TW200520647A - A component assembling method of a flexible print circuit board - Google Patents

A component assembling method of a flexible print circuit board

Info

Publication number
TW200520647A
TW200520647A TW092135319A TW92135319A TW200520647A TW 200520647 A TW200520647 A TW 200520647A TW 092135319 A TW092135319 A TW 092135319A TW 92135319 A TW92135319 A TW 92135319A TW 200520647 A TW200520647 A TW 200520647A
Authority
TW
Taiwan
Prior art keywords
fpcb substrate
fpcb
covering layer
circuit board
assembling method
Prior art date
Application number
TW092135319A
Other languages
Chinese (zh)
Other versions
TWI301391B (en
Inventor
Gwun-Jin Lin
Guo-Fu Su
Original Assignee
Adv Flexible Circuits Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adv Flexible Circuits Co Ltd filed Critical Adv Flexible Circuits Co Ltd
Priority to TW092135319A priority Critical patent/TW200520647A/en
Publication of TW200520647A publication Critical patent/TW200520647A/en
Application granted granted Critical
Publication of TWI301391B publication Critical patent/TWI301391B/zh

Links

Abstract

A component assembling method of a flexible print circuit board (FPCB) includes: a forming process of FPCB substrate after forming a supporting covering layer having an adhesive layer on a FPCB substrate blank; the FPCB substrate still remaining on the supporting covering layer after the forming process; printing and forming welding material on a welding face of the FPCB substrate according to a preset diagram and then placing and positioning electronic components in the preset locations on the FPCB substrate; through a hot welding process, to weld the electronic components onto the preset positions of the FPCB substrate; then removing the supporting covering layer along and the adhesive layer. The material of the supporting covering layer can be polyester (PET), polyimide (PI), or glass fiberboard.
TW092135319A 2003-12-12 2003-12-12 A component assembling method of a flexible print circuit board TW200520647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092135319A TW200520647A (en) 2003-12-12 2003-12-12 A component assembling method of a flexible print circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092135319A TW200520647A (en) 2003-12-12 2003-12-12 A component assembling method of a flexible print circuit board

Publications (2)

Publication Number Publication Date
TW200520647A true TW200520647A (en) 2005-06-16
TWI301391B TWI301391B (en) 2008-09-21

Family

ID=45070212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092135319A TW200520647A (en) 2003-12-12 2003-12-12 A component assembling method of a flexible print circuit board

Country Status (1)

Country Link
TW (1) TW200520647A (en)

Also Published As

Publication number Publication date
TWI301391B (en) 2008-09-21

Similar Documents

Publication Publication Date Title
GB0416621D0 (en) Multilayer printed circuit board and method for manufacturing same
AU2003259552A1 (en) Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board
WO2003009657A1 (en) Circuit board, circuit board-use member and production method therefor and method of laminating fexible film
AU2003220241A8 (en) Process and apparatus for manufacturing printed circuit boards
HK1083292A1 (en) Method for mounting electronic component
DE60015035D1 (en) Vacuum lamination device with conveyor and method for applying a dry film resist to a printed circuit board
MY136428A (en) Resin/copper/metal laminate and method of producing same
AU4554399A (en) A method and apparatus for finding and locating manufacturing defects on a printed circuit board
EP1571894A4 (en) Holding/convey jig and holding/convey method
TW200731881A (en) Methods and devices for cooling printed circuit boards
WO2004032583A3 (en) Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards
TW200735733A (en) Method and apparatus for positioning flexible printed wiring board onto component mounting carrier tool
TW200631482A (en) Rigid flexible printed circuit board and method of fabricating same
SG106125A1 (en) Fixing adhesive sheet for flexible printed circuit board and method for mounting electronic parts in flexible printed circuit board
WO2008105744A3 (en) Method and apparatus for assembling surface mount devices
TW200520647A (en) A component assembling method of a flexible print circuit board
JP2002232197A (en) Electronic component mounting method
GB0312150D0 (en) A pallet for supporting a printed circuit board during soldering and a method for soldering a component to the printed circuit board
CN109688704B (en) Method for controlling glue overflow and soldering tin performance of rigid-flex board
CN201022241Y (en) Gold finger and flexible printed circuit board with this gold finger structure
WO1998012907A1 (en) Parts mounting methods
GB9904255D0 (en) A method for tracking printed circuit boards on multi-board panels through a production process
DE59905205D1 (en) METHOD FOR COATING PCBS OR THE LIKE SUBSTRATES
TW200709745A (en) Method of fabricating printed circuit boards
KR20170052078A (en) Continuous producting metallic foil laminate device and method thereby

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent