpiece is moved from the conversion chamber to the processing position in the processing chamber (32). 、 / About Figures-Α and -Β® 'Many modes have been described, the most representative systems (1G) and ⑽) can be operated, and the description of the operation of lifting and lowering will be further described: should be recognized The preheating effect is completed by the ascent, descent, or combination of the lifting pickup. Such a combination includes, for example, the combination of “(starting lifting and lowering, then lifting and lowering). For the ^ process step 'lifting and loosening, then lifting and lowering, and then the combination of lifting and rising, reads ascending and falling. Combination, or for a subsequent process step, the combination of lifting and lowering the riser, then the combination of rising and falling, and then the lifting and lowering of the combination. Therefore, it is expected-broad adaptability 'about the use of the lifting bolt. This particular choice can be made by the The pre-process agency job. Lion can allow Koca to achieve side effects. Ying Ke can realize that during the rapid change of the work, 'lifting the lifting bolt (selecting the workpiece) can reduce the workpiece in the workpiece branch. Structural movement (displacement of its position). When the combination of the hoisting and lowering of the hoisting and lowering bolt can be _ should be secreted in-process room towel-a single piece of mad piece, designed to produce-separate work piece 'or directed-process room design to correspond and / Or continuously combine to process two or more workpieces. Note the current description of the seventh figure—the system is manufactured according to the present invention and is generally represented by the reference number (). The system is similar, except for its use, except for = process platform. Therefore,-"a" is appended to the reference number, which indicates the combination with the-process platform, and-'V' is appended to the reference number , Indicates the combination with the second process platform. The process platform is located within the range of the shared process room (32,), so that the two workpieces are exposed to the phase environment. Therefore, as mentioned above, it depends on the system (10) And i) can be applied to the system i) in the same way, except that the workpieces can be processed in pairs in order to increase the system throughput. It is also said that at 8 o'clock, the shaft is provided when the shaft is not required. ALICE-D: \ PATENTAPU-068-0008 22 200535928 Fill and bypass configuration. The present invention is explained in detail in the foregoing, and it should be recognized that the manufacturing process of a series of workpieces: the moon door is in Weishui to never need to increase the pressure of the process chamber, which exceeds the pressure for preheating. It is thought that such silk will see low-purity production. 0 This completely avoids using any higher force (higher than the pre-display force) in the process chamber. Moreover, it is usually possible to complete the change of the reading force very quickly so that it is between the preheating and the processing force, regardless of whether the simple force is up or down. In particular, the use of a backfill method from any backfill storage configuration and / or the use of backfill from the conversion chamber is very beneficial to the conversion chamber pressure from the processing pressure to the

Lithium I is heated together under this preheating pressure, and it is expected that the yield will increase depending on the processing time. Furthermore, any desired combination can be used, from a backfill storage room and from a conversion room = back to the red process, carving-continuous or corresponding manner, this should be the backfill source. The description of the 932 patent—the AVA system—is expected to minimize capital losses. It is believed that the present invention provides many advantages beyond the use of a single system. For example, the system can enhance the system's processing of each piece of work by means of recovery, or partly excessively high demand. The present invention is transferred to a process chamber or a similar process to a mid-removal process under the reliance force, which is under or below the preheating pressure of the workpiece, thereby reducing a number of pressure changes, as indicated by the method of the '932 patent. Furthermore, as mentioned above, this application provides customization of the cooling effect when the workpiece returns to the conversion chamber. I hate it because of the lack of previous technical cognition, and I get a lot of inspiration here. From this process, "spear to -Hai warm-up power" can be raised to the process room forever, very quickly. 2. Force. Furthermore, regarding the pressure change provided by the overall process planning, the present invention provides-succinct and method 'including backfilling Gu'. In a sense, it is impossible to understand at least the following statement from the prior art Can be made possible from the previous description. 1. A method in which the process is treated as at least one workpiece 2 The system has at least a conversion room and a process room, so the conversion room in the conversion room The pressure in the process chamber in the process chamber can be individually changed, and the workpiece can be moved to the conversion = and. Between the Haiyi process chamber 'the system further includes-process gas adjustment configuration, at least-after the electric water treatment The needle provides the process gas to the process chamber at a specific flow rate, which can provide the process gas at a maximum flow rate of ALICE-D: \ PATENT \ PU-〇68-〇〇〇8 23 200535928. A method includes: A) balance the nothing Wing force and the process Qianlida—additional force components are added to a plasma treatment process; the job is performed at 5b; b) the workpiece is transferred from the conversion chamber to the process chamber under repeated processing forces; (Qin) At the same time, the rise of the surface at the same time, the system is raised, ",,,, and so on, without the help of the work force d) to reduce the process room to reach the processing capacity, the simultaneous process. At a temperature close to the processing temperature and the processing temperature, the method is exposed to the electric treatment. The method according to item 1 of the patent application scope, wherein the pressure rise rate is at least θ 3 per second. For example, if you apply for the method of enveloping item 1 in its entirety, the worker will use the electric | treatment process to remove it together with the preheating and exposure effects: 4, such as the middle class Lee Fan HI item 3 The method, at the processing temperature, in which the unreasonable over-generating-plasma is customized for removing the photoresist residual etching layer from the substrate. The method of claiming item 1 of the patent scope, wherein the workpiece is supported by a carrier, and includes heating the carrier to preheat the workpiece. Up to-at least 6. The method of the patent scope of item 5, wherein the heating effect includes heating the carrier Tao's _ such as the method of the patent scope of the first item, wherein the processing pressure is between _ to Sichuan 8. The method of patent scope w, wherein the treatment pressure is 1 tau. The No. 1 method, in which the pregnant pressure is between 25 and 10. The method in item 1 of the patent application range, wherein the preheating pressure is at least 60 Tao. π · The method of item 丨 in the application range, wherein the preheating effect includes directing ALICE-D: \ PATENTAPU-068-0008 24 200535928 gas mixture 7 into the process chamber to enhance the temperature rise rate of the workpiece . 12. Preheat the gas mixture as described in section u of the patent application. The use of helium as a minimum to select and use the method, including assembling a backfill storage configuration, using flow to select the generation of gas :: add in the borrow = into the additional process room input includes, use from The === pieces of the backfill storage configuration and increase the process chamber's willingness to reach the pre-bond force. 1. Use the line body to enter the axis and backfill the process body. -14 · ^ Declares the method of the patented car siege U item, in which the backfill function includes the use of, = _ additional process chamber gas input flow ^ processing process, body Health— «, enters the process chamber as the electrical process gas. The expanded state is used to further guide the system16. For example, item 13 of the scope of the patent application includes a backfill storage and a back-to-back Wei storage;-= matching fill storage configuration, in other words Under the circumstances, the process chamber Γ will be backfilled, and the storage chamber order will be backfilled. In other words, the processing temperature is selected as the processing temperature and used as the next step. The workpiece was heated during the W cylinder up to -18. If the 13th backfill in the scope of the patent application is repeatedly filled with the process room, the selected value in the storage room = = __ and 1 Lu Dong hates to violate. Select a threshold value, in other words, far less than the degree: in the sense of filling, which makes the backfilling force and the processing room === storage room 'is some kind of next step used to enhance the heating rate of the workpiece The force is at least equal to the preheating and repetitive force. As the item 18 of the patent application scope, the instrument provides at least no process gas during the backfilling period. ^ Process gas adjustment configuration, see the method as described in item 13 of the patent application range, wherein the dust ALJCE-D: \ PATENT \ PU-068-0008 200535928 in the process chamber rises in the range of 15 to per second 150 Taoer Q 21. If the patent application scope of the 13th chamber, the pressure rise rate reaches 30_ per second. ~ The method including processing the first item of the patent scope of each cow during the process, including the method according to steps ⑴ to--the same method, the first method of the patent scope, including the process according to the steps ⑴ to ⑷ The pressure of the process chamber in the room can be long and white, and the book is set to the seat knife and between the senior and the senior side and the process chamber II = :: = Process gas processing is willing to set at least to control the process chamber! Force, reducing the cost of the process. Lida _ Lai workpieces were added to the Wei processing ship, and the force of the process room was increased to set the preheat pressure higher than the processing temperature. At the same time, the result was no improvement. Under the condition of the conversion chamber, the gas input flow to the :::::: chamber is caused to flow into the process chamber, and the process chamber is relied on the work material-processing temperature, and the conversion of the rising and remaining _ to === preheating pressure 'Using the first configuration and the residual force, the pressure can be reduced, so that the pressure in the process chamber can be reduced to the point where the pulp is processed. V. Under the force processing temperature, the workpiece is exposed to the device of the second item of the patent application range, such as the device of the patent application, wherein the pressure rise rate is at least every 'Among them, the range of the processing pressure is 27. The device according to item 24 of the scope of the patent No. 4, wherein the processing pressure is 1 Tauer. i-D: \ PATENT \ PU-〇68-〇〇〇8 26 200535928 25 to 25 = 24 purchases of ten losers, delete force _ between 29. As shown in the patent application section. 24-month device 'is assembled to simultaneously process a pair of processing-series work-month patents for the siege of 24 items, including a device for storing the configuration according to steps (a) to (e) to select the ϋϋΐζ item The first configuration includes-backfilling the additional process room clock with a low flow rate, which is based on the selection of the fine filling effect. The private pressure is from the processing pressure to the pre-heated diffuser to guide the additional 2 units, where the backfill configuration includes-gas magic, such as applying for a patent == flowing into the process chamber. The generator is used to generate plasma, as the clothes, where the process chamber includes a plasma to produce the gas, 4 ===== Qi Qingcheng gas and greater than the pre-delivery force, it backfills the system = Sub y backfill gas, in other words, when a back force backfill storage channel applies for the device in the scope of patent application No. 34, which includes a control configuration, where: η causes phase filling and contact with surface force τ at- Alas, when the rising force reaches a selected force, the force of the work piece is also smaller than the preheating force. The door is dry, and the temperature is equal to the degree. Then, the dust is connected to the process chamber for storage. ㈣Filling the process chamber, in the sense of the meaning, it makes the return force and the place ^ to day force scale reach the pre-delivery force, as the next step to increase the heating speed of the workpiece ^ 6 · ^ application, patent装置 In the device of item 35, during the fine filling of the towel, the process rolling body adjustment configuration provides at least no process gas. 37 · A method for processing at least one workpiece in a system with v-transition to and ㈣-to, so that the transition chamber pressure in the transition chamber and the ALICE-D: \ P ATENT \ PU -068-0008 27 200535928 ^ The chambers are individually controlled and can move workpieces to the conversion chamber and the process chamber with a specific m = :: process gas · configuration'at least in the process of plasma processing,- Fang: = Rolling body far away process chamber 'and it can process the chamber force at the maximum flow rate, and move the workpiece to the conversion chamber and the temperature in concert, so that the workpiece is added to the process chamber— The treatment process is less than bamboo " In other words, after making it reach the treatment temperature,-the treatment force is in a sense that 'they produce a maximum force which does not exceed the pre-clock force'. The value of the preheating pressure and the use of __ in the process room. Butterfly surface force, bowl rise '= emotional, the basin part with-input flow rate, using an additional process room gas input flow eight, to reach the overall input of the process room The rate is greater than this maximum flow rate. At least for the method of patenting Gu Item 37, in which the rate of movement rises per second, wherein the operation process includes the conversion 'wherein the operation process includes the 39. As the method of patent application No. 37, the method chamber pressure is maintained at This process is under pressure. 40. The method according to item 37 of the scope of patent application The pressure in the switching chamber is maintained at this preheating pressure. 41 · Configurations' In a system, used to process at least one workpiece according to a multi-step overall process, the pre-processing chamber towel is used to preheat the workpiece to a processing temperature, and thereafter, in the In the process $, the processing pressure is exposed to the plasma, and at least close to the processing temperature, the processing pressure is less than the pressure, so during the multi-step overall process, at one or more points, the The pressure in the process chamber must rise from the processing pressure to at least the preheating pressure. The reduction step includes a process gas adjustment configuration, at least when the workpiece is exposed to the electric chamber, at a specific flow rate to provide the reduction. It reaches the process chamber and can provide the process gas at a maximum flow rate, and is configured to form part of the system. The configuration includes: a configuration to increase the pressure of the process chamber, and from the processing in the multi-step overall process The pressure is increased at least to the preheating pressure by providing an additional process chamber gas at an input flow rate: ALICE-D: \ PATENT \ PU-068-0008 28 200535928 more than the The maximum flow rate. In the process room, the age-changing towel is converted into money and in this = to, "the work can be changed individually" and the workpiece can be moved to the conversion room and between, and the workpiece is heated under-preheating pressure to-processed in a processing process That is, if a processing temperature is lower than the preheating temperature, the process is purchased, and a backfiller is selected for material-backfilling, where the landfill configuration includes-the water part of the gas expansion gas. Lai Li and the gas expansion milk distribution guide the plasma gas into the process chamber. The backfill storage 45 uses the device in the 42nd patent scope, where the backfill storage configuration includes a pre-display force, return to Zit. 'Storing a backfill gas, in other words, the backfill pressure is greater than the second in the storage chamber. Including-the control is configured in the backfill storage saying that when the force at the place is less than 2 = the force, the process chamber' rises to-the selected value, in other words stored in, _ The value of 1% of the force of the collapsed company is placed by the backfill, etc., to the small and second process chambers, in a sense, the backfill pressure and the processing chamber pressure are made to __force, as The next step is used to enhance the heating rate of the workpiece. There is at least -4 L = method 'in a system' for processing at least one workpiece, the system has a process chamber, a process chamber, a transition chamber m in the transition chamber, and the force in the transition chamber. Move the workpiece to the conversion chamber and the process chamber in one pull and two steps. The process gas adjustment configuration 'at least during-the plasma processing process for the process gas to reach the process chamber' can be added at the maximum flow rate. Pressure of the room and the manufacturing process—the work force, where the worker ALICE-D: \ PATENT \ PU-068-0008 29 200535928 b) collectively balance the dust in the conversion room and the piece reaching the processing room; To the pressure, transfer the worker from the conversion room C) Under the process room, use the Laiqin Φ to reduce the process room to the place — # 达 — processing temperature;; the processing room, while the conversion room is still at least the Thermal pressure e) at least close to the processing pressure and the processing process; at a degree, the workpiece is exposed to the plasma; f) at a pressure increase rate, the small portion is increased by the-input flow rate, additional processes Pressure, as a result, the overall input flow rate to the process chamber is greater than the maximum flow rate At the same time, it recognizes the flow to make it reach the system g) to jointly improve the process power, from the system -47 ° seconds 15 Taoer. Eighth ° ° pressure rise rate at least every time as received in the scope of the patent application No. 47 The method is to select the pressure that is in communication with the process chamber, and select the liter to be used in the process chamber, and increase the process chamber pressure to the processing pressure at the rate of _force rise to the processing pressure = force on the backfill storage detail.胄 程 胄 赖 职 勤. ^ Using 50. The method as described in the scope of patent application No. 49, in which the backfill storage-backfill storage is assembled and including back pressure in the backfill storage room under pressure-that is, when the pressure is greater than the target pressure Then, the process chamber will be backfilled. The "Nisshen hole body" is also the method of the item %% of the patent scope, in which the backfill effect makes the recovery force stored in the backhaul and the process chamber under the processing pressure rise to the selected value, The processing pressure is smaller than the pre-display force when the side is selected. The temperature is processed in Wei heating cylinders, and then the pressure chamber is connected to the service room for backfill storage. In a sense, it makes the two pressures and The processing chamber is pressure balanced to at least Preheating pressure, as the next - the step of using a heating rate in the workpiece. S ^ 52. The method of claim 49, wherein the backfilling effect includes directing a rate of pressure rise in the process chamber so that it ranges from 10 to 15 Taos per second. 53. The method of applying scope 47 items, in which the photoresistor side of the workpiece branch ALICE-D: \ PATENT \ PU-068-0 (30 200535928 ^ where the preheating and exposure steps are assembled, and the plasma The photoresist residue is collectively removed during the process. 54. The method according to item 53 of the patent application scope, wherein the electric paddle is customized to remove the photoresist layer from the substrate at the processing temperature. Wang — 55 The method of claiming the scope of the patent, the guard piece is: it also includes heating the carrier to preheat the workpiece. Holding a fork, the method of reaching the scope of the scope of ==== 55, of which The heating action includes heating the planted Bel-Tauer I !; the method of claim 47 in the patent scope, wherein the preheating pressure is between M to 60. 58, such as the method of the scope of patent application 47, wherein the preheating pressure At least the method of applying the 47th patent scope of Tao Tao and Ren Eryi, in which the preheating effect includes the introduction of a pre -... reading into the job room to match the reading temperature. Preheating gas ca 59 # Law, Bao Shi-detailed part of the theory-the method of applying for the 47th scope of the patent application of Gong Erniu, including Steps ⑷ to ⑻ are at the same time in the series of workpieces 62. · If the method of scope 47 of the patent application includes processing according to steps ⑷ to ―-there is at least a method, in one Wei, for processing at least one workpiece, the system has ttr? Processing chamber 'so that the switching chamber in the switching chamber and repeated forces in the = to process chamber can be individually changed, and the workpiece can be moved between the switching chamber and between, a method includes ... 1 to a) Isolate from the process chamber with a force, change the dust force of the conversion chamber to a selected value, and p is greater than the preheating force, and heat the workpiece there to a processing temperature; b) Initially separate from the process chamber At least under the treatment force lower than the preheating pressure, balance the coughing force of the process chamber, so that the back force fills the process chamber at least to the pre-ALICE-D: \ PATENT \ PU-068-0008 31 200535928 process Chamber 0 jointly balances the pressure to the preheating pressure, moves the workpiece from the conversion chamber to the process d) brews the workpiece to the processing temperature with the pre-clock force under the process chamber; and e) reduces the process The force of the chamber M is up to the force of the force. From this conversion chamber, the force = force isolation; At least close to the force of the place and the processing temperature, the workpiece is exposed to the plasma. 64. If the method of the patent application No. 63, the method further includes the step of isolating the conversion chamber and the fabric After the period of time, the process chamber will rise from the pre-clockwise force to the conversion chamber to reach the selected value; after the part is exposed to the problem, the remaining chamber will reach the pressure, and at the same time as the selected dust force value In the conversion room, the balance between the conversion room and the system is balanced again, so that the pressure value makes the weaving _ lai preheating force · the processing sr processing pressure converts the workpiece to the transfer room, and work together to balance the conversion room Pressure and 65. The method of claim 64, further comprising: J) After rebalancing, repeat steps (c) to 步骤 for at least one additional workpiece. Paste P66 · As in the method of applying for the scope of patent No. 63, one of the isolation valves chooses to provide pressure communication between the process chambers, and the balancing effect includes opening the isolation valve while moving the workpiece through the isolation valve . Baishi 67 · If the method of the scope of application for patent M, a bypass configuration selectively provides = miscellaneous exchange $ and the pressure connection of the process chamber, so that between the balanced side and an isolation conversion chamber and the process chamber 'Provided at least to move the workpiece, between the transition to and the process room. 68. The method of claim 63 of the patent scope includes selecting the preset pressure as the basis, at least part of the process chamber pressure in the process chamber and a conversion chamber dust force in the conversion chamber. I 69 • -configuration 'in a system for processing at least one work piece, the system is equipped with a ... to and a process room' so the dust in the conversion room in the conversion room and in the clothing Lai Cheng room movement can be changed individually, and the reading can be moved between the conversion room and the process room ALICE-D: \ PATENT \ PU-068-0008 32 200535928, a configuration includes: a first-configuration to change the Switching chamber pressure, from the pressure value of the preheating pressure of the process, at least in Weijia _ turn up to _ processing temperature: == the use of the Caiheng conversion chamber and the process chamber and the initial-less than = processing pressure The process room, so under the hot pressure, the pressure is backfilled by the system = to 0 70. If the device in the scope of patent application 69, including an isolation valve, through the

The _movement in the change chamber and the process chamber, and the assembly options provide pressure communication between the switch chamber and the process to as a pressure balance. 71 · If one of the devices in the scope of patent application 69 is used, one of the bypass configurations chooses to provide the pressure communication between the conversion room and the process room, so as to use the balance and-the isolation room is between 5 hrs and the travel room U is less provided. As the workpiece moves between the miscellaneous chambers. In a system, it is used to process at least one workpiece. The system has a conversion chamber and a process chamber, so the relay pressure in the conversion chamber and the process chamber pressure in the processing chamber. The workpieces can be individually moved and the workpiece can be moved between the conversion chamber and the process chamber. A method includes: operating at least the process chamber pressure and cooperatively moving the workpiece between the conversion chamber and the process chamber, and so on The workpiece is exposed to a pre-clock force in the process chamber to heat the workpiece to a processing temperature, so that the workpiece is applied to the processing process in the process chamber, at least under the processing pressure. In a word, after it reaches the processing temperature, the processing pressure is less than the pre-display force. For a certain type of wire, it produces a maximum process chamber pressure that exceeds the Gu Ding force and is less than the large pre-force value. But it is greater than the processing pressure, and the operation process includes increasing the conversion pressure to the threshold value, and then the clock force communicates between the conversion room and the process room. Vigor, in a sense Beer which process chamber, so that continued force of the return journey from the chamber sense SITA treatment pressure to the preheating pressure. 73. The device according to item 72 of the scope of patent application, including initiating the movement of the workpiece between the transition to and the 4 & to 'have_ conversion money power is reduced between the selected value and the pre-ALICE-D : \ PATENT \ PU-068-0008 33 200535928 Within this range between thermal ink power. In the conversion room and the option to provide the intermediary room, ~ = ::: = 75 · — a method using a conversion room with at least one conversion room and the number = cow 'so shot in the conversion room and in the The process control in the process room 'can move each jade piece between the conversion room and the process room. The system includes a simplified configuration of the system, at least one plasma processing_; two = 1 process gas to the Process room, which can provide the ^ t 'change room at a maximum flow rate and reduce the strength of the process room, and work hard—the broken shaft to the turn six times and four rooms', so it should be in the process room. The first workpiece is exposed to the pre-pressing pressure at two pieces to the processing temperature, so that the workpiece is applied to the process in the process chamber under the processing pressure, in other words to bring it to the processing temperature. 1 pressure = reason: the force is less than the preheating pressure, in a sense, it produces a maximum process force that does not exceed the preheating time, which is less than the pre-bonding force value of the airtime, and is in the process = In the application-the rate of increase in pressure is used to deal with the pressure of the bridal force, and the shirt will improve the force of the conversion room. At least partially - input flow rate, use of additional process chamber gas _ input flow, which makes the overall input rate reaches the process chamber is greater than the maximum flow rate. 76. The method according to item 75 of the patent application scope, further comprising: by continuously operating the conversion chamber force and the process chamber force, processing the next majority of cattle and the same work to make the next work of β Xuan The movement is between the conversion room and the process room: so that most of the subsequent fields are exposed to the preheating pressure in the process room for wire-feeding-the next time the worker parts reach the domain temperature, so At least under the processing pressure, the processing chamber towel applies the subsequent workpieces to the processing process, and at least in this way reaches the preheating pressure value of the processing temperature X utilization at atmospheric pressure, and generates a pressure that does not exceed the preheating pressure. Maximum process chamber pressure. 77. Method 75 of the scope of patent application, where operation_ includes the conversion ALICE-D: \ PATENT \ PU-068-0008 34 200535928 to maintain the pressure at least at the processing pressure while processing the majority of the workpiece. Xun Ru applied for a method with a scope of 75 items, in which the operating room was maintained at least at the τ number of workpieces. This method was converted to the method for processing item 75 of the scope of the patent application, including adding a large number of the workpieces to the workpiece at the same time. The method 'completely has the pure processing of at least the conversion chamber and the process chamber. The conversion power in each chamber and the pressure of the process chamber in the process chamber are used. Move between the conversion room and the process room and the double-pass room air force, and work together to move the workpiece between the conversion room and U to, so that the red part of the cap in the process room is exposed to _ job pressure = heat Mother-squat " " processing temperature, so in the process room, the workpiece is added to-processing less than-under the work force, in other words woven after making Lang Wei Li Wenshu, a-=, _ Force, in a sense, it generates a force that does not exceed the preheating dust force, 'uses a preheating pressure value that is less than atmospheric pressure, and the operation process includes only the objective of the mother-workpiece, the pressure should be turned Age, between _ 敎 pressure and the pre-pressure 2, the pressure cycle at least Points due to the establishment of communication between the power chamber and the conversion of the process chamber, so the use of the selected backfill the process chamber pressure. Using the method of J1 · M material to enclose the 80th item, including reducing the movement of the workpiece between the transitions and the transition between 'the pressure of the transition chamber is between the selected value and the preheating pressure. Within that range. τμ 82.-a configuration 'using a system with at least one conversion chamber and a process chamber to process more than two cows' so that the pressure of the conversion chamber in the conversion chamber and the pressure I of the process chamber in the processing chamber each vary' and The reading can be transmitted between the Qianlai room and the miscellaneous process room.-The configuration includes:-the bypass configuration is used to select and provide the pressure connection between the conversion room and the process room as the pressure in between. Balance without using the isolation valve. 83. The configuration of item 82 in the scope of the patent application, wherein the bypass configuration includes a bypass cut to selectively control the pressure communication between the conversion chamber and the process chamber. ALICE-D: \ PATENT \ PU-068-0〇g 35 200535928 The configuration of the towel room item 83 of this process chamber, and the bypass configuration of this towel configuration includes pressure increase at a rate of 15 tauer to the mother's day. The pressure rises, in the configuration of item 83 of the patent, where the bypass configuration is installed to sense the pressure increase; from the processing to the preheating, the pressure of the chamber is changed by more than 30 seconds per second. The configuration of item 82 includes a control configuration to make the transfer setting value, and ϊ the process chamber, rise up to the selected value, that is, less than the pressure of the selected job, and the workpiece is heated up to-processing The temperature, followed by Yi Er, its === bypass configuration opening 'backfill the process chamber' is the next step in some way to balance the surface pressure to at least the preheat pressure, as a configuration. 'In a system, use a manufacturing process with at least-conversion room and-process Yu change the conversion room in the conversion room and in the process room-separated = 3 and the resident can be in the There is a communication between the conversion room and the process room, and it is used to select and provide the acceleration rate between the conversion room and the process room. …, Yili, induction in the process room to make at least 15 Taoer per second, such as the patent application scope of the 8th room and the power of the-and _ force under the auxiliary ", 1 material; = = own set, so that The conversion is also less than-preheating time, where the workpiece is heated to a processing temperature, the selected value of the pot 2 backfills the process chamber, and in a sense, its detachment force is used as the next step. Two: The system handles most of the systems. 'Using a process room with at least one conversion room and a process room, the H-change room, and the move in the process room A-isolated room, a configuration includes Between the conversion room and the process room, a backfill configuration option is selected to communicate with the process room, to sense ALICE-D in the process room. ^ ATEHT \ Pfj-068-0008 36 200535928 90. For example, the configuration of the 89th aspect of the patent application, wherein the diffuser is equipped to sense the backfill gas from the backfill configuration. I. Enclose the expansion of the flying body c 1 such as the configuration of item 89 of the patent scope, where the backfill configuration includes-backfill storage to, and-under the greater than Mu Jianli's service, store-backfill gas, backfill the process room. The force is in the configuration of the item% of the patent scope, where the target is-the pressure of the workpiece is increasing, the processing temperature is at least up to the processing temperature, as the τ-step to process the 93. Such as the scope of patent application The configuration of item 91, of which one is filled for backfilling, and the force is used between the Xiao Jitong conversion room and the process room. . Back to the top 94. If the configuration of the item% of the scope of the patent application includes a controlled filling storage room, a backfill pressure and a process room under the-processing force, up to-selected] two times less than the selected value 'and expected — Duty, add to this series. "Instantly, strengthen this! ^ Return power, the processing pressure is equal to the preheating, and it is used for the next-step sense 'coffee filling configuration for processing temperature = such as the configuration in item 90, which is equipped with the system Before the φ Xia, add :: Worker: Zhongzhong, and in the process room, expose the workpiece to the language, gather the forming part ;: The ===== 电 ΐ 霞 体 生产 体Guide the backfill gas at the end of the phase filling configuration, and its further assembly is used to guide the electrical charging gas component material. Although the county has different positioning, it presents various specific configurations with the various components. There are many ways to fix it. Here is the method: "Without any restrictions, for example, I can manage, modify, and combine the various steps again. In the response or in a limited relationship, for- A specific event, «Birth of a special event, on Na㈣ka⑼, Xi Na Mi1, pressure ^ ALICE- d: \ PATENT \ PU-068-0008 37 200535928 degree definition. As another example, the present invention is commonly converted Room, two or more conversion rooms can be operated, and in that case, the _ « The phase. ==. As mentioned above, it does not limit many different modification methods, and uses the same assembly at the same time without deviating from the hair_God and collar. M, 可 __ Example == Month, β brother is clear and does not have Any restrictions, and the present invention is not satisfied, 丨 ,, = Amendment within the scope of the patent application. Α is the money ', but at least can be explained in [Schematic Illustration]

Understand that this day, Γ By referring to the following detailed description, the diagram related to the following is briefly described ij τ is a shell-removal type. From the front, it is f_ μ 帛 -B according to the present invention. A schematic diagram of a shell removal pattern, viewed from the front, is a Γ transfer processing system according to the present invention, in which a bypass configuration is provided for backfilling from the conversion chamber to the process chamber. The second diagram is a flow chart illustrating a way in which the system of the first A can be used to 'reserve the conversion room, at least under the processing room, and expose the workpiece to the plasma in the process room. During processing. * The second figure is a chart illustrating the relative pressure of the process chamber pressure, backfill chamber pressure, and workpiece temperature, based on the flowchart in the second figure. The fourth diagram is a flowchart illustrating a way in which the system of the first A can be used, and the conversion chamber is retained, at least under pre-heating, to expose the workpiece to the process chamber. Heating effect. The fifth graph is a graph illustrating the relative time between the pressure in the process chamber, the pressure in the backfill chamber, and the relative temperature of the workpiece, based on the flowchart in the fourth graph. This figure is a flow chart illustrating a method that can be used in the system of the first B 'so that the conversion chamber backfills the process chamber from the processing pressure to the preheating pressure. The seventh figure is a diagram with the shell pattern removed. Viewed from the front, it is another bypass-specific embodiment according to 38 ALICE-D: \ PATENT \ Pa〇68 ^ 〇〇〇200535928 of the invention. Provide a dual process platform, and either or both can be used to backfill the process room. l Symbol description of main components]

~~ —— ^ 10 ~~ ——__ system system 12 transfer chamber 14 robot robot 18 arm bracket 20-'effector (paddle) 22 pattern model 30 ~~ —- ^ _ semiconductor semiconductor workpiece 32 ~~ —— plasma-processing chamber 34 ~~ ^^ plasma source plasma source 36 ----- plasma plasma 38 susceptor carrier 40 lift-pins ^ _ passage 44 ~ ^^ valve 45 ~~-^ __ arrow arrow 46 ~~-^^ exhaust port 48 ~~-^ ___ gas 50 ~-^^ __ diffuser 52 ~-^^ gas input 54-^^ backfill arrangement 56 --- ~ ^ _ backfill input 58 ^ --- process gas 60 ~~-^ __ Mass Flow Controller 66 backfill valve 39 ALICE-D: \ PATENT \ PU-068-00〇8 200535928

68 backfill ballast chamber 70 chamber line indoor line 72 supply valve 74 supply line supply line 76 backfill gas 78 backfill gas 78 pressure sensor 79 diffuser 80 diffuser 80 system 82 bypass arrangement 84 piping line 86 bypass valve 90 computer computer 92 MFC mass flow controller 94 input 96 output 100 system 101a first plot 101b second plot second diagram 102 third plot third system 200 system 202a plot 202b plot 300 third mode 400 system 40 ALICE-D: \ PATENT \ PU-068-0008

Claims (1)

200535928 10. Scope of patent application: 1. A method, in a system, using a processing principle, the system has at least-conversion room and-process room, so the pressure at the === pieces and the manufacturing pressure of the process property Can be changed separately, and parallel = 'Nanjin-step includes between the process chambers-process_section configuration prepared to process M specific stream HX to provide a reduction body to the process chamber, 1 maximum flow rate to provide the process gas, a method Including:-Committing to apply force to the tank with one piece of force to cut the work b) Under the processing pressure, transfer the workpiece from the conversion chamber to the manufacturing system C) Preheat the work piece to process The temperature, at the same time-Qin Rising 'Cheng Yi Lida-pre-looking force, as a result, the "Rising" system without lifting conversion force at an input flow rate, from an extra Lomo Palace monthly conditions, at least part of the rate of entry is greater than the maximum The flow velocity _ makes the overall input Φ entering the surface to reduce the surface force _ at the process, and _ process. e) At least relying on the strength and the light at the place, exposing the workpiece to electro-condensation treatment 15 Taoer ^ The method of applying for the first item of the patent of Qing Dynasty 'where the pressure rise rate reaches at least one layer per second, and one item is used The method, in which the guard supports-light blocks the layer of money as the moment passes. In the process, the light is removed together with the preheating effect and the exposure effect. 4. The method of item 3 in the scope of the patent application, which is generated in the process of it processing-under the needle degree, of which the plasma 5. The scope of the patent application No. = 3_ customized. Including heating the implement for preheating the workpiece. ", The middle cylinder is made of-carrier support, and up to-at least the method of the scope of the patent No. 5" wherein the heating effect includes heating the carrier 7. If the method of the scope of patent application No. 1, wherein the processing pressure medium In the range of _ to 10 ALICE-D. \ PATENT \ PU-068-0008 41 200535928 Taour. & The method according to the scope of patent application, wherein the processing force is Tao. The method to No. 1 of Zeer, in which the surface force is between 25 Taoer. H) · The method according to item [Scope of the patent application], wherein the preheating pressure is at least 仞 Taozhuan · Wai No.1 Lion method, and the towel side includes guiding-pre-heating-material into the process room to enhance The temperature rise rate of the workpiece. B ,,, 12 · As in the method of applying for item u of the patent scope, part i γ of the preheated gas mixture. ',] Use w as at least to select the encirclement, 1 in the item :: method, including assembling a backfill storage configuration, using flow' to select the gas produced to increase the additional process chamber input includes including using the backfill storage ^ Place the pieces and increase the process room time-room to reach the preheating force. 2. Flow from the input to the breast to backfill the process volume diffuser method, where the return includes using a gas in the process chamber. From the wind to the wind, it flows in from the backfill storage configuration and enters the processing process of item 5 in the scope of the patent application, such as the process gas and:-plasma, as the plasma process gas into the process chamber. ° Domain volume diffuser, which is used to further guide the system including -method, loading and filling storage configuration, that is, under the force greater than -target pressure, it will be returned to the storage room, and the temperature is changed in other words. As the next step. $ & management cylinder_heating the workpiece up to-if the team applied for the 13th backfill dust force of the patent scope and the process room is at _ place, the bottom of the backfill storage room will rise up to the selected value, In other words, it is much smaller than ALICE-D: \ PATENT \ PU-068-0008 200535928 the selected value and its handling capacity is also less than-pre-reduced force, heating the work there ^ 'Then __ includes the process by pressure Chamber, the backfill storage chamber is installed. In a sense, it equalizes the backfill pressure and the processing chamber pressure to at least the preheating pressure H as the next step for enhancing the heating rate of the workpiece. 1. At first 19. If the method of the scope of application for patent π is applied, the system shall provide at least no reductions in the backfill. The method of adjusting the body tone, the method of "please claim the scope of patent No. 13", wherein the pressure rising rate in the process chamber ranges from 15 to 150 Taoer per second. ^ The method of item 13 in the patent application, wherein the backfilling effect includes the pressure rising rate from 30 to 40 tau per second. (a) 5, J ^ a ^ 23 · If the scope of patent application is the first! The method of the item includes arranging a list of artifacts according to steps ⑷ to ⑷. Department 2 "-a device in a system for processing at least one workpiece, the system 至少 at least-conversion room and-process room 'so the pressure of the conversion room in the conversion room and the process in the room The chamber pressure can be changed individually, and can be transferred to the conversion chamber and the system next to the process. Further steps include-process gas adjustment configuration, at least in the process of determining the flow rate 'to provide a reduction body to the process chamber, Wei Ru—Maximum supply of the process gas, a device includes: B-No.-configured at least to control the pressure of the process chamber, reduce the pressure of the process chamber to a processing pressure 'in the Wei · workpiece added-plasma processing, And increasing the pressure of the process room 'and cooperating with the regulatory body to adjust the configuration to reach a pressure higher than that of the labor force at the place, at a rate of ^ force ^ rise, as a result, without improving the difficult money, at least partially At a light-entry flow rate, the gas flow from the additional process chamber makes the overall flow into the process chamber ^ greater than the maximum flow rate; meanwhile, a second configuration in the process chamber is brave to preheat the workpiece to a processing temperature , And rise ^ The process chamber pressure cooperates, from the processing pressure to the surface pressure, the first configuration and the residual transition to pressure 'at least close to the processing pressure, so that the process chamber pressure can be reduced to that place ALICE-D: \ PATENT \ PU-〇68-0008 43 200535928 Pulp force 12 to) Butterfly force and τ 'of the processing temperature There are several ways to expose the tree to the electricity, in one system, for processing at least one workpiece, the The system has a process "㈣ to ^-process room 'so that the conversion room in the conversion room is forced and at the respective 11 lakes, and the workpiece can be moved to the conversion room and the processing room. This step includes-process Gas adjustment configuration, at least in the process of plasma treatment, is used to provide process gas to the process chamber, and it can supply the process gas at the maximum flow rate. One method includes ... to > And work together to rely on the workpiece to pay the conversion room and the = to ^, so the workpiece in the process chamber is exposed to-preheating pressure, used to add ... secondary ^ up to-processing temperature, so in the process Add the workpiece to a process in the chamber, to 1 Under pressure, that is, after it has reached the processing temperature, as soon as the processing pressure is reached, the pressure is a certain purity, which produces a maximum β, * force that does not exceed the pressure, which is less than the atmospheric pressure. The value of the thermal pressure, while using a willing force in the process chamber. The force = the rate depends on the preheating pressure from the processing pressure. Without increasing the pressure in the conversion chamber, the result is at least partially at an input flow rate. The additional process chamber gas input flow is such that the overall input rate to the process chamber is greater than the maximum flow rate. ALICE-D: \ PATENT \ PU-068-0008 44