TW200523955A - Method for manufacturing surface-mounted metal foil chip resistor - Google Patents
Method for manufacturing surface-mounted metal foil chip resistor Download PDFInfo
- Publication number
- TW200523955A TW200523955A TW93100263A TW93100263A TW200523955A TW 200523955 A TW200523955 A TW 200523955A TW 93100263 A TW93100263 A TW 93100263A TW 93100263 A TW93100263 A TW 93100263A TW 200523955 A TW200523955 A TW 200523955A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal foil
- chip resistor
- layer
- resistance material
- insulating substrate
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 86
- 239000002184 metal Substances 0.000 title claims abstract description 86
- 239000011888 foil Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 11
- 238000001259 photo etching Methods 0.000 claims description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 238000002679 ablation Methods 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 5
- 229910052770 Uranium Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims description 4
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 3
- -1 nickel chromium aluminum Chemical compound 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 claims 1
- VNTLIPZTSJSULJ-UHFFFAOYSA-N chromium molybdenum Chemical compound [Cr].[Mo] VNTLIPZTSJSULJ-UHFFFAOYSA-N 0.000 claims 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 3
- 239000000126 substance Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 58
- 239000004020 conductor Substances 0.000 description 34
- 229910000679 solder Inorganic materials 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 239000000976 ink Substances 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 6
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000012812 sealant material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004591 urethane sealant Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93100263A TW200523955A (en) | 2004-01-06 | 2004-01-06 | Method for manufacturing surface-mounted metal foil chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93100263A TW200523955A (en) | 2004-01-06 | 2004-01-06 | Method for manufacturing surface-mounted metal foil chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200523955A true TW200523955A (en) | 2005-07-16 |
| TWI313875B TWI313875B (enExample) | 2009-08-21 |
Family
ID=45072851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93100263A TW200523955A (en) | 2004-01-06 | 2004-01-06 | Method for manufacturing surface-mounted metal foil chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200523955A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8994491B2 (en) | 2012-08-17 | 2015-03-31 | Samsung Electro-Mechanics Co., Ltd. | Chip resistor and method of manufacturing the same |
-
2004
- 2004-01-06 TW TW93100263A patent/TW200523955A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8994491B2 (en) | 2012-08-17 | 2015-03-31 | Samsung Electro-Mechanics Co., Ltd. | Chip resistor and method of manufacturing the same |
| TWI506653B (zh) * | 2012-08-17 | 2015-11-01 | Samsung Electro Mech | 晶片電阻器及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI313875B (enExample) | 2009-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |