TW200520647A - A component assembling method of a flexible print circuit board - Google Patents
A component assembling method of a flexible print circuit boardInfo
- Publication number
- TW200520647A TW200520647A TW092135319A TW92135319A TW200520647A TW 200520647 A TW200520647 A TW 200520647A TW 092135319 A TW092135319 A TW 092135319A TW 92135319 A TW92135319 A TW 92135319A TW 200520647 A TW200520647 A TW 200520647A
- Authority
- TW
- Taiwan
- Prior art keywords
- fpcb substrate
- fpcb
- covering layer
- circuit board
- assembling method
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 abstract 6
- 239000010410 layer Substances 0.000 abstract 4
- 238000003466 welding Methods 0.000 abstract 3
- 239000004642 Polyimide Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229920000728 polyester Polymers 0.000 abstract 2
- 229920001721 polyimide Polymers 0.000 abstract 2
- 238000010586 diagram Methods 0.000 abstract 1
- 239000011094 fiberboard Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A component assembling method of a flexible print circuit board (FPCB) includes: a forming process of FPCB substrate after forming a supporting covering layer having an adhesive layer on a FPCB substrate blank; the FPCB substrate still remaining on the supporting covering layer after the forming process; printing and forming welding material on a welding face of the FPCB substrate according to a preset diagram and then placing and positioning electronic components in the preset locations on the FPCB substrate; through a hot welding process, to weld the electronic components onto the preset positions of the FPCB substrate; then removing the supporting covering layer along and the adhesive layer. The material of the supporting covering layer can be polyester (PET), polyimide (PI), or glass fiberboard.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092135319A TW200520647A (en) | 2003-12-12 | 2003-12-12 | A component assembling method of a flexible print circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092135319A TW200520647A (en) | 2003-12-12 | 2003-12-12 | A component assembling method of a flexible print circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200520647A true TW200520647A (en) | 2005-06-16 |
TWI301391B TWI301391B (en) | 2008-09-21 |
Family
ID=45070212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092135319A TW200520647A (en) | 2003-12-12 | 2003-12-12 | A component assembling method of a flexible print circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200520647A (en) |
-
2003
- 2003-12-12 TW TW092135319A patent/TW200520647A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI301391B (en) | 2008-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |