TWI257647B - Advanced multi-pressure workpiece processing - Google Patents

Abstract

Workpiece processing uses a transfer chamber in cooperation with a process chamber. The workpiece is to be heated to a treatment temperature, at a preheating pressure, and subsequently exposed to a plasma at a treatment pressure, which is less than the preheating pressure, yet very rapid pressure increases can be induced in the process chamber in transitioning from the treatment pressure to the preheating pressure. The transfer chamber pressure can be maintained at the treatment pressure, the preheating pressure or raised to a selected pressure to backfill the process chamber to the preheating pressure. A backfill arrangement can selectively induce rapid pressure in the process chamber. A bypass arrangement provides selective pressure communication between the transfer and process chambers and can be used for backfilling the process chamber from the transfer chamber.

Description

1257647 IX. INSTRUCTIONS: [Technical field to which the invention pertains] - This application claims priority from the US patent application No. _Na, which was promulgated on January 6, 2003, and is incorporated herein by reference. . [Prior Art] / The present invention relates generally to the field of processing - a variety of workpieces, and more specifically, for a system or method 'to perform an overall process on a workpiece by using more than one type of force. For example, manufacturing workpieces such as semiconductor wafers, in the overall process, typically performs different tasks with different pressures at different points. One example of such a multi-pressure process is disclosed in U.S. Patent No. M. 9,932 (hereinafter referred to as the 932th patent, in particular, in the second paragraph of the ninth patent, revealing seven prior art procedures to the atmosphere -vacuum 'atmosphere' (here-to-va one. _-here^ room heating - the wafer reaches the expected process temperature, then the process chamber is pumped to the second job process, and the money is added to the job In the process (4) - the orifice returns pressure to the gas pressure while the wafer is exchanged with the other wafer. For example, such a process is useful when removing the etchant from the wafer. The 932th patent uses the well-known principle that its thermal conversion efficiency increases with the gas-gravity. The phase-enhanced wafer production is over-utilized by the previous field of the system, the 932th patent f - load / no load pressure reduction After the dust in the process chamber, the use of _ intermediate dust force, in _ two = hot crystal S] no negative force does not need to be the atmosphere, but nevertheless "all the seam forces. About this point" after careful consideration, in view of this The arguments and cognition of the invention, added to the brother 932 special restrictions The problem will be regarded as the step-by-step limitation of the increase in the production volume of the system. Recognized by other cuts, in the "angry pressure and _ turn = f seeking _ force change" in the system production amount ± add ^ ^ ^ ^ 3 words into - Steps in the appropriate review of the argument. Bu Wenzhong will consider the removal of the aforementioned Guan and _ while still providing a better ALICE-D: \PATENT\PU-068-0008 6 1257647. SUMMARY OF THE INVENTION A system is described for processing at least one workpiece, a device, and a method. The system includes at least one conversion chamber and a process chamber, such that the chamber pressure in the conversion chamber, and at 5 liters The process to the pressure can be varied, and the workpiece can be moved between the conversion chamber and the processing chamber. The system further includes a reaction gas adjustment arrangement for providing the reaction gas to the private atmosphere. At least a specific flow rate in a plasma treatment reaction, and capable of providing a maximum flow rate of the reaction gas.

,,.,, 口付付伏主! The pressure of the knife and the chamber is the same as the pressure at the 3, where the workpiece is applied to the process. The workpiece is transferred from the transfer chamber to the process chamber at the pressure of the portion. Preheating the workpiece to a treatment temperature, the pressure of the fish is increased, and the pressure is increased by a preheating pressure at a rate of pressure increase, and at least one point is utilized to make the flow of the person to flow at a flow rate of at least one person. Under the pressure of the switching chamber, the overall input rate into the chamber is greater than the maximum A flow rate. Reducing the pressure of the process chamber to the place (4) The bribe force is lower than the treatment temperature, and the battery will be smashed by the battery. In the other aspect of the present invention, the conversion chamber pressure and the process = The transfer chamber is transferred to the process chamber. In the process chamber (4), an additional process chamber gas is used, and at least part of the system rate is greater than the maximum flow rate under the shift of the wheel, in order to preheat the pressure; the overall input speed of the second = process chamber is in one implementation. , the contribution of the workpiece to the transfer room. The pressure of the pass is used to select the backfilling system in order to select the same process as the process chamber. The other point of view is (10) force ϋ « force _ surface dust force. The pressure is greater than - the selected value of the preheating pressure, 7 to Isolation, change the conversion room, the temperature of the person will be close to the processing temperature. Most ALICE-D: \PATENT\PU-068-0008 1257647 2 The process chamber is at least under - force, the treatment pressure is less than the preheating Having the = chamber and the process chamber equal force, such that the selected _ force backfills the process chamber, at least = 忒 preheating pressure. The pressure is adjusted to the state of the preheating pressure, and the workpiece is removed from the process chamber. Under the pre-fresh force, preheating the guard at least reaches the treatment force. At least at the "Lesson and the processing temperature, the workpiece is exposed to the electricity, and at least the processing pressure is at least And ====between the conversion chamber and the process chamber, so that in the _ exposure to the pre-force, use the field side of the processing temperature, and the ===fr is some kind In terms of meaning, the use - less than the compilation force, but the large = one ^ _ clock force value, which produces the most Room rate, and using the process chamber j rate, = fruit does not increase the conversion ,, at least a part of the extra clothing spear to the milk body, flowing at an input rate: In the continuous view of the present invention, in order to reflect the majority The workpiece, at least the process is operated in the first "piece_between the conversion chamber and the process chamber, so that it will be exposed to preheating to heat the first workpiece to the process chamber 'The first piece is placed in the process, at least, 』 = pre = force _ under the _, almost reached the processing temperature, in a sense to ^ 眺 less than atmospheric dust 'but greater than the processing The preheating pressure value produces a maximum process (four) force that exceeds the pressure of two members and two pressures. The operation of the conversion chamber pressures the process of the process, the female system manages many workpieces, and collectively moves each successive one of the turns To the conversion room to the 'and-mould force to increase the material, the wire does not increase the dust in the conversion chamber ^ ^: ^ eve with 4 force collar external H gas, at the rate of input and flow. In the feature, the workpiece can be converted to a number of eves and processed at the same time. A bypass configuration is provided as a supply of pressure between the two miscellaneous ones and the pinning chamber, so that the pressure generated by the knife is equalized, and the workpiece is passed through the conversion chamber and Between the process chambers. In a feature ALICE-D:\PATENT\PU-〇68-〇〇〇8 8 1257647 2 a tube view raises the switching force up to a selected value, including the process chamber being less than the wire pressure The lower 'Qiu is similarly less than the occupational pressure, and the temperature is processed in the scale of the workpiece. Then the 'stalk is opened by at least the opening between the conversion chamber and the processing chamber = fill the processing chamber' in a sense And the process chamber pressure and the processing chamber pressure are close to the preheating pressure 'as a connection τ for heating the workpiece. In another aspect, the far bypass configuration is used to provide pressure communication between the noodle miscellaneous chamber and the predicate chamber, and the process chamber equalizes the pressure, and the isolation crucible is not used. In fact, in the system - at least one guard is processed, according to the multi-step whole process, in the ghost chamber, the workpiece is warmed up by the preheating pressure, and the pressure is processed in the domain The workpiece is exposed to the plasma, and at least the processing temperature is equal to the preheating pressure, such that the process chamber is in a multi-step overall over-bee pressure rise 'at least the preheating pressure-point or More. The system advances two (4) adjustment configurations, at least the workpiece is exposed to the plasma at a specific flow rate: gas reaches the process chamber' and is capable of providing the process gas at a maximum flow rate: ==! The process chamber pressure, in the multi-step overall process into the ="" person 5 s shai preheating dust force' to provide an additional process chamber gas at - speed / 1 person, so that the entire process room is reached The input rate is greater than the maximum flow rate. [Cross-management method] The presentation of (4) m can enable one of the original skills in this field to be produced and applied to °Hai Mingming and provided in a patent application, below and its necessary conditions. For the description of 'will be easily recognized by these skills in this field, and here (4) · can also be seen in other frequency of the actual implementation of the specific real-time, the symbol AF A Ke Qi U limit - To. It is based on the sound suppression, and the principles described here and the special sales of the temple are not proportional and are actual charts. Figure-A is a diagram, and on the front side, is a semiconductor example, usually indicated by the reference numeral (10). When the system (10) is set up by a person, and the system of ^^,^=打打, it will understand that the invention can be combined with various systems with '峨_蝴术彡, in the relay room, and ALICE-D:\PATENT\ PU-〇68-〇〇〇8 1257647 = points, the ability to change forces. #然, between the conversion and the process room must work: preparation. The system will be configured to meet a number of alternative features =: r: r platform connection includes, for example, the use of - or two in the b to medium double workpiece process position, and - or more = # = ϊ 512 Considered as an example of which describes such features and combines them all

m money, secret book Shen · whole _ show, Xian as the date of the implementation (10). Special mentions ‘The test numbers are used in similar projects and, where possible, throughout this disclosure. , H regarding the first A picture, system 〇〇) includes a conversion room (9) in which only ^ person (9) is displayed. The robot includes - arm (8) and the arm of the arm ^ rfn (20) 〇. * Semiconductor workpiece (3G) removes a photoresist surname layer or model (22) (thickness cup 1:) 'Although it can be used in this field Kind of original skills recognition, Lin Tong is beneficial to the package of two records (four) Gu 'but the secrets of the study · sedimentary, Xuan layer deposition and the side of each side of the 仃i which are at different process points, adding different strengths in the On the workpiece. As described above, for the purpose of this example, 'providing an electrification process chamber (3) having a plasma source (34), for example, a cow. , - Induction of the plasma (Icp) source. An electrical component (%) is produced using an electrical source (9), and L is used for the removal of a photoresist-like sputum. Other suitable plasma sources include, but are not limited to, microwave sources, water sources, ECR electrical sources, and capacitive light (parallel plates) plasma sources. Specifically referring to the processing chamber, or "process chamber (ah (10) (seven)," can be -Si placed rib age - jade pieces and _ processing source connections, for example, an electropolymer Source 0 The plasma chamber (34) can be used in a sample process window to perform a plasma, for example: Process pressure · · 2 to 20 Torr (the best results when found close to 1 Torr) Electricity (per workpiece) · 5〇〇 to 5, 〇〇〇w (the best results when found close to 3, 〇〇〇w) Narrative gas: Partially mixed or all in accordance with the following gases: * 〇2 Flow: 1,000-20,000 (5,00 found (M0, _sccm works best) 10 ALICE-D:\PATENT\PU-068-0008 1257647 • Ar, He, N2 flow: separate or mix 50_5000sccm (effect found at 500sccm Best) • H2, D2, HD flow: separation or mixing l, 〇〇〇 _20, OOOsccm (the best results when found close to 10,000) • Forming gas (4-10% Hr) ·· l, 〇〇〇- 15, OOOsccm (the best results when found close to 10,000) • Hydrogen probe compound gas (low molecular weight): for example CH4, C2H4, C2H6, C3H8, C 4H1(), etc.) Flows from 1,000 to 10,000 sccm (CH4 has the best flow rate at approximately 5,000 sccm) • Contains carbon halide gases: eg cf4, C2F6, C3F8, C4F6, c-C4F8, CHF3, CH2F2, CH3F , C2HF5, C2H2F4, C1CF3, C12CF2, etc. - Flow rate less than 300sccm • HF flow: flow rate less than 3〇〇sccm • N2O flow · 50-5000sccm • NH3 flow: 50-5000sccm Heart removal of photoresist side effect during drying process 'It can be understood that during the plasma exposure, the photoresist 2 removes the scale and the temperature of the workpiece increases. For example, heating the guard to a temperature is expected to be between 丨耽~3耽, in order to reach the production. The amount of help Ο"0 is read in a vehicle GO. The load is in the body of the body, and the temperature of the vehicle is forced to rise, and it is found that in the normal (4) cycle, the carrier is at least In the overall cycle n mouth ^ degree. Alternatively 'the fast c to the comfort c. Close or preheat at a temperature or between the values, in order to comply with the additional plus _ ==== Caused by any electric water storm and or material/device thermal energy limitation (40) , Γ〇4Γ-ίΓ ' ° to use the elevator pin to achieve an indication, ° for moving the workpiece (30), the borrower (20) and the carrier (38): on, if necessary, The workpiece moves (not shown) to the position, and the display end acts to cry. The lift pin (40) is in a retracted position. . (3)) Retracting into the conversion chamber (12), so that the workpiece (five) ALICE-D:\PATENT\PU-068-0〇〇8 11 1257647 is supported on the carrier (38). - #_道(6) defines that the machine (14) between the chamber (9) and the process chamber (9) can thereby convert the workpiece. An isolation (44), for example, uses a galvanic isolation gate valve or gap to select a fully or partially closed ride (4)) (eg, for example, to provide pressure communication as a two-chamber balance) ). In this example, the composite operation opens the valve (44) in this direction, indicated by the arrow (6), having - twisting to the right in the two shafts. In the process chamber, a waste state (6) is used to create a state of the art, in cooperation with the appropriate configuration. The exhaust gas flows out in the direction indicated by the arrow.

The electropolymer chamber or grab (34) includes a gas diffuser (5 〇) that receives the process gas ^(9) and the backfill configuration (9). The latter is in the _ backfill input (9), providing an input / benefit (50) 'Special note input (9) can be linked with another - type configuration to divide the drought - gas input, in order to prevent the double wheel diffuser (9) Demand. This term backfilling _ describes the case where the low pressure is reached to high pressure, and the result of the initial higher pressure transmission. Pay particular attention to the fact that the diffuser is designed to evenly distribute the pressure in the electropolymer source (9)), = electricity, inflowing gas The diffuser (5.) and the gas inlet lines (9) and (56) are likely to be taken low. The process gas (58) generally reduces the gas mixture, which is beneficial to the production of plasma, and the gas can also be processed by the process gas. The input (52) is used as the workpiece (9) to enhance the temperature of 2 liters. In this regard, the process gas is regulated by the _ whip (the mass flow controller (10), the actual exposure of the piece in the plasma _, its supply has The high-precision process gas input is used to control the characteristics of the plasma. When the whip provides such precise control, the speed is relatively slow. Furthermore, for example, the MFC device is characterized by a maximum flow rate value. It is often very slow. Therefore, it is clear that _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The detailed volume and operation of the backfill configuration (9) will be provided below. Before, it is enough to detect that the backfilling person (8), the valve (66), and the backfilling room (68) are simultaneously configured to increase the rapid pressure in the 2::(32), for example, by - low plasma = surname breaking pre-reduction force, Not separately, or with the process gas input... - the backfill chamber line (5) is directed from a backfill supply (72) to the backfill chamber (10). The supply line (74) is connected to the wheel back supply valve (72). Gas (5) - front indicator. Use the - pressure sensor to monitor the backfill chamber (68). In a sense ALICE-D: \PATENT\PU-068-0008 12 1257647 Come to the private and supply valve ( 72) Before the application of backfilling cooperation, the initial pressure of the heart can be reached in the backfilling chamber. Alternatively, in the backfilling, the towel can ensure that the pressure condition can be controlled by the shell flow controller (not shown). For a known period of time, the gas flowing into the backfill chamber is measured. It is known in the art that a person having the prior art, in light of this overall disclosure, can lightly illuminate the backfill configuration. A gas diffuser (79) ) placed between the plasma chamber (34) and the process to (32) 'as an increase in process Purpose, however, that the gas diffuser is not required. Use-backfill configuration (54), either alone or in conjunction with process gas MFC ((8),

Considerations can result in a process chamber rise rate of more than 15 _ per second. In fact, consider an average rate of increase of more than 15 teraels per second or more. At the present stage, the first B diagram is graphically described as a modified system implementation, which is generally indicated by the reference number (80). The system (8〇) is similar to the system (10) in Figure A, except that it is not required to be backfilled ((4) and a single input gas diffuser (not shown) is used. Again, a pressure bypass configuration is illustrated. (82), as an option to provide pressure communication between the conversion chamber (1)) and the process chamber (32). The bypass configuration (82) includes a line (10) and a bypass valve (the latter can be opened in any manner to achieve an equalization of the pre-surface force between the process chamber and the conversion chamber, and the bypass configuration can be manufactured according to specifications. All components, in order to enable energy between the two chambers, X to v every 15 pots (four) rate, to achieve rapid pressure equalization. In fact, consider a rate of 2 seconds 15 _ or greater. Therefore, can be implemented by less than 丨Tao _ to (9) Taur's speed transition, such as a low-end execution limit, less than 4 seconds. Of course, for this phase _ force change has been fully confirmed 'expected less than 2 seconds of the transition time. Green (10)) and (10) control 2 easy to correct this towel has a strong skill (four) from listening to the thief face, for example ^ brother, using the computer (90) and appropriate pressure or gas flow control sensor, for some of its offer to implement all the expected procedures here. In Wei (10), another difference is that the MFC (92) of the input (I) is entered, and the input is sent to the conversion chamber (9). This jump is described in =. Special attention is given to the control in the conversion chamber (9), which is controlled in an alternative manner. 2 There are any examples of limitations that can be used to communicate with the conversion chamber using a ------------- ALICE-D:\PATENT\PU-068-0008 13 1257647 The shovel returns to the second and third figures and the first type in which the system (10) is used. The second picture ^^田述-main mode with the reference number (10), and flute one = off to illustrate the various steps of the pull, usually intended to describe all the drawings, including the third picture, say "= = 璺 and / / value 'such a value is never expected to become a limit, and the Fan is ^, two maps, in addition to the other graphics below, the process room can also be: Said. Light bribe can be expressed as "PR". In the third diagram, the conversion formula (101a) illustrates the process in the process chamber (32), and the main diagram illustrates the variation of the coil in the backfill chamber (68), and the second pattern (10)b) shows the temperature of the workpiece. Paste and - the third figure (1〇2) says the chamber (9), even for the workpiece (3 (nt with the same low pressure operation, the conversion can be called::) and the same === Exposure = ❹Π 0 _ shirt called test. Le, ^ force moved to the process chamber (32) and placed in the carrier from the conversion to (12) _ on the two (four) axis _=====^ gate valve 'liter _ ( 44) extends over the top surface of the carrier == extended position). Similarly, regarding the isolation _ presenting the open state, the end effector (20) of the robot arm (18) is inserted into the desired position above the rhyme == lifting raft, the end effector makes the workpiece (the Machine: The cymbal control is coupled to the end effector). After the upper part is placed on the top of the lifting and lowering, the robot arm is pulled away from the process chamber by 2:2=3=:=; : Move the workpiece to - the position of the original position in the processing position field is similar, complete the shift processing position. Continued workpiece -, 1 household = wrong by retracting the lift (40), lowering the workpiece until the vehicle is fully warm to the second picture), time set, before heating. As the heated carrier begins to rise from Tg, the workpiece approaches the I and heats up between 15 (TC and 35 (rc). The rising work ALICE-D:\PATENT\PU-068 -0008 14 1257647 The temperature of the piece can be attributed to the conversion of radiation, gas convection and heat conduction. There is a pressure on the carrier to stay on the carrier, and the pressure in the process chamber (32), so the plasma chamber (34) quickly from ^ Rising, in the third figure - preheating pressure Pl, by the addition of the gas, which makes the range between ^Taor and 250 taels, can be fully used to accelerate the heating rate of the workpiece. A very fast The pressure rises, as shown in the third figure from P〇i, j Pl, in the time interval of _ ti, can be generated by the application of the backfill configuration (54). The job pressure of nearly 6 〇 is sufficient. And at this pressure, most of the benefits come from the improved heating rate, which is clearly understood to be obtained by a higher pressure. That is, it is more time to explicitly raise the pressure above 6Q. After reducing the pressure, the production is reduced. In the process room, by strict: Filling the valve (66), completes such a rapid pressure rise to release the compressed gas stored at a higher pressure from the backfilling chamber (6), paying particular attention to the backfill storage chamber usually very close to the process chamber. Point, under a sufficient pressure, according to the size of the storage chamber (68) to make a volume of sufficient gas, so that the process / plasma chamber combined to achieve the expected pressure. It is worth paying special attention: for all the specific embodiments here, the process The chamber gas volume is minimized to achieve a direct contribution that increases the rate at which the pressure rises. There are at least two executable methods to increase the rapid pressure. The third figure illustrates a backfill equalization technique in which the backfill is raised in advance. Pressure, or set a selected pressure value Pw (see Figure 101b, t〇). This pressure value is the basis for setting, part of the volume in the backfill chamber and the process chamber, so that the two chambers are balanced The hot pressure A, then the backfill valve (66) is turned on at t〇. That is, the pattern 101a and the Chuanji meet at time ^. The backfill valve (66) is closed and then equalized, and the back is made from t3 to t5. The chamber pressure rises to Psel. When Psd is shown as 65 taels for the convenience of illustration, it can be appreciated that this value can be determined in a number of ways, as will be explained below, and the use of this value is not intended to be limiting. As an alternative technique, It is not shown in the third figure, but it is easily understood from the first A diagram that the backfill pressure can be clearly raised above the Psei value, so that the backfill chamber always maintains a value higher than Ρι. When the process chamber reaches Ρι, in order to stop the backfill, the backfill valve (66) is closed, that is, once the process chamber pressure rises to δ 预 preheating pressure, the backfill valve (66) is closed. In any part of the technology , can open the supply valve (72) 'The same day inch backfill valve (66) is closed, and fill the backfill storage chamber (68) again to reach a desired pressure. According to various factors including indoor volume and flow rate, the flow rate can be generated in a replaceable technology. ALICE-D: \PATENT\PU-068-0008 15 1257647: Faster _ force rise. In any case, the use of any technology, such as that required in the overall process planning, can result in a rapid dust rise in the process chamber. It is specifically mentioned that in the overall process, at any time-time point, any of these techniques can be used, when using the backfilling room (the internal position is in the production of miscellaneous (9) towel guidance - the pressure rises. In the actual implementation towel The flow rate per (10) Taur. The best effect is achieved by 15 _ per second up to 15 〇 __ force. Μ, σ /, in step 104, once the workpiece temperature approaches the carrier temperature (but usually slightly 'At the temperature of the vehicle', the pressure in the process chamber is rapidly reduced to _treatment pressure, and the enthalpy is required for the photo-engraving step. The third figure illustrates that from time t] to ^2 :: Hold this pressure P1. However, at t2, the process chamber pressure is rapidly reduced so that J starts to recover to P〇. The treatment pressure p〇 for the plasma exposure step can be at _pressure ° _ to ω _ The treatment pressure is reached at t3. Similarly, when the temperature-conducting/flow 3 = r (32) is carried out, the plasma gas flow is started. Then, the electropolymer gas (10) L and the inflow electric chamber (34) For example, between some of the intervals, including the incentive to specifically mention the spear/sud, as described Arriving at any temperature for a fixed period of time, using the previous system to perform the basis of the measurement or the number of the person who can be present, can be step S1G6, the working process room reaches the surname and has the introduction of the plasma gas supply, ie Power supply crying ^ Haidian plasma chamber (34) connected to the distribution network" ... one in ^, will be with the electricity will be at the same time the network starts to rotate to - point, here _, 'where = plasma _ Cheng Start. The third figure shows - 10 seconds "the temperature of the piece rises slightly. Second =, to the time of exposure of the plasma to t5, the work produces red (four): 2 sets (four) with (38) Exposing in step 108, the flow of the slurry is passed through the i Rt5 to suspend the plasma side process, the gas used for the electric power can be equal, ". Sustained. The process chamber pressure and 1 red piece The isolation between the pressure chambers of the conversion chamber is p/(44), f the treatment pressure and can be opened between the process chamber and the conversion pulls the lift and lifts the workpiece at the top end of the carrier ALlCE- D:\PATENT\PU-068-〇〇〇8 1257647 Above the surface. In step U〇, just open the two-sided valve (44) and pull it up and down (40), the end effect can '(2〇) pulling person riding the hybrid system, the read transducer ah feeding chamber 〇2 transducer). The next step is to transfer the other workpiece into the processing chamber and repeat the above steps. The gas environment is used to achieve a rapid workpiece heating rate, by one or more of the following gases, and into, red and 以及 关 关 _ _ _ workpiece domain rate · · ^, take, such as 2 rt rib, book, 〇2, A, Jane 3, A0, a low molecular weight hydrogen barrier compound gas (eg rF ^ C2H4 Na, C3HS, C4Hl, etc.), - a gas containing gas (eg C1CF .ri ^ °3!81QF6 \ C"C4P8' CHF3 ^ C2HF2 ^ CH3F ^ C2HF5 ' TM ^ 3 2CF2 special). The specific shouting environment can accelerate the heating of the jade pieces and the cooling rate of the field Γ = the mixture button can be called "preheating gas". One of the benefits of this process planning. At the same time as the time required for the part to decrease, the heating effect of the number of workpieces that can be generated per hour can be recognized as the interval between the use of the preheating gas and the ribs can be enhanced to cool the interval, as follows. With Li Tong (the picture and the fifth picture are related to the first picture A, the second mode can make 2, the husband and the second. The fourth picture is the flow chart, indicating the various steps of this mode, usually with reference numbers (200) Label, force and workpiece temperature versus time pattern. u T chamber pressure, backfill chamber pressure time correspondence, diagram (part) description back = 62 = _ chamber (9) pressure and diagram (204) description of the workpiece Temperature vs. time library: For the two- and -Pl, the switching chamber (12) is operated continuously in a substantially continuous manner, and is used in the process chamber before the plasma is exposed between the pre-emphasis. The whole period is described above, for example, some views of the == formula to complete cooperation, and the isolation valve (44) A method is repeated for 4 (= use of the actuator arm (2 〇) some components can be ' Operating in a number of improved ways, 'again' should be able to understand this approach' while still Achieving the expected movement—the workpiece is in the process chamber (32) of the conversion;:===, while moving the workpiece to the load from the 4 conversion chamber (12) to the _(38). When the process chamber has Completely at ALICE-D:\PATENTAPU-068-0008 1257647 under the preheating pressure, when it is close to the carrier (5), the workpiece will undergo an enhanced heating action and then descend on the tool. (4) Time (4) τ2 at tG. ^ In step 208, the workpiece is reached at the processing temperature τ2 at time t2, and the pressure 'from P1 to the processing temperature ρ 降低 is reduced in the process chamber (32), in this example , can be achieved under the time of & the special fiber and the aforementioned surface gas mixture, if used, can simultaneously use the conversion chamber and the woven towel for convenience and no bribery. In other cases, by The diffuser (9)), which properly introduces these gases, enters the process chamber in order to complete the preheating of the workpiece, so that the temperature rises from _t2, and the rate is increased by this time. / 'From step 210' Introducing plasma gas into the process chamber and electroforming After the firing, the plasma processing chamber (9) starts to expose the plasma at U. The plasma exposure lasts for a long time (the plasma gas is introduced. The test step is completed and the pressure of the rising process chamber is up to ι, which can use the preheated gas. Hybrid execution and lifting the workpiece from the carrier (38). As described, the backfill configuration (5) can be applied, and the - rapid pressure rise is described below, especially in the process (four) force diagram (application). During the period of (4) t6, the P堡 to Ρι's fortune rises. During this time, in the backfill room pattern (employment), there is a decline. Then in the backfill room, the force falls, with the backfill closed. As shown in the figure (brain), before t5, the expected pressure of helium or higher can be stored in the backfill chamber. Similarly, it is clear that the backfilling power rises above ~, so the *Hai backfill room often maintains a pressure higher than Pl. In this case, the main rotation of the backfilling room (2〇2b) belongs to the above-mentioned diligence, not only provides - more steep and = linear · force rise 'from P 'Pl ' and in the figure (employed) - more (four), more linear under the 'month' from 匕 to P,. Furthermore, the 'time at t6' pattern and (brain) will not gradually merge = but will be very close to a linear slope function. In addition, the backfilling configuration can be used to draw the pre-reduced compound or to mix an expected gas mixture with the Wei Cai in the process chamber. Next, in accordance with step 214, the workpiece is transferred from the process chamber (32) to the conversion chamber (12) under the preheating force. Teshun and due to its exposure to the pre-delivery force, will enhance the work of ALICE-D:\PATENT\PU-068-0008 18 1257647, but the effect of 'subsequent plasma exposure, and the conversion is reached on the return journey room. It is estimated that the workpiece can be cooled in this manner, at least 30 additional before leaving the conversion chamber (12). C. This V, p effect 4 can be enhanced to be used with the preheated gas mixture at or with the conversion and process chamber. Therefore, the "preheating, gas pressure and mixture each help each other in cooling the workpiece and heating the workpiece. It should be clear that the cooling of the king piece can provide a higher degree of elasticity. Through the selection of the preheating pressure, Customizing the cooling rate of the workpiece, such as in a desired method and cylinder, as it passes through and exits the chamber. Furthermore, the choice of cooling gas mixture provides a level of cooling Customizing. When the field is switched to and the process chamber is simultaneously at the preheating pressure, another workpiece can be transferred (216) to the process chamber while repeating the foregoing sequence.

The use of the lift raft (40) together with the actuator arm (9), and for the short/about the fifth and sixth figures' present description - the third mode, the first B-circle system (10) can be used. In the third mode, the compression conversion chamber (12) is isolated from the process chamber (9), and the read-set pressure value Psel' is, in some cases, higher than the pre-suppression pressure P1 at some point. An MFC (92) is provided to raise the switching chamber (4) to the set pressure value. Specifically, the third mode is used to refer to the case where the second mode is equal to the second mode, and f represents the patterns (202a) and (202b) in the fifth figure. That is to say, the process to the relocation force is presented by the schema, and the conversion chamber _ (brain) is presented, which will be further advanced. The sixth figure, the age-based step, is the third mode, usually marked by the number (). Again, paying attention to certain aspects of the model, which are fully described above, for example, the backfilling chamber (68) of the figure can be used in this manner. As described above, the measurement of the backing chamber is also applicable to the determination of the set pressure of the backfilling chamber. , determining the appropriate value, at least one advantage ..... is greater than the pressure used in the plasma treatment (in other words, referring again to the -B diagram, the spirit of this third mode is to use the set pressure in the conversion chamber, In a sense, the process chamber (32) is backfilled so that the process chamber and the conversion chamber are both specialized, at least close to the pre-requisite force. That is, the process chamber is handled from the force & Force IV and the conversion chamber (9) M force slips from the set duty to the pre-force & because the first eight described 'the pressure value is set for the conversion chamber when the aforementioned backfilling technique is applied.

ALICE-D: \PATENT\PU-068-0008 19 I257647 The gas is according to the law of the wave of the ear. (1) Pselvtc; piVt〇t where Psel is the set pressure value and Ρι is the pressure chamber and the paste: For example, in the case of a room, at 1 Torr, the force] can be ignored for the purpose of simplification, and the squat is less than the set value. Of course, it is easy to determine the slogan and/or experiment with a person with the original skills in the field. …also

In 7 cases, the conversion chamber can be maintained at a pressure of 25 to 250 Torr, and 65 Torr is the best setting. The Jewish process room is maintained under the pressure of the place, and the expected plasma treatment process is required from 陶 陶 = to 10 Torr, where i taur is a typical pressure. The difference between the two pressures is, for example, the pressure is raised in the process chamber, and the speed is increased by 60, ^ is more than 10 times the process (four), and the conversion (four) pressure can be set to & _, so Between/converted to the isolation/gate valve between the four rooms, the pressure between the two chambers is also the same as in the [Taor Tianran's difference in the gas environment between the two chambers and in the process chamber In the middle needle U idler heating cycle, the conversion chamber needs to be adjusted with different set pressures. The higher set pressure and larger volume of the converted 3 gas environment allows Lin to "rapidly, raise the complexity of the process to the pressure it, as the red piece is tested for heating. When the reduction discussion is equally suitable for In the first figure, the use of the backfill chamber (68) is described in the following paragraph. ——: Regarding the first-B and fifth maps, consistent with most of the workpieces that are processed, as will be seen, /, will initially In step 3G4, it is presumed that the conversion chamber (12) and the process chamber (32) are equal to the preheating pressure P! and in the chamber, the reading is located there. Therefore, the same can be used to isolate the crucible ((4) and the bypass valve (86). The workpiece is turned off and heated (3 〇) to preheat at a temperature of time t ,, and the temperature of T 2 is reached at time t2. In step 306, once the valve is closed, the processing chamber (12) returns to the set pressure Psd. Again, note that the pattern of the chamber pressure is similar to the pattern of the backfill chamber pattern (2〇2b) in Figure 5. w is that these patterns will be identical, at least from a practical point of view, if the backfill chamber volume and conversion Chamber volume and flow rate are nearly identical, although this non-essential condition and many modifications can be This field 20 ALICE-D:\PATENT\PU-068-0008 1257647 is made by a person who knows the original skill month b, which is disclosed here. However, for the sake of brevity, the fifth® towel will be assumed. (2G2b) shows the change of the pressure in the conversion chamber during the whole period (4). Therefore, the MFC (92) is used to start the conversion chamber waste force up to h shortly after to. It should be implemented at any suitable (10) rate. The Wei shrinks and starts at any suitable time, as long as the conversion chamber reaches the set value before the next rise in the preheating pressure at the processing chamber (4). ^ The workpiece reaches the processing temperature within the relevant time limit, Figure 5 (202a) illustrates the system

Cheng Qianli (step drive) is reduced from Ρι at time t2 to & at time t3. This pressure drop is achieved by the discharge action, which is not illustrated in this figure on the reaction vacuum (four) side, but can be represented by the exhaust gas discharge port (46) in the first A diagram. "In the relevant time limit, the process reaches (32) reaches p〇. As described below, in the step, the plasma can be hit by an electric water gas and the slurry is activated to start the removal of the photoresist throwing agent. The operation until the time t5 in the fifth figure 〇 in step 312, with respect to the termination of the PR ★ division interval within the time limit, the plasma gas 2,,,,,,, and the process chamber (32> from the conversion chamber ((1) backfill) In order to generate a rapid rise from the process pressure to the preheating pressure in the process chamber pressure ring ^ 202 =). This pressure rise name reaches the preheating pressure at time (10) after the start of the process. The pressure of the pressure-type (2〇2a) towel rises, and the response from the heart to the one in the transition chamber pressure pattern (202b) from Ps』p 2 falls. It should be considered that the rate of increase of this pressure is reached. The two true/independent system (8G) must be relatively large, but during a short period of gas flow. The configuration of the square road in the total green r return (8)) Mingfeng ground is configured for this purpose. That is, the exit, two. Γ) and Bypass (86) are all manufactured according to size, collectively for the rate of this flow two Use - Large diameter catheters, when the length of the bee ray catheter includes any valves in between, the 7 #limit 'guides can block the flow of gas. It is believed that in this field - the original output is disclosed here and transmitted From a point of view, the ability to implement the bypass configuration will depend on the relative volume of the conversion chamber and the process chamber.

The alcohol chamber configuration 2 of the figure is considered to be achievable, which is equivalent to or greater than the bypass configuration, because the high-conductivity 1-conductor transfer and components can be achieved. Special Note _ The position of the mouth and vacuum pump outlets, shown in the various patterns, naturally ALICE-D:\PATENT\PU-〇68-〇〇〇8 21 1257647 is shown in the chart, but is not expected to be a limitation. Furthermore, the bypass configuration can mean that the isolation diaphragm (44) can be assembled in response to the expected flow rate.

Can be combined; bypass compensation system, the result of the distribution of the lion back to the maximum flow rate, in this backfilling step A, as any other high-speed flow step m (four) can be assembled in this way. Straight and/or Clamping The processed workpiece is removed from the process chamber (32) in step 3U, and another workpiece is moved from the transfer chamber to the processing position in the actual process chamber (32). With regard to pictures -A and -B, the systems represented by many modes ("〇") and (10)) have been described, and the description of the ascending call = can be accomplished by the rise, fall or combination of the output. = 2 c including 'example New' (_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _结 ☆ 升 _ use. This particular choice can be borrowed from the _ period process results. It should be able to physically improve _, the outline of the rise and rise (the battle 7 workers;) the movement of the piece in the cylinder branch county (displacement position) Of course, the lift/up/down combination can be located at the same time in the process chamber - separate workpieces, designed to produce - and = parts, or for the -to chamber design, to correspond to and / or continuously combine to process two workpieces Note that for the seventh figure, the description is given—the system is manufactured in accordance with the present invention, and the general cone weight is 22-2). The system (400) is similar to the foregoing system except that it is used in the range of the 参 Γ ' ' ' 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加 附加= The phase _ force environment. Therefore, as described above, it is considered that the system (10) is applied to the system (lion), except that the workpiece can be handled in pairs in order to be produced. The configuration of the bypass valve (82) is also described, although it is not necessary to provide the back ALICE-D:\PATENT\PU-068-0008 22 1257647 and the bypass configuration.

DETAILED DESCRIPTION OF THE INVENTION The present invention has been described in detail above and it should be appreciated that during the processing of a series of workpieces, it is never necessary to raise the process chamber pressure beyond the pressure for preheating. It is believed that such demand will be seen as reducing system throughput. Therefore, it is completely avoided to use any rainier force (in the preheating pressure) in the process chamber. Again, the process chamber pressure can typically be varied very quickly between the preheat and process pressures, whether or not the pressure is rising or falling. In particular, the use of a backfilling method, from any backfill storage configuration and/or backfilling from the conversion chamber, is highly advantageous in that the switching chamber pressure is increased from the processing pressure to the preheating pressure. Heating together at this preheating pressure can be expected to increase the system production enthalpy by 20% - 50%, depending on the processing time. Further, the backfilling process can be performed from a backfill storage chamber and from the conversion chamber using any desired combination, using the respective backfill sources in either continuous or corresponding manner. While the '932 patent described above describes an AVA system that is expected to minimize capital losses, the present invention is believed to provide a number of advantages over the use of an AVA system. For example, by reducing =, restoring to atmospheric pressure, or partially over-loaded/unloaded pressure, the system is enhanced to process each workpiece. The invention is transferred to or from the process chamber at the pressure which is below or below the preheating pressure of the workpiece to reduce a number of pressure variations as indicated by the method of the 5 932 patent. Further, as described above, when the workpiece is returned to the conversion chamber, the towel provides customization of the cooling side. ° Proposed the lack of prior art cognition, which has gained a lot of inspiration here, when moving from this process. When preheating the pressure, it is possible to lift the process chamber in a very fast manner forever. In addition, the pressure change provided by the overall process specification, the present invention provides a concise and memorable contribution, including backfilling. In the sense that it is not possible to recognize at least the following statements from the prior art, it is possible to be made possible by the prior description. In the system, a process is used as at least one work pressure to convert the chamber and the chamber, so that the conversion in the conversion chamber: the process chamber pressures in the chamber and the second can be changed individually, and the workpiece can be moved to The slurry unit further includes a process gas conditioning configuration, at least at -, a special flow rate for providing process gas to the process chamber, which can be -

ALICE-D:\PATENT\PU-06J 23 1257647 The maximum flow rate provides the process gas, “methods include: a) balancing the chamber pressure and the process chamber pressure _ processing

The piece is applied to a plasma processing process; where the J b) is transferred from the conversion chamber under the process of Lili, e) preheating the workpiece to a treatment temperature, and at the same time To; pressure to rhyme pressure, the result is no increase in the rise and the input flow rate, by the - additional process chamber gas input flow, so that the input =: to the average rate is greater than the maximum field speed; ) Reduce the surface force of the pin to the S pressure; ah process. e) At least rely on the handling of diligence and bribery, the silk should be called _ „2. If the patent application scope is the first item of the ancient 15 taur. The pressure rise rate of Bazhong 5 hai at least 3 per second. The first layer, and the plasma processing process, with the pre-reported support - photoresist repellent paste layer. "I, gamma exposure and removal of the light 4 · as claimed in the third The process produces a plasma for the removal of the luminosity from the substrate, wherein the plasma 5 is customized as in the first correction-correcting side layer of the patent application. The heating of the carrier is used to preheat the workpiece. , wherein the workpiece is supported by a carrier, and 6) as claimed in the patent range up to at least a fixed temperature. , , wherein the heating comprises heating the carrier 7 · as claimed in the scope of the patent range of Taur. , wherein the processing pressure is between 0·01 and 10 8 · If the patent application scope is 9 · If the method of applying for the special 围 丨 item is 1 Torr. Between 250 Torr. The pressure is between 25 and 10. For example, if you apply for a patent, you can use the pre-heating pressure. At least 60 Hightower. The method of the second brother, wherein the preheating action includes guiding-preheating ALICE-D: \PATEN7APU-068-0008 1257647 gas mixture enters the process chamber, 12 as in the patent application 2 = temperature rise rate of the piece. Part of the preheated gas mixture. The method 'includes the use of helium as the at least flow, to select the production body to read to the towel. _ The external process room input includes, the profit _ fill the surface of the workpiece and the increase of the room room - room up to Pre-sewn force. , 1 Lai Wan wire miscellaneous flow, backfill the process 14. If the application of the scope of the 13th treatment (10) part, the transport T«, as the electrical process gas into the process room. ^, _ expansion state, to further guide the system including - backfilling storage & ζ 13 items, wherein the assembly _ filling configuration, that is, in the greater than - 目 勤: fill gas in the backfill storage room, In exchange for the diligence of the sentence, the process room will be backfilled. Pre-clock force, so that the secret plus 16 '^ where the target pressure is selected as the processing temperature, as the next step of use (four), sub-heating the workpiece during the processing of the workpiece to a team as claimed in the 13th article backfilling The force and the process chamber rise to the selected value in the storage chamber under the processing pressure, and the processing pressure is also less than the rising value, in other words, much less than; meaning, fill in the connection system: =:: := For the next-steps to make the lions secret. # ^ Please force, for example, the method of claim 18, wherein the system provides at least no process gas during the backfill. The configuration is as follows: [2] The method of claim 13, wherein the pressure in the process chamber is ALICE-D: \PATENT\PU-068-0008 25 1257647 28. As claimed in claim 24 Load 25 to 250 taels. Μ ', medium _ thermal pressure range is between the workpiece. 29. The apparatus of claim 24, wherein the apparatus for assembling a pair of processing--working items as claimed in claim 24 includes, according to the steps (4) to (4) 31. The device of the item, wherein the first -= configuration. selects the ____ pressure to make the paste __action ί: when the external process chamber gas input flows, the process chamber pressure is controlled by the treatment. 32. The apparatus of the item, wherein the backfill diffuser is configured to direct the additional process chamber gas input into the process chamber. 33. The apparatus of claim 32, wherein the process chamber comprises an electric feed produced by the use of secret money as part of the process of diffusing the gas into the process chamber. The device of the U-domain body and the mouth device No. 31, wherein the backfill storage configuration comprises - Γ backfill pressure for storing - backfilling gas, in other words, when the backfill L is greater than the preheating pressure, backfilling the process chamber . 35. The apparatus of claim 34, wherein: the filling chamber causes the backfilling pressure to be selected at the processing chamber pressure and the processing pressure is also less than the preheating pressing, When returning to the vehicle, the input ==== gas adjustment ^申====step, where the backfill is lying, the process has at least one system in the system for processing at least one workpiece, the system has a private, Thus, the switching chamber dust force in the conversion chamber and the three chamber forces in the ALICE-D:\PATENTVPU-068-0008 1257647 can be individually controlled, and the workpiece can be moved to the conversion chamber and the processing chamber to be specific, including - Process gas conditioning configuration, at least in the - plasma processing process to provide the 'gas === gas to the process chamber, and its ability to - the maximum flow rate of the process chamber less than the power of the force The workpiece and the workpiece in the process chamber are exposed to a pre-emphasis force for addition to a small/dish level, such that the workpiece is applied to the process in the process chamber,

Under the professional force, after the D position reaches the treatment temperature, the pressure heating pressure is treated. In a sense, it produces a preheating dust that does not exceed the pre-reaction force to a maximum of 'using less than atmospheric pressure. The value of force, while using one in the process chamber; the rate of increase 2 from this place is difficult to reach the furnace force, the forest raises the pressure of the conversion chamber, the result is at least partly - the flow rate of the input, the use of _ extra The process chamber gas input stream 'which causes the overall input rate to reach the process chamber to be greater than the maximum flow rate. 38. The method of claim 37, wherein the rate of increase in pressure is at least 15 teraels per second. 39. The method of claim 37, wherein the operating process comprises maintaining the chamber pressure at the pressure of the chamber. 4. The method of claim 37, wherein the operating process comprises maintaining the chamber pressure at the preheating pressure. 41. A configuration, in a system, for processing at least one workpiece according to a multi-step overall & 'in the process chamber to preheat the pressure, preheating the guard up to the processing temperature, and thereafter, Exposing the workpiece to a plasma at a processing pressure in the process chamber, and at least approaching the processing temperature 'the processing pressure is less than the preheating pressure, such that during one or more of the multi-step overall process Pointing that 'the process chamber pressure must rise from the process pressure to at least the preheating pressure'. The system further includes a process gas conditioning configuration, at least at a particular flow rate during exposure of the workpiece to the electrode. Process gas reaching the process chamber, and capable of providing the process gas at a maximum flow rate, configured to form part of the system, the configuration comprising: a configuration to increase the process chamber pressure, from the overall process of the multi-step The treatment pressure is increased by at least the preheating pressure, and an additional process chamber gas ALICE-D is provided at an input flow rate: \PATENT\PU-068-〇〇〇8 28 1257647 input machine 'Which make the process g Wei overall input flow rate greater than the maximum flow rate. 42. A configuration in which, in one system, at least one workpiece is processed, the system is in a process chamber: the pressure in the conversion chamber in the conversion chamber is two, and the pressure of the h can be offset, and the workpiece can be moved Between the conversion chamber and the processing chamber, and heating the workpiece under a preheating pressure to expose the pressure of the process, the temperature is exposed to the process of the TM ship, and the backfilling configuration includes a gas expansion device, For the production of 1-3: two = set 'there is its butterfly tenderness - the assembly of electricity and mass production, Lai Dian's system: Qing, the gas and the gas are wrong, such as the device of the 42nd patent 'The backfill storage configuration includes a gas-filling gas-transformation force greater than 46. The apparatus of claim 45, including a control configuration, is returned to the storage chamber such that the pressure is filled and the process chamber is under the process pressure. Loading - selection = force small difficult ^ _ Lilian County _ « sister set the back to the filling room 'in a sense, 'to make the power and the treatment are all special, / _ Lai Li, as the next - The steps are used to enhance the heating rate of the workpiece. 47. - A method in a system to process at least one workpiece, the system and to the J-conversion ^ and - the remainder of the room - so in the conversion room and in, :, : Step 2 includes a process gas adjustment configuration, at least in the process of plasma processing, Wei Wei - the maximum flow rate of the heating element reaches the end of the force, and the work AL_CE-D: \PATENT\ PU-068-0008 29 1257647 pieces up to balance the conversion chamber house force and the process chamber movement, transferring the work from the conversion chamber = the pre-clock force under the process chamber, preheating the workpiece up to the processing temperature; Hot work; the process room is up to the processing capacity, and the conversion chamber is still at least a small amount of the pretreatment process close to the treatment and the processing temperature, the workpiece is exposed to the plasma at a small portion: two rates And increasing the pressure of the process chamber to the preheating pressure, and as a result, moving the workpiece to the conversion chamber from the process chamber while lifting the process chamber. Second 15 pottery; For example, if you apply for the special method of the 47th method, the rate of increase of force is at least every 49. The method of claim 47 of the patent scope includes configuring a backfilling and storing the in-compartment of the room to be selected in the process room. A pressure is generated at the rate of t 'swelling to increase the double force of the process to the processing, including the backfilling storage configuration, and backfilling the pressure of the process room. 50. If the method of claim 49 of the patent application is included, the method of filling the tree café is repeated. If the pressure is greater than the target pressure, the process chamber is backfilled. 51. The method of claim 5, wherein the backfilling effect causes the returning force in the returning force to rise to a selected value in the process chamber under the processing pressure, and the processing pressure is less than the selected value. At the same time, it is also smaller than the impurity pressure, where the workpiece is heated to reach the processing temperature, and then the backflow storage is placed in a pressure communication manner with the process chamber. In a sense, the Erbao force and the pressure in the processing chamber are The balance is at least the preheating pressure as the lower _, the heating rate of the workpiece. ^, 52·, the method of claim 49, wherein the backfilling action includes guiding the rate of pressure rise in the r chamber to a range of 1 G to i5 Torr. The method of claim 1, wherein the workpiece supports _light_engraved AUCE-D:\pATE>mpu side 30 1257647=where the preheating and exposing steps are assembled, and the photoresist is removed Face • Two ==== Method 'Where the process is produced - the handling of the shirt is used to (4) the substrate is removed from the photoresist. 55. The method of claim 47, wherein the complexing s includes simultaneously heating the carrier and heating the workpiece. " pieces by - vehicle selection,

A method having a condition of up to =^^利_%, wherein heating is performed to heat the carrier. Please refer to the method of claim 47, wherein the preheating pressure starts at 5 liters. 58. The method of claim 47, wherein the preheating force is at least 6 〇 Tao•人二Γ 专利 patent scope item 47, wherein the preheating side includes introduction-pre-,, b σ ...into the predicate room' to increase the rate at which the temperature rises. The method of preheating gas mixing is to supplement the method of item 59, including the use of helium gas as part of the method of the method of claim 47, including the steps of (8) to (8) at the same time. The method of claim 47 (4) includes, according to steps (4) to (8), a method of processing at least one light, in the system of (10), for processing a workpiece, the system and a process chamber, and thus in the conversion chamber The towel transfer chamber pressure and the process chamber pressure can be varied, and the workpiece can be moved between the conversion chamber and the process chamber. A method includes: a) from the process chamber, the saturation is converted, and the tilting is converted to the SM force. - selecting a pressure value, that is, greater than =_ force, heating the workpiece to a processing temperature; and initially balancing the 3 to the rhyme with the processing chamber at least at a processing pressure less than the preheating pressure The pressure between the chambers, such as the pressure selected by Lin, backfills the process chamber to at least the preheating pressure; ALICE-D:\PATENT\PU-068-0008 31 1257647 The process room balances the balance force, _ The transfer chamber is moved to the system while Φ is under the process chamber Preheating the pressure, preheating the workpiece to _ process warm sound. e) reducing the process chamber force up to the processing pressure, and isolating the pressure from the conversion chamber; the process is at least close to the processing pressure and the processing temperature, Exposing the workpiece to the plasma portion 64. The method of claim 63 further includes: g) after balancing the age and the system between the righteous forces, and from the process chamber to leave, from the pre- The heat pressure rises and the pressure of the conversion chamber reaches the selected value; the pressure barrier is at the county level, and the residual chamber is at least the processing force is the same as L. In the conversion chamber of the constant pressure value, the conversion chamber is again balanced. And the force between the processes, such as judging the value of the force, the process chamber is backfilled to the pre-pressure. The process = processing pressure to convert the workpiece to the transfer chamber, synergistically balance the pressure of the conversion chamber and 65. The method of the 64th item further includes, after re-balancing, repeating steps (c) through (i) for at least one additional workpiece. 66. The method of claim 63, wherein an isolation valve is selected to provide a clear force communication between === and wherein the balancing action comprises opening the isolation 阙 while moving the element through the isolation valve. • As stated in the patent | & method of Section 63, wherein the bypass configuration is selectively provided between the conversion chamber and the process chamber _ force communication, the balance rib and the isolation valve interface = conversion chamber And between the process chambers, at least for moving the workpiece between the conversion chamber and the process chamber. W # • The method of claim 23, which includes selecting the preset dust force, based on the force in the process chamber of the process chamber and the force in a conversion chamber of the conversion chamber. a configuration in which, in one system, at least one workpiece is processed, the system has a second transition to and a process chamber, such that the conversion chamber waste force in the conversion chamber is in the private The clothing can be changed separately, and the reading and shifting chamber can be read between the chamber and the processing room ALICE-D:\PATENT\PU-068-0008 32 1257647. One configuration includes: the pre-logistics ^= reading lion turn Butterfly force, contact pressure isolation is greater than k (diligence value, heating the I piece at 4 points at least - processing temperature, · simultaneous force 4 (four) balance the room without the chamber and the initial - less than the preheating pressure = treatment Pressure to publish her, __订, 峨 (4) bribes = in Gaya Μ 专 专 专 专 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第

The movement between the chambers of the chambers and the selection of the chamber provides a pressure communication between the chamber and the garment to the pressure balance. For the device of the 69th patent range, one of the bypass configuration options provides a pressure zone between the chamber, the balance of the load, and the relationship between -_阙 between ", and the system is at least provided as the Movement between the conversion chamber and the process chamber. 72. A method, in a system towel for processing at least one workpiece, the system having a chamber and a process chamber, such that the pressure in the conversion chamber in the conversion chamber and the process force in the garment to the private Each of the controls, and between the viewing chamber and the processing chamber, a method comprising: ... operating to the chamber pressure, and cooperating to move the workpiece between the conversion chamber and the private Thus, in the process chamber, the workpiece is exposed to a preheating pressure for heating = tilting - processing temperature, such that the workpiece is applied to the process in the process chamber, to/at processing pressure Next, in other words, after it reaches the processing temperature, a processing pressure is less than j preheating pressure, in a sense, it generates a maximum process power that does not exceed the preheating pressure, and is less than atmospheric pressure. The surface pressure value is greater than the domain pressure, while the operation includes raising the 4 chamber pressure to a value selected, after which the pressure is communicated between the converter chamber and the gas particle = between 'which causes the pressure in the converter chamber to be selected from the value Drop 'the pressure on the face, just some 1 heart to sense 'its backfilling the process chamber, so that the pressure in the process chamber from the preheating pressure rise of the treatment pressure. J3. The device of claim 72, comprising starting the workpiece between the conversion chamber and the beta garment & moving to the conversion chamber pressure drop between the selected value and the pre-33 ALICE-D :\PATENT\PU-068-0008 1257647 Within the range of thermal pressure. 74. The apparatus of claim 72, wherein the bypass configuration selects a pressure communication between the conversion chamber and the processing chamber as the balancing effect and between the rotating chamber and the processing chamber Isolation valve, at least providing the workpiece between the turn

The movement between. / 狂 狂 to I _ /5 - a method, using a system with at least - conversion chamber and - process chamber to process a majority of the workpiece, such as the conversion chamber pressure in the conversion chamber and the process chamber pressure in the processing chamber Each of the workpieces can be moved between the conversion chamber and the process chamber, and the system includes a section of the gas s of the material, at least in the plasma processing process, to provide a reduction The process chamber is capable of providing the process at a maximum flow rate. The method includes: - performing at least a woven air force, and (iv) moving the _ turn to between the conversion chamber and the process chamber, Thus, in the process chamber, the first workpiece is exposed to a preheating press I' for heating the workpiece to a processing temperature, so that the workpiece is applied to the processing process at least in the process chamber cap. Under pressure, the change is based on the temperature of the processing temperature of 2 - the processing pressure is less than the preheating pressure, in a sense, it produces no more than the pre-heating - the maximum residual pressure, small The value of the pressure of the job, while using the right to control - The rate of force increase from the process pressure to the preheating pressure, without increasing the pressure of the shift chamber, results in at least a portion of the flow rate of the input process, using the additional process chamber milk input flow, which allows the process to be reached The overall wheel rate of the chamber is greater than the maximum flow rate. 76. The method of claim 75, further comprising: hunting the weaving chamber pressure and the process chamber pressure, processing the next plurality of workpieces, and preparing the simplified workpieces in the miscellaneous chamber And between the process chambers, such that a majority of the subsequent ones are exposed to the preheating pressure in the process chamber for heating each of the next workpieces to reach the processing temperature, because at least in the system The processing pressure=down, the later red part is added to the domain process, and at least the method reaches the processing temperature X, and the surface pressure value at atmospheric pressure is generated, and the chamber pressure is not exceeded.八衣征77. The method of claim 75, wherein the operation comprises converting the ALICE-D: VPATENT\PU-068-0008 34 1257647 to at least the processing pressure and force, and simultaneously processing Most of the artifacts. 78. The method of claim 75, wherein the operating room is maintained at least under the force, and processing the plurality of workpieces includes the method of converting the application to the 75th item of the patent application, including simultaneously Adding a majority of the workpiece to the workpiece can transfer most of the workpieces to the conversion chamber and the miscellaneous operation to the v 彳 royal gas, and cooperate with the process chamber, such as this: In the process room, the social parts are exposed to the pre-conversion chamber process, at least in the 丄2 2 _ workpiece added to the treatment ====' Canna said that the sister's pressure to turn the second, :: face: The force cycle of the conversion chamber 'between the selected chamber and the pre-compression portion is caused by the base force communication established between the conversion chamber and the processing chamber, so the process chamber is backfilled using the selected pressure. , the method of claim 80, comprising initiating the workpiece between the conversion hot pressing 'related to the conversion chamber pressure drop between the selected value and the pre-82. - utilizing one having at least one conversion chamber And the number of workpieces' so the chamber pressure in the converter chamber and =: : each in the process chamber, and the workpiece is permeable between the conversion chamber and the processing chamber - a configuration comprising: - a bypass configuration for picking and providing between the conversion chamber and The pressure communication between the process chambers is balanced as a balance between them without the use of the isolation crucible. 83. The configuration of claim 82, wherein the bypass configuration includes a bypass valve for selectively controlling the The pressure communication between the conversion chamber and the processing chamber. ALICE-D: \PATENTAPU-068-〇〇〇8 35 1257647 The configuration of the process chamber 84 as in the item, wherein the bypass configuration is included in the apron & 15_ The rate of diligence increases. _ _ force increase rate processing to the preheating pressure, from more than 30 per second Tao 86 · such as the scope of patent application ^

(4) force and under-treatment pressure of the process chamber., with shouting _ = value, and it is also less than _ preheating force, the workpiece in the second P sense 'which makes the process (four) force and the treatment Chamber pressure, w to some kind of thinking - the step is used in the heating process of the workpiece. , a sea preheating pressure, as the heart of the two:: the system in the system of the force can be smashed in the process room, an isolation, the configuration includes: ^ between the conversion room and the process room The dress is equipped with the isolation coffee to choose to provide the conversion room and the process room. The test cycle is less than 15 terares. The application range is 帛87. The application range includes 87 room pressure and a process chamber under a process pressure that rises to a selected value such that the transition is also less than - the preheating pressure, where the heated second is also selected, the opening is backfilled into the process chamber, in a sense The 3-chamber factory ^=3 is at least the pre-clock force, as the lower-step is used for the heating of the workpiece to the '--configuration' in the system, the system has more than enough red parts, so The process chamber pressures of the Lai conversion can be varied, and the workpiece can be moved between the conversion chamber and the isolation valve, and the configuration includes a movement-backfill configuration between the clothes column and the process chamber. Frictional connection 'to sense the alice-d:\patent\pU.068.00 in the process chamber 08 36 1257647 90. The configuration of claim 89, wherein the assembly is used to sense the backfill gas from the backfill configuration, to the boring-expansion storage room S, such as the large application range 89 The configuration, wherein the backfill configuration includes a backfill 92 pressure: under the force 'storage - backfill gas, backfill the * workpiece. The device is used as a lower-step to process the 93. As in the configuration of claim 91, the valve ' is used to control the communication between the conversion chamber and the process chamber. Including - backfill age: 4 · If the configuration of the scope of application for the 91st item, including - control configuration, material return === and the process room under one force, rise up - selected value: then by The process chamber:: force 'the workpiece is heated at this point - the treatment temperature, ^ ^ surface placed fine _ deposit, _ Xiao: 89 Μ ' ^ to the mid-to-night mother second 15 Torr pressure rise rate. [6] The following is a configuration of the 90th patent, wherein the system is assembled to expose the workpiece to the plasma in the process chamber, and in the process chamber, The forming portion is used at the second time - the electrified gas in the plasma chamber is generated to guide the slave U, and wherein the process chamber includes - gas diffusion 11, the assembly thereof. __ Set back to the Wei body, and its entry-recording is to guide the plasma gas component in detail = edge; ^ _ = / with financial system, the financial concept has a different position in a variety of positions 2 2 invention A variety of specific configurations with this variety of components can be presented, in interaction. Furthermore, the method described here can use the helmet button Puyang Shenglu Na said that 11 (four) numerology, red secrets, the various steps i take the reaction in the specific event π or in a defined relationship 'targeted-specific event, Any point within the center of the event will occur at any time, press ALICE-] D:\PATENT\PU-068-0008 1257647. The column 'is carried out in accordance with the teachings of the present invention, it being understood that when linked - two 'shoulders, two or more conversion chambers can be operated, consistent with the statements herein. As in the prior art and related methods disclosed herein, the invention is practiced in a variety of different configurations, in a manner that is versatile, and in many other specific forms. Therefore, the method of the 0(4) method can be regarded as an example of the month and does not have any customs. _ This issue (4) does not obscure the details of the details, but the scope of the patent application is amended. In the [Simple Description of the Drawings], the present invention can be understood by referring to the following. The first-drawing diagram is a diagram of the removal of the outer casing. From the front side, in order to process the workpiece according to the present invention, J_the towel provides a backfilling configuration, causing a rapid pressure rise in the process chamber. Figure B-B is a diagram of the removal of the outer casing pattern. From the front, a further workpiece handling system made in accordance with the present invention, wherein a bypass configuration is provided for backfilling from the conversion chamber to the process chamber. , Figure - is a flow chart, illustrating a mode in which the system of Figure A can be used, retaining the conversion chamber, at least under a process pressure, exposing the workpiece to plasma in the process chamber During processing. + The third figure is a graph illustrating process chamber pressure, backfill chamber pressure, and workpiece temperature versus time, based on the flow chart in the second figure. Figure 4 is a flow chart diagram illustrating a manner in which the system of Figure A can be used, retaining the conversion chamber, at least under preheating pressure, exposing the workpiece to the process chamber, enhancing the workpiece The heating effect. The fifth figure is a graph illustrating the relative pressure of the process chamber pressure, the backfill chamber pressure, and the workpiece temperature phase, based on the flow chart in the fourth diagram. The sixth drawing, which is a flow chart, illustrates a manner that can be used in the system of Figure 1 such that the transfer chamber backfills the process chamber from the process pressure to the preheating pressure. The seventh figure is a drawing for removing the outer casing pattern, and from the front, another specific embodiment of the workpiece processing system manufactured according to the present invention ALICE-D:\PATENT\PU-〇68-〇〇〇8 38 1257647 A dual process platform and a bypass configuration and backfill configuration are provided, either or both of which can be used to backfill the process chamber. [Main component symbol description]

10 system system 12 transfer chamber conversion chamber 14 robot robot 18 arm bracket 20 effector (paddle) activator (paddle) 22 pattern model 30 semiconductor workpiece semiconductor workpiece 32 plasma-processing chamber plasma processing chamber 34 plasma source plasma source 36 Plasma slurry 38 susceptor carrier 40 lift-pins lift 42 passage channel 44 valve 45 arrow arrow 46 exhaust port exhaust 48 gas gas 50 diffuser diffuser 52 gas input gas input 54 backfill arrangement backfill configuration 56 backfill input backfill input 58 Process gas Process gas 60 Mass Flow Controller Mass flow controller 66 backfill valve Backfill valve 39 ALICE-D:\PATENT\PU-068-0008 1257647

68 backfill ballast chamber backfill stabilization chamber 70 chamber line indoor line 72 supply valve supply line 74 supply line supply line 76 backfill gas backfill gas 78 pressure sensor pressure sensor 79 diffuser diffuser 80 system system 82 bypass arrangement bypass configuration 84 piping line 86 Bypass valve bypass valve 90 computer computer 92 MFC mass flow controller 94 input input 96 output output 100 system system 101a first plot first pattern 101b second plot second pattern 102 third plot third pattern 200 system system 202a plot diagram Equation 202b plot 300 third mode third mode 400 system system 40 ALICE-D:\PATENT\PU-068-0008

Claims (1)

1257647 The scope of Taor. :· The method of item 1, wherein the treatment pressure is 1 Torr. 9. The method of claim 1 of the patent scope of the s month, made by the Ganshiyi blood mine, to the range between 250 taur. - Among them are pre-..., the pressure is between 25 taels. 1) The method of claim 1, wherein the preheating pressure is at least 6 〇, the method of the preheating gas enclosure item 11, including using helium as at least: ==::: the workpiece With the = room up to the preheating pressure. The additional process chamber gas is infused to flow, and the method of backfilling the process body 2 == range 13 item, wherein the backfilling function comprises using 1 additional process coffee input flow, and entering the process gas into the object from the backfill storage configuration , material-step guides the green of the 13th item of the system, and its #assembly lion fills the storage configuration, in the middle of the __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The process room will be backfilled. What is the premise: the method of the 16th patent range, wherein the target pressure is selected as the =: and in the processing - the piece of the piece reaches _ 18. The method of applying for the 13th item of the patent garden includes filling in the return With the process room in-treatment, up to - the selected value is in other words much less than 42 C:\Eunic6 2006\PU 1257647 The selected value and its processing pressure is also less than the i-force, in the bribe heating the transfer - processing temperature And thereafter, the backfilling action comprises communicating the process chamber with pressure, and installing the backfill storage chamber, in the sense that the backfill pressure and the pressure of the processing chamber are equal, at least up to the preheating pressure, as the next step is used Increase the heating rate of the workpiece. The method of claim 18, wherein the process gas conditioning configuration provides at least no process gas during the backfilling. 20. The method of claim 13, wherein the rate of rise of the pressure in the process chamber ranges from 15 to 150 teraels per second. 21. The method of claim 13, wherein the backfilling comprises directing the rate of pressure rise to 30 ohms per second in the process chamber. 22. The method of claim 1, wherein the processing of each pair of workpieces is performed according to step (4). This includes a series of workpieces according to the method of paragraphs (a) to (e). Α-mail-to-mx-lin-at least-red parts, the system has a to->-transition chamber and a process chamber, such that the chamber pressure in the chamber and the chamber pressure in the chamber can vary, The workpiece can be transferred between the conversion chamber and the processing chamber. The system further includes a process gas adjustment configuration, at least in the plasma processing process, with =::= followed by fine, and its maximum flow rate is provided.帛S& is set to y to control the process chamber pressure, reduce the process chamber's willingness to stress, where the workpiece is applied to an electropolymerization process, and the t and f process gas adjustment configuration cooperation is high In the pre-heating of the handling of the house, the result is that the turbulence of the room is not increased, resulting in at least part of the wheel-to-wheel maximum == room gas wheel flow, so that the overall input rate of the process room is clear. Replacement 43 C:\Eunice 2006\PU -2-fOM/fce/Ooc 1257647 = too = smoke fine, age county exposed in the electricity 25-- in the system for processing at least _ room:;: T So in the conversion room __:= door life ^ _, the shot will be converted into a simple room to listen to the process room 2 = system step - including - Process gas conditioning configuration, at least in the plasma processing process A: = gas reaches the process chamber 4 - operating at least the process chamber pressure, and cooperatingly moving the miscellaneous member between the conversion chamber and the processing chamber, such that the reading is exposed to the preheating pressure in the processing chamber for heating the workpiece a processing temperature, such that the workpiece is applied to a process in the process chamber, at least under a process pressure, that is, after the process temperature is reached, a process pressure is less than the preheat pressure, In a sense, it produces a maximum process chamber pressure that does not exceed the preheating pressure, uses a value of preheating pressure that is less than atmospheric pressure, and applies a rate of pressure increase in the process chamber from the process pressure to the preheating The hot pressure, without increasing the pressure of the shift chamber, results in an additional process chamber gas input flow, at least in part at an input flow rate, which causes the overall input rate to the process chamber to be greater than the maximum flow rate. 44 α-Έυηίοβ 2006Ψϋ MSBPU-0M\PU-068-00(m>U-068-000e-2~(Ori-Alice).Doc