200529382 九、發明說明： 【發明所屬之技術領域】 本發明係有關於漣壯+ 哪乃、逆、、、口电子兀件之承载 至少一雷子分 nn 及關於固定 中之承載件。本發明也右奶 载件之雷+ _ ^ 也有關於將連結至一承 執1〒之包子兀件封 ^ 帝工-#/ 长及關於將固定於一承載件夕 冤子兀件從~ 7系番从' ^秋1干之 ^ 承载件分開的方法。 【先前技術】 別如封裝’尤其如半導體，在其被放置於-特 據習知技術=t載件後’便展開大規模之封裝。根 t呈 ‘，，、目的，一承載件被放置到一模具之中， 劑果特：如：排要進行封裝的位置上留下空腔。液態封裝 、D %氧物質，接著被加壓射出至該模具空腔中， 且在中m儿丄 ^ r 5 被 。在封裝劑（部分）固化之後’模具從該承 3被.除：預期的封裝便可達成。此封裝技術係以大量 主 ' 、乜行現存封裝技術的缺點係其模具複雜且昂 貝，且通當作姦σ彳首 ’、屋。口 v向，以致每一種產品需要其特定之模 具0 【發明内容】 本t明之目的即係提供一改良的技術，以將放置於一 載中之包子元件封裝，其中，有了所有相關的優點後， 存相對較複雜的模具變成不再需要。 為達成此目的’本發明具備一連結電子元件之承載 200529382200529382 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to the bearing of Lianzhuang + Nana, inverse, and electronic components, at least one lightning element nn, and the fixed component. The present invention is also about the thirst of the milk carrier + ^ ^ There is also a seal about the bun which is attached to a contract 1〒 ^ 工-# / 长 和 About fixing the bun to the carrier from ~ 7 The method of separating the carrier from the '^ 秋 1 干 之 ^'. [Prior art] Unlike packaging, especially semiconductors, large-scale packaging is carried out after it is placed in a conventional technology = t-loaded part. The root t is ‘,,, and the purpose, a carrier is placed in a mold, such as: leave a cavity at the position where packaging is to be performed. The liquid-encapsulated, D% oxygen species is then injected into the cavity of the mold under pressure, and is coated with 丄 ^ r 5. After the encapsulant is (partially) cured, the mold is removed from the bearing 3: the desired encapsulation can be achieved. This packaging technology is based on a large number of mains, and the disadvantages of the existing packaging technology are that its molds are complex and expensive, and they are generally regarded as sloppy heads. Orientation, so that each product requires its own specific mold. [Summary of the invention] The purpose of this invention is to provide an improved technology to package the bun components placed in a load, which has all the relevant advantages After that, relatively complicated molds became unnecessary. To achieve this, the present invention has a bearing for connecting electronic components. 200529382
件’其特徵在該電子元件5小士 A 件至）有-部份係置放於設在承載 件中之凹槽裡。舉例來說 ^ 件中之凹槽最好係由開在1中 承載 設置的凹槽藉此形成（至少 載牛中 ⑺）衩具空腔，封裝工作# 可在其中進行。因此，該模 Η作便 诉工腔的摩巳圍，便不爯雪 (全然）由一個模具零件才能 于 模具的功能被(至少部分因， 該產品導向之模具空腔因此二二'子:牛… 〇 7巧屋品（至少部分）έ士人 使得產品導向之模且雯彼,r , J、、Ό B ， Τ j <犋具零件（至少部分）不再、▲ 成工藝裝備的成本大幅降彳 艳可k 製程時更換產品之程序簡化 進仃封$ 重要優點，便係當安排對_^^根據本發明承裁件的 減低。將製成封裝（封裝外私）白^目 錯*機會會 榦，可能會對該封裝成口 " ^ ^ (delammation)現象，以致 脫層 八双模具搴件中之模具空 一 且/或發生其他問題。 工 J禾， 採用根據本發明之承載件 離的製程步驟變成(至少部分)：:要成封= 誤機會會降低。封 口而也成使錯 曰陣低封裝製程間僅需使周一 凹槽（相對於傭銥嬗目+ ^ 人°又於承載件中的 於傳統拉具零件中多次使用模且 減少清潔封裝裝置件之+巫拍缺士 八二工），此更 點，之兩要。根據本發明承載件的 係电子疋件之封裝乃（至少部 坆 二:r該承載件與封裝外著力得=承=之 卜双以相對小幅度固化之後，該承载件與其上 /、 之封 6 200529382 裝外殼便已可再行後續操作，這造成 得以減少的額外優點。此外，在使 ：* 循%、時間 元件已經被（至少部分）放 衣劑之前’該電子 這也造成另-個優點，亦即在封:::::部;， 件時’損傷該電子元件、和損傷該電子==該承裁 通常脆弱的連結之機會便能減低。 牛人八承载件間 的一在邊:特畢:的::”:例中，該，開在承載… 邊畢兄電子兀件一般都是放置於承恭~ 面。若單-個凹槽可接受複數個電子元件 、—平坦 該複數個電子元件可因此以單_次=的話便更有利， 種極端的變化中，這種方法導致」=時覆蓋。在-1束欠伽丨 ^ 面周圍的承載件， :件。：：可種為::Γ，其中可放置-個或極大量電子 在另一種變化中，承載件具備複數個凹槽（孔、.同） :個凹槽放置至少—個電子元件，其至少部分係位於凹槽 =槽可設置成位於—承載件層内’構成該承載件完整 :二1T設想例如一具備凹凸面(p，)上層的 1此二 在複合承載件（基板）之電氣絕緣材料 此等凹ΓΓΓ在該承載件（基板）製造階段時便設置 此專凹凸面，也可能在之後（亦即製造該承载件之 凹槽還：能提供具備構成承載件一部份之面罩的 7 \ ’凹槽就設置於面罩中。此種面罩，舉例來說，可 Η至承載件之一薄片（foll)材料構成（例如-可黏附 承載件之標籤）。相反地，該面罩至少也可部分由— 7 200529382 連接至承載件之遮㈣㈣成， 硬紙板或塑膠製作之遮蔽薄板。 7載件、以 本《月也包括如上所述之承载件，立 槽至少係部分充填著封裝劑。此處該封裝之凹 充分固化，以使放置該凹槽中至少—個分也可不 分為封裝劑所封裝。該 ’子70件係至少部 可、^ + 件至少部分被封|，伟表干 =㈣子元件被封裝劑完全包覆， = 子兀件-部份不被封裝劑所包覆夂成4電 作用為感應器或價測器，或 。二牛“列來說可 便可能藉錢#。 4以件生成之熱傳導到其環境 二:二:：：變化中’該承…-料道 擇具-窄化屮槽且凹陷在承載件中。此料道可選 A 口（閘門），設於料道連接到該承載件内 料進=置太封裝劑之射出可因而透過設在承載件上之該 -因二道的窄化出入口比習知技術的較不明 因：根據本發明封裝的產品其射出通道（fe⑷通常不 分：而不艮:“發明，產品可連同所供應之封裝劑從承載件 移除其射出通道。在此之前，料道係模具之零件， 它便：：’且需經常保養。現在既然料道可和承載件整合， 使用—次，且至少習知料道的一些缺點不再出現。 m另—種貫施例中，承載件中設置之凹槽覆蓋一薄片 ”私至該承載件。該薄片材料層因此提供一保護層，以 =裝劑和連接至模具空腔之模具零件。承載件可能設 '道也可覆盖該薄片材料，藉此以使料道中之封裝劑 200529382 和模具零件 前述承 無法黏著。 本發明之一 電連接至待 一個優點， 凹槽内，此 載件堆疊放 承載件而言 一承載件層 件可具一面 槽。 ,,在電子元件固定到其上之前的階段也形成 部份。此種承載件具數個接觸位置，以實現導 固疋電子7C件。此種承載件勝過傳統承載件的 在於該導電接觸位置由於係位於設在承载件之 等導電接觸位置係部分被保護著的（尤其當承 置時）。根據上述，對於至少具一電子元件之 ，"亥承載件可具備複數個凹槽，此凹槽可設於 内而和该承載件整合成一體，且/或該承載 成為承载件之一部分，在面罩中設置該凹 古、、此外，本發明提供一種封裝連結承載件之電子元件的 立矢IL私步驟為· A )提供一承載件，具一電子元件至少 邻分置放於該承載件内一 ^ ^ ^ ^ ^ ^ ^ ^ u糟宁，且與邊承載件連結，:B ) 對该承載件中之凹槽供廡 應封哀劑，及C)連接該封裝劑至該 承載件與該電子元件。 千在此封裝的意思為該電子元件至少 口P分為封裝劑所包覆。 '为处M 、 此處封裝劑通常在製程步驟B)係以 /夜恶彳，、應至承載件之 凹钇，且在製程步驟c)被固化。將封 I劑投至凹槽内將使兮主+姑 濺）的…“ 5 的組成）洩㉟（溢流和噴 ' 巾田降低’畢竟該凹槽可設置成只在上邊開 口的凹槽，藉此不希望出規的私继W / 透開 出現的封裝劑溢流/洩漏到下邊的 f月況便不可能發生。除 ? _ ’、則面已敘述過關於根據本發明之 承載件的優點外，封裝時 f ^ 才封裝裝置要求的封口力量（closing 〇 r c e )也變成不異雪亚 . 再而要。封裝劑理論上可被引入（倒進） 9 200529382 該凹槽，而不需對封穿 程中，放署/ 何（過）塵力。在固化過 在凹槽内之封裝劑可和一 影響封裝劑接受固化時的形狀 、…件接觸’藉而 件置放其中之承# 、 处要封住該具備電子元 Λ本上:裁件裡的凹槽的話，最明顯地便係採用 基本上平坦的模具零件。 ί ?木用一 相對I”法—較佳的應用中，於製程步驟C)時，承载件 =控它的支架零件係位於靜止狀態 = 一基本上平坦之薄叔 7 糸與 移動的。此處吾人可执相成;^専板相對於該支架零件係可 〒至少一個其模具空 其 之薄板取代。此等對：=之模具零件改由， 此本方法可利用羽/ 的修改可非常容易達成，因 白σ封裝设備施行而毫無問題。 /、、、：而’本方法也 & 作。承載❹不同的方式施行封裝操 動式支架灾件 二/ 蛉，猎刼控承載件之一可移 可同時平：^ 且同樣操控承載件之一模具零件也 旦欠件了 ^承載件的行W向前進。料載件與該模 裝Γ=:形成循環輸送帶之-部份。因此封裝可在」 單許多。由此裝置和現存封裝設備比起來其設置簡 該載件連結之電子元件，且/或藉由同時對 對固定ΓΓ個凹槽供應封裝劑，還可能更進-步增加 口疋在一承载件上之電子元件封裝的效率。 上2 I备明更提供-種方法，以將固定在一承載件 之-子元件和該承載件分開，其係包括以下製程步驟:x) 10 200529382 提供-承載件’具至少部分充填已固化 且一電子元件至少部分 、破蜊之一凹槽， 口丨刀置放於该凹槽中， 裝電子元件之承载件的一部份，與該 ）將包含經封 開。因此在封裝劑如上所述投至承载件=剩餘的部分分 不需移除構成該凹槽的裝置，例凹槽後’吾人 料、且/或-面罩。該至少層、—薄片材 …亦即由已固化之封裝劑所包 同的製程技術從該承载件移除 7直接猎由不 1切割、或苴他當目—\ 鑽石切割、（雷射） ^ 为離技術。包覆該凹槽之承葡杜 也可在此分離過程中分開。 價之承載件零件 【實施方式】 弟1A圖係顯示—承載件i，其上之 子元件3置放於凹槽2 一凹才曰2二出，電 h T 〇另一種承 示在第1B圖，承载件4中 月施的方式顯 戟仟4中之兩個凹槽5同 1A圖t承載件丨的情形不同的， ^ — 口第 =:份之材料層6中。此材料層6可由例如一 =材料、硬紙板、或任何其他材料構成。材料層6可黏 附；堅硬的底層10，或材料層 一 ^ # ^ ^ ά 曰6與底層10的連結也可以 此“ + 復數個免子兀件7被置放到每個 此寺凹槽5之中。料道8 ^ ^ 7 ^ 丨曰八承載件之内，以供應至 :::之凹槽2中。凹槽2與料道8並且係由一層薄片 # 了視八只知條件而予最佳化。 弟2圖係顯示—承裁件2G，其—材料層2】構成-凹槽 200529382 22之周圍。和第1A圖與第iB圖之承載件1和4不同的， 係該承載件不具電子元件，僅具備連接或接觸點23之一格 點組，一個或一個以上之電子元件可連接至此。不具電子 元件之此種承載件20亦構成本發明之一部分。 第3 A圖係顯示一承載件 封裝劑31。顯示在第3Β圖中之承載件32也具充填封裝劑 33之凹槽。承載件32係由一底層34與一頂層35組裝而成。The piece 'is characterized in that the electronic component is 5 pens A piece to) there is-a part is placed in a groove provided in the carrier. For example, the grooves in ^ are preferably formed by the grooves provided in 1 to carry (at least the cattle ⑺) the cavity with which the packaging work # can be performed. Therefore, the mold is used as a capricorn for the cavity, so it is not possible (at all) that a mold part can be used for the function of the mold (at least in part because the product-oriented mold cavity is therefore two or two '): Cattle ... 〇7 Qiaowupin (at least partly) makes the product-oriented model, and r, J,, B, T j < parts (at least partly) are no longer, ▲ become process equipment The cost is greatly reduced. The process of replacing products during the manufacturing process is simplified. The important advantage is to arrange for reduction of _ ^^ according to the present invention. The package (package private) will be made white. Wrong * Chance will work, and the package may become "delammation" phenomenon, so that the mold in the delaminated eight-double mold assembly is empty and / or other problems occur. 工 J 禾 ， Use according to the present invention The process steps of the carrier part turn into (at least part of) :: to be sealed = the chance of mistakes will be reduced. Sealing and also making the wrong package only need to make a Monday groove between the low-package processes (compared to the commission iridium + + ^ The person uses the mold many times in the traditional puller parts in the carrier, and Less clean packaging device parts + wicker slaps and eighty two workers), this point is more important, two important points. According to the present invention, the package of the electronic component is (at least the second part: r the carrier and the package outside After the two pairs of hardened = bearing = solidified in a relatively small amount, the carrier and its upper and lower cover 6 200529382 can be installed for subsequent operations, which has the additional advantage of being reduced. In addition, in making: * By%, the time element has been (at least partially) before the dressing agent 'the electron. This also results in another advantage, that is, when sealing ::::: 部;,' damaging the electronic component, and damaging the electron == The chance of the adjudicator's usually weak connection can be reduced. One of the cattle-bearing eight carriers is on the side: Tebi ::: ": In the example, the drive is on the side ... It is placed on the Cheng Gong ~ side. If a single groove can accept multiple electronic components, it is more advantageous to flatten the multiple electronic components with a single _ times =. In an extreme change, this method results in 》 = Time coverage. Carrying parts around the -1 beam under-gauge plane,: pieces. : Can be seeded as: Γ, where one or a very large number of electrons can be placed. In another variation, the carrier has a plurality of grooves (holes, the same): at least one electronic component, at least part of which can be placed in each groove It is located in the groove = the groove can be set to be located in the-carrier layer 'to form the complete structure of the carrier: two 1T imagine, for example, an upper layer with a concave and convex surface (p,) 1 and two electrical insulation materials in the composite carrier (substrate) These recesses ΓΓΓ are provided with the concave-convex surface during the manufacturing stage of the carrier (substrate), or it may be later (that is, the groove of the carrier is also manufactured): 7 can be provided with a mask that forms part of the carrier \ 'The groove is set in the mask. Such a mask, for example, can be made of a foll material of a carrier (for example, a label that can be attached to the carrier). Conversely, the mask can also be formed, at least in part, from a masking sheet connected to the carrier, a cardboard or plastic masking sheet. 7 Carrying parts, this month also includes the carrying parts as described above, the vertical grooves are at least partially filled with the encapsulant. Here, the recess of the package is fully cured, so that at least one part placed in the recess may be encapsulated without being divided into an encapsulant. The '70 pieces are at least partially, and ^ + pieces are at least partially sealed |, Great surface dry = ㈣ 子 components are completely covered by the encapsulant, = = child parts-part is not covered by the encapsulant into 4 Electricity acts as a sensor or valence detector, or.二 牛 “列 说 可 便 可以 贷 钱 #. 4 The heat generated by the piece is conducted to its environment. Two: Two ::: Changing. The bearing ...-Material channel selection-Narrowing the trough and recessing in the carrier Optional A-port (gate) for this material channel, which is set in the material channel and connected to the carrier. The material feed = the injection of the sealant can be passed through the narrow inlet and outlet ratio of the two-way channel provided on the carrier. Less known cause of the known technology: the injection channel of the product packaged according to the present invention (generally, it does not distinguish: not invented: "Invention, the product can remove its injection channel from the carrier together with the supplied encapsulant. Before that The sprue is a part of the mold, and it is: 'and needs frequent maintenance. Now that the sprue can be integrated with the carrier, use it once, and at least some of the shortcomings of the sprue no longer appear. In the embodiment, the groove provided in the carrier covers a sheet "to the carrier. The sheet material layer thus provides a protective layer for filling and mold parts connected to the mold cavity. The carrier may be provided with The channel can also cover the sheet material, so as to make the sealing in the channel Agent 200529382 cannot be adhered to the aforementioned bearing of the mold part. One of the present invention is electrically connected to one of the advantages. In the groove, the carrier is stacked with the carrier. A carrier layer can have a groove. It also forms a part before the stage above it. This kind of carrier has several contact positions to achieve the conduction of the electronic 7C part. This kind of carrier is superior to traditional carriers in that the conductive contact position is located in the The conductive contact positions of the carrier are partially protected (especially when mounted). According to the above, for at least one electronic component, the " Hai carrier may be provided with a plurality of grooves, and the grooves may be provided in The carrier is integrated with the carrier internally and / or the carrier becomes a part of the carrier. The recess is provided in the mask. In addition, the present invention provides a method for encapsulating and connecting electronic components of the carrier. · A) Provide a carrier with at least one electronic component placed adjacent to the carrier. ^ ^ ^ ^ ^ ^ ^ ^ U and connected with the side carrier,: B) in the carrier Recess Supply the sealant, and C) connect the encapsulant to the carrier and the electronic component. The meaning of the package here means that the electronic component is at least covered by the encapsulant. The encapsulant is usually used in process step B), which is to reach the concave yttrium of the carrier, and is cured in process step c). Putting the sealant I into the groove will make the main + splatter ) ... "5's composition) Leakage (overflow and squirt 'towel field lowering' After all, the groove can be set as a groove that only opens on the top side, so that you do n’t want the unintentional private W / see-through appearance The overflow / leakage of the encapsulant to the next month will not happen. Except for the advantages of the carrier according to the present invention, the sealing force required for the device to be encapsulated at f ^ ( closing 〇rce) has become the same. The encapsulant can be theoretically introduced (introduced) 9 200529382 This groove does not need to be put in / dusty during sealing. The encapsulant that has been cured in the groove can be contacted with a part that affects the shape of the encapsulant when it is cured, so that the part is placed in the bearing #, where the electronic component is sealed. The grooves inside are most obviously the use of substantially flat mold parts. ί? Use a relative I ”method-in a better application, in the process step C), the carrier = the bracket part controlling it is in a stationary state = a substantially flat thin uncle 7 and moving. This I can do it together; ^ The plate can be replaced by at least one of its molds with empty parts relative to the bracket parts. These pairs: = the mold parts are changed, this method can be modified by using / Easy to achieve, no problem due to the implementation of white sigma packaging equipment. / ,,, and: This method also works. Carrying out different ways to implement the packaging operation-type bracket disaster parts II / 蛉, hunting control load One of the parts can be moved and leveled at the same time: ^ and one of the mold parts that also controls the carrier is also owed ^ the row W of the carrier is moved forward. The carrier and the mold are assembled Γ =: the-part of the endless conveyor belt Servings. So the package can be in a lot of singles. Compared with the existing packaging equipment, the device has a simpler arrangement of the electronic components connected to the carrier, and / or can supply the encapsulant to the fixed ΓΓ grooves at the same time. It is also possible to further increase the opening in a carrier The efficiency of the above electronic component packaging. The above 2 I provides further a method to separate the sub-element fixed to a carrier from the carrier, which includes the following process steps: x) 10 200529382 Provide-the carrier has at least part of the filling solidified And an electronic component is at least partly broken into a groove, and a mouth knife is placed in the groove, and a part of the carrier for holding the electronic component is sealed. Therefore, it is not necessary to remove the device constituting the groove after the encapsulant is thrown into the carrier = the remaining part, for example, after the groove, it is unexpected and / or a mask. The at least layer,-sheet material ... that is, the process technology enclosed by the cured encapsulant is removed from the carrier 7 directly hunted by non-cutting, or jealous— \ diamond cutting, (laser) ^ For off-technology. The pudu covering the groove can also be separated during this separation process. [Embodiment] Figure 1A shows the display-the bearing i, the sub-element 3 on it is placed in the groove 2 and the second element is 2 out, the electric h T 〇 another is shown in Figure 1B The way in which the bearing member 4 is applied in the middle of the month shows that the two grooves 5 in the halberd owl 4 are different from the case of the bearing member 1A in FIG. This material layer 6 may be composed of, for example, a material, cardboard, or any other material. The material layer 6 can be adhered; the hard bottom layer 10, or the material layer 1 ^ # ^ ^ ά Said that the connection between 6 and the bottom layer 10 can also be this "+ a plurality of child-resistant elements 7 are placed in each of this temple groove 5 In the material channel 8 ^ ^ 7 ^ 丨 said within the eight carrier to be supplied to the groove 2 of :::. The groove 2 is connected to the material channel 8 and is made of a thin sheet # depending on the conditions The figure 2 shows the cutting part 2G, its material layer 2] constitutes-around the groove 200529382 22. It is different from the supporting parts 1 and 4 in Figure 1A and Figure iB. The carrier does not have electronic components, but only has a grid group of connection or contact points 23. One or more electronic components can be connected thereto. Such a carrier 20 without electronic components also forms part of the present invention. Figure 3 A A carrier encapsulant 31 is shown. The carrier 32 shown in FIG. 3B also has a groove filled with the encapsulant 33. The carrier 32 is assembled from a bottom layer 34 and a top layer 35.
封裝劑33係設置成待封裝之電子元件36的一部分保持無 封哀劑33，此设置對電子元件36位於封裝狀態時，仍須以 特定方式和環境聯繫的情況尤其需要，例如㈣已決定、之 #唬、產生已決定之信號、1 /或熱移轉。為使電子 36部分保持無封裝劑，可利用薄片零件π覆蓋。此外 載件30還可見兩個充填封裝劑之料道％， 37所覆蓋。 々/寻月零件 弟4Α圖係示意顯示具兩個半邊模具41、42之封驻继 置40，兩半邊模具相對的距離係可調 ^ 了被置放於下半邊糍 戰什 41 r 遺杈〃、中（或在封装後從半邊槎且 41私除）。對承載件43和 千遺拉具 變的情形，後者““ +邊杈-41相對方向穩定不 此目的/ 會如圖示實施例提供—接受空間44以、衾 此：的。上半邊模具42包括一平坦薄板，並中，44以達 不忍，為封裝劑所用之料道45 —處如圖 並不會同時出現 八 、項，但實務上可能 ^ 了出現。封裝劑之供應可以任 行，其令特別是使一 之方式進 使用A㈣使液態封裝劑射出，便形成 12 200529382 一經常利用的解決太丄从 、 ^ , 式。此卜，、/主意封裝劑用的料道45也 可設置在下半邊模且 ，访 a ^ 並且通吊以通道設置在半邊模具 其中之一的接觸面。 苐4B圖係顯示封 互閉合的情形。封筆：：…在丰邊椒具41、42彼此相 “心南 放於為封裝目的而設置的承 載件43内之凹槽. y. +，其中待封裝之電子元件48已置放 其中。圖中清楚辱g . ,. . Μ μ，和0知半邊模具中模具空腔須以高 精確度與防磨損的方々 式（除開料道45 ^又置：較，上半邊模具42的平坦樣 極大之簡化。^所述’料道也可設置於他幻代表 最後，第5圖係顯示一分離 。根據箭頭？2的方向…曰，6〇，其具-㈣狀部 件63内現已充填乂 〇疋 一馬達62驅動。一承載 充真則述已固化之封裝劑64， 平面66之可蔣叙斗丄 欲置於位於一 + 支撐桌65上。藉移動該支擇卓65(包 括例如在平面66上 文琢杲65 (包 部61之下，以传系、，7載件63可被移動至鋸齒狀 承載件63可依需求分成片段。 【圖式簡單說明】 本叙明可以基於非限制性、表示 _ 施例，而更進_步說明，其中·…，圖式之示範實 第1A圖係顯示根據本發明之 有兩個凹槽，内置―電子元件；w件的透視圖，其具 第1B圖係顯示根據本發 透視圖，其具有兩個凹槽’一二 13 200529382 層形成，每凹槽内置複數個電子元件； 第2圖係表示根據本 — 目供冰她 ^月之一承载件的透視圖，其僅 八備一接觸位置之格點組 第3A圖係根據本發明【―)二^件可被連接至此； 個充填著封袋劑之凹槽； @透視圖’其具有兩 第3 B圖係根據本發 — 圖，JL呈右+ , 之另一承載件不同實施例的透視 僅部分A @ h 我^之凹槽，凹槽内置放複數個The encapsulant 33 is provided so that a part of the electronic component 36 to be encapsulated is free of the sealant 33. This setting is particularly needed when the electronic component 36 is in a packaged state and still needs to be connected to the environment in a specific way. For example, it has been decided, #Bluff, generate a determined signal, 1 / or heat transfer. In order to keep the electronic 36 portion free of encapsulant, it can be covered with a sheet part π. In addition, the carrier 30 can also be covered by the two filling channel filling channels 37. 々 / Picture of the moon-seeking part 4A is a schematic diagram showing the sealing of 40 with two half molds 41 and 42. The distance between the two molds is adjustable. It is placed in the lower half. 〃, medium (or from the half 槎 after encapsulation and 41 private exemptions). For the case where the bearing member 43 and the Qianguo pull are changed, the latter "" + the edge of the branch -41 is not stable in the relative direction. This purpose / will be provided as shown in the illustrated embodiment-the receiving space 44 and 衾: The upper half of the mold 42 includes a flat sheet, and the 44 is unbearable, and the material channel 45 used for the encapsulant is shown in the figure. The items 8 and 8 will not appear at the same time, but they may appear in practice. The supply of the encapsulant can be arbitrary, and it is particularly necessary to use one method to use A㈣ to eject the liquid encapsulant, which will form 12 200529382, which is often used to solve the problem. In addition, the material channel 45 for the / encapsulant can also be set on the lower mold half, and visit a ^, and the passageway is arranged on the contact surface of one of the half molds. Figure 4B shows the case where the seals are closed. Sealing pen:… the grooves in the Fengbian peppers 41 and 42 are placed in the carrier 43 for packaging purpose. Y. +, In which the electronic component 48 to be packaged has been placed. Figure .... Μ μ, and 0 know that the mold cavity in the half-edge mold must be of high accuracy and wear-resistant square (except for the material channel 45 ^ again: compared, the flat sample of the upper half mold 42 is extremely large). The simplification can be set at the end of the other representative. Figure 5 shows a separation. According to the direction of the arrow? 2 ... say, 60, the inside of the 现已 -shaped member 63 is now filled. 〇 疋 One motor 62 is driven. One bearing is filled with the solidified encapsulant 64, and the plane 66 can be placed on a support table 65. By moving the support 65 (including, for example, on the plane 66) Above 65 (under the package 61, by the transmission system, the 7 carrier 63 can be moved to the zigzag carrier 63 can be divided into segments according to requirements. [Simplified illustration of the drawing] This description can be based on non-limiting , Indicates _ examples, and further _ further explanation, where ..., the model of the model is shown in Figure 1A. The invention has two grooves, built-in-electronic components; a perspective view of the w-piece, which is shown in Figure 1B, according to the perspective view of the present invention, which has two grooves '12 13 200529382 layers, each groove is built-in A plurality of electronic components; FIG. 2 is a perspective view showing one of the bearing parts according to the present project, and the grid point group with only eight contact positions is shown in FIG. 3A according to the present invention. Pieces can be connected to this; a groove filled with bag sealing agent; @ perspective view 'which has two third 3 B picture according to the present-Figure, JL is right +, another perspective of another embodiment of the bearing only Part A @ h 我 ^ 的 槽 槽, a plurality of built-in grooves
1刀為封裝劑所封裝之電子元件； 圖，封裝IS顯：根據本發明之-封裝裝置的剖面示意 係表示封裝操作開已f放其内，胃中根據本發明 F闻始之則的示意圖； 々4B圖係顯示封裝操作 剖面示意圖· α β 中弟4Α圖之封裝裝置的 η » Μ及 第5圖係示意顯示一分 一分開方法的透視圖。 、在進行根據本發明之 【主要元件符號說明】 1承栽件 2凹槽 3電子元件 4承栽件 5凹槽 6材料層 7電子元件 14 200529382 8料道 9薄片材料 10底層 20承載件 21材料層 22凹槽 23連接或接觸點 30承載件 3 1封裝劑 32承載件 33封裝劑 34底層 35頂層 36電子元件 37薄片零件 38料道 40封裝裝置 41下半邊模具 42上半邊模具 43承載件 44接受空間 45料道 46封裝劑 47凹槽 15 200529382 4 8電子元件 60分離裝置 6 1錯齒狀部 P2箭頭 62馬達 63承載件 64已固化之封裝劑 65支撐桌 66平面1 knife is the electronic component encapsulated by the encapsulant; Figure, packaging IS shows: According to the present invention-a schematic cross-sectional view of the packaging device is a schematic view showing the packaging operation has been placed inside the stomach according to the present invention Figure 4B is a schematic cross-sectional view of the packaging operation. Η »M and Figure 5 of the packaging device of Figure 4A in Figure β are perspective views showing the one-by-one separation method. 1. The description of the main component symbols according to the present invention: 1 support member 2 groove 3 electronic component 4 support member 5 groove 6 material layer 7 electronic component 14 200529382 8 material channel 9 sheet material 10 bottom layer 20 carrier member 21 Material layer 22 Groove 23 Connection or contact point 30 Carrier 3 1 Encapsulant 32 Carrier 33 Encapsulant 34 Bottom layer 35 Top layer 36 Electronic component 37 Sheet component 38 Material channel 40 Encapsulation device 41 Lower half mold 42 Upper half mold 43 Bearing 44 Receiving space 45 Material channel 46 Encapsulant 47 Groove 15 200529382 4 8 Electronic component 60 Separation device 6 1 Misaligned part P2 arrow 62 Motor 63 Carrier 64 Cured encapsulant 65 Support table 66 Flat
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