1301391 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種軟性電路板製程技術，特別是關於 一種軟性電路板之零件組裝方法。 【先前技術】 查在軟性電路板的技術領域中，業者已發展出各種不 同之製造技術，其主要製程大部份是將軟性電路板經整板 、打完零件後再成型，而成型之方式一般可分為銑槽 (Routing)方式及模具沖模方式。經過一片一片地成型步驟 之後，再一片一片地作電子組件之表面黏著（SMD)或焊接 ，以將該各個電子元件焊固在該軟性電路板之預定位置。 在採用表面黏著技術時，典型的習知步驟係先進行印 錫膏之步驟，將錫膏依一預定圖型印刷形成於該軟性印刷 電路基板之表面，然後取置所需之電子元件定位於該軟性 印刷電路基板之預定位置、再以迴焊爐迴焊（Refl〇w)以加 熱該軟性印刷電路基板上之錫膏使該等電子元件焊固於該 軟性印刷電路基板之預定位置上。在完成上述一序列之步 驟之後，即可收料及進行成品之檢查。 在此類相關技術中，業者已發展出不同之製程方法以 及製造設備。例如在中華民國發明專利公告編號第520624 號中，其揭露出一種軟性電路板的製造方法，其製造方法 主要包括Α·將金屬薄板裁切成附有料帶之預設電路；B.配 合該預設電路而裁切上、下絕緣薄膜；C·以治具使上、下 1301391 絕緣薄膜包覆於金屬薄板外，並固定其相對位置；D對整 體施以相對長時間之相對高溫高壓；E.精修成形。 又如中華民國新型專利公告編號第553589號中，其 係為一軟性電路板之表面黏著技術，其提供一以連續式撓 性電路板為基板之表面黏著技術設備，以將複數電子元件 藉表面黏著技術安裝至一撓性電路板，該設備包括一進料 單元’以整捲連續之帶狀形式輸出該撓性電路板；一锡膏 形成單元，自該進料單元輸入該撓性電路板，以將錫膏依馨 一預定圖型形成於該撓性電路板之至少一表面；一元件取 置單元，自該錫膏形成單元輸入該經形成錫膏之撓性電路 板，以將該等電子元件依複數預定位置配置於該撓性電路 板供錫貧形成之該表面；一錫焊單元，自該元件取置單元 輸入该經配置該等電子元件之撓性電路板，以加熱該撓性 電路板上之錫貧使該等電子元件焊固於該撓性電路板；一 收料單7L，自該錫焊單元輸入該經焊固該等電子元件之撓 性電路板；及一控制單元，控制上述單元之各別及整體之馨 運作。 /、又如中華民國新型專利公告編號第524164號中，其 係為-用於表面黏著技術電路板迴焊製程之治具組件，其 了有可承載電路板的治具基板，該治具基板頂面設有至 =二用以定位電路板之固定針、對應於電路板上預定設置 電子=件數量之定位針以及數間隔短柱，設於治具基板上 ==十可對應貫設於電路板非圖案化線路區域處，該設 、〜基板上之定位針分別對應電路板—預定電子元件裝 1301391 置處，且凸伸出電路板頂面固定電子元件，該間隔短柱短 於固定針及定位針之長度。 【發明内容】 本發明所欲解決之技術問題 然而，在採行前述習知之軟性電路板電子元件之表面 黏著技術時，欲在該軟性電路板之表面印上錫膏、以及在 該軟性電路板之預定位置放置電子元件之步驛中，—般都 需另外設計治具(Fix_。雖然其製程尚能符合製程快速 的要求’但在使用治具以及執行過程中有可能會有傷到已 經黏著或焊固在該電路板上零件的風險。 緣此’本發明之主要目的即是提供一種軟性電路板之 令件組裝技術’以克服習用技術中必需使用特定設計治具 之限制。 本發明之另一目的是提供一種更具製造簡便性之軟性 電路板之零件組裝方法，其在不使用治具的狀況下，可簡❿ 便地將所需之電子元件組裝定位在軟性電路板上。 本毛月之另目的是提供一種較具製程安全性之軟性 么電路板之零件組裝方法，其在執行軟性電路板之電子元件 、、且裝疋位過程中’不會有電子元件受到治具損傷的風險。 本發明解決問題之技術手段 u本發明為解決習知技術之問題所採用之技術手段係在 製備之軟性印刷電路基板形成一具有黏著層之支撐覆層 1301391 之後，對該軟性印刷電路基板進行成型步驟，在成型後該 軟性印刷電路基板皆仍留在該支撐覆層上，然後將焊著材 料依一預定圖型印刷形成於該軟性印刷電路基板之表面， 再取置電子元件定位於該軟性印刷電路基板之預定位置， 經過加熱步驟，使該軟性印刷電路基板上之焊著材料使電 子元件焊固於該軟性印刷電路基板之預定位置，最後將該 支撐覆層及黏著層予以去除。該支撐覆層所選用之材料係 為聚酯薄膜PET、聚亞醯胺膜PI或是玻璃纖維板。 本發明對照先前技術之功效 經由本發明所採用之技術手段，可以使軟性電路板在 進行電子元件之組裝過程中，不需使用到特定之治具，故 可減少特定治具之設備成本，亦可在不需使用治具之狀況 下簡化了整個電子元件組裝之步驟。再者，由於不需使用 治具，故在執行本發明之軟性電路板電子元件組裝定位過 程中，不會有電子元件受到治具損傷的風險。 【實施方式】 首先參閱第一圖所示，其係顯示本發明軟性電路板之 零件組裝方法之流程圖。而第二圖係顯示在採用本發明技 術時所製備之一軟性印刷電路基板之立體示意圖。茲同時 配合第一圖及第二圖對本發明作一詳細說明如后。 在執行本發明之製程方法時，首先於步驟101中，先 製備出一軟性印刷電路基板1，在該軟性印刷電路基板1 •1301391 上間隔地設置複數個電子元件定位區域11，並在該每一個 電子元件定位區域11之預設間距位置配置有複數個焊著 區域12。此外，為了在製程中能達到定位之效果，故在該 軟性印刷電路基板1上之適當位置可設置數個光學參考點 13 〇 在完成軟性印刷電路基板1之製備後，即可在該軟性 印刷電路基板1之背面形成一支撐覆層2(步驟102)。該支 撐覆層2所選用之材料可為聚酯薄膜PET(Ethylene⑩ Terephthalate)或是聚亞醯胺膜Pl(Polyimide)等材料，當然 亦可選用其它具有類似功能之材料，例如FR4玻璃纖維板 〇 在該支撐覆層2與軟性印刷電路基板1之間係可以黏 著層3使兩者黏著結合。該黏著層3可採用習知之黏著材 料，只要能將該支撐覆層2與軟性印刷電路基板1予以黏 著之材料皆可適用。第三圖係顯示軟性印刷電路基板1與 支撐覆層2藉由黏著層3黏著結合時之剖視圖。 i 在完成上述之步驟後，接著對該軟性印刷電路基板1 進行成型步驟（步驟103)。此成型步驟係可採用習知銑槽 (Routing)或是模具沖模方式予以成型。在該軟性印刷電路 基板1完成成型步驟後，整個軟性印刷電路基板1連同各 個電子元件定位區域11皆仍留在該支撐覆層2之黏著層3 上（步驟104)。接著，在經過簡易之整平過程（步驟105)後 ，即可對該軟性印刷電路基板1進行印錫膏（焊著材料）之 步驟（步驟106)，以將錫膏依一預定圖型印刷形成於該軟 1301391 性印刷電路基板之焊著面。1301391 IX. Description of the Invention: [Technical Field] The present invention relates to a flexible circuit board process technology, and more particularly to a method of assembling a flexible circuit board. [Prior Art] In the technical field of flexible circuit boards, the manufacturer has developed various manufacturing technologies. Most of the main processes are to form the flexible circuit board through the whole board and after the parts are finished. Generally, it can be divided into a milling method and a die punching method. After a piece of molding step, surface adhesion (SMD) or soldering of the electronic components is performed one by one to solder the respective electronic components to predetermined positions of the flexible circuit board. In the surface bonding technique, a typical conventional step is to perform a solder paste step of forming a solder paste on a surface of the flexible printed circuit board according to a predetermined pattern, and then positioning the desired electronic component to be positioned. The predetermined position of the flexible printed circuit board is reflowed by a reflow oven to heat the solder paste on the flexible printed circuit board to solder the electronic components to predetermined positions of the flexible printed circuit board. After completing the above sequence of steps, the material can be received and the finished product inspected. In such related art, the manufacturer has developed different process methods and manufacturing equipment. For example, in the Republic of China Invention Patent No. 520624, a method for manufacturing a flexible circuit board is disclosed, the manufacturing method mainly comprising: cutting a metal thin plate into a preset circuit with a tape; B. cooperating with the pre-processing The upper and lower insulating films are cut by a circuit; C. The upper and lower 1301391 insulating films are coated on the outside of the metal thin plate and fixed in relative positions; D applies a relatively high temperature and high pressure to the whole for a relatively long time; Refined and formed. Another example is the Republic of China New Patent Publication No. 553589, which is a surface-adhesive technology of a flexible circuit board, which provides a surface-adhesive technology device using a continuous flexible circuit board as a substrate to borrow a plurality of electronic components. The adhesive technology is mounted to a flexible circuit board, the apparatus comprising a feeding unit 'outputting the flexible circuit board in a continuous roll form; a solder paste forming unit, the flexible circuit board is input from the feeding unit Forming a solder paste into a predetermined pattern on at least one surface of the flexible circuit board; a component accommodating unit, inputting the solder paste-form flexible circuit board from the solder paste forming unit to The electronic component is disposed on the surface of the flexible circuit board for tin deficiency formation according to a plurality of predetermined positions; a soldering unit is configured to input the flexible circuit board on which the electronic components are disposed to heat the The tin is depleted on the flexible circuit board to solder the electronic components to the flexible circuit board; a receiving list 7L, the flexible circuit board for soldering the electronic components is input from the soldering unit; and System unit, and the overall control of respective units of the above-described operation Symrise. /, as in the Republic of China New Patent Publication No. 524164, which is a fixture assembly for a surface-adhesive circuit board reflow process, having a fixture substrate capable of carrying a circuit board, the fixture substrate The top surface is provided with a fixed pin for locating the circuit board, a positioning pin corresponding to the predetermined number of electronic components on the circuit board, and a plurality of spaced short columns, which are arranged on the fixture substrate == ten can be correspondingly arranged At the non-patterned circuit area of the circuit board, the positioning pins on the substrate are respectively disposed corresponding to the circuit board-predetermined electronic component 1301391, and the top surface of the circuit board is fixed to the electronic component, and the spacer short column is shorter than the fixed The length of the needle and the positioning needle. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention, however, is to apply solder paste on the surface of the flexible circuit board and to the flexible circuit board when the surface adhesion technology of the aforementioned flexible circuit board electronic component is adopted. In the step of placing electronic components in a predetermined position, it is generally necessary to design a fixture (Fix_. Although the process can still meet the rapid requirements of the process), there may be injuries and adhesions during the use of the fixture and the execution process. Or the risk of soldering the components on the board. Thus, the main object of the present invention is to provide a flexible assembly technology for flexible circuit boards to overcome the limitations of the use of specific design fixtures in conventional techniques. Another object is to provide a component assembly method for a flexible circuit board which is more convenient to manufacture, and which can easily assemble a desired electronic component assembly on a flexible circuit board without using a jig. Another purpose of Maoyue is to provide a method for assembling parts of a circuit board that is more flexible than process safety, in which electronic components of a flexible circuit board are executed. And there is no risk that the electronic component will be damaged by the fixture during the clamping process. The technical means for solving the problem of the present invention is the technical means for solving the problems of the prior art, which is based on the prepared flexible printed circuit board. After forming a support layer 1301391 with an adhesive layer, the flexible printed circuit board is subjected to a molding step, and after the molding, the flexible printed circuit board remains on the support layer, and then the solder material is subjected to a predetermined pattern. Printing is formed on the surface of the flexible printed circuit board, and the electronic component is positioned at a predetermined position of the flexible printed circuit board. After the heating step, the soldering material on the flexible printed circuit board is used to solder the electronic component to the soft component. The predetermined position of the printed circuit board is finally removed, and the support coating and the adhesive layer are finally removed. The material selected for the support coating is a polyester film PET, a polyimide film PI or a fiberglass board. The utility model can make the flexible circuit board assemble the electronic components through the technical means adopted by the invention. In the process, it is not necessary to use a specific fixture, so the equipment cost of the specific fixture can be reduced, and the entire electronic component assembly step can be simplified without using the fixture. Furthermore, since there is no need to use the treatment. Therefore, in the process of assembling and positioning the electronic component of the flexible circuit board of the present invention, there is no risk that the electronic component will be damaged by the jig. [Embodiment] Referring first to the first figure, the flexible circuit board of the present invention is shown. A flow chart of a method for assembling a part. The second figure shows a schematic view of a flexible printed circuit board prepared by using the technique of the present invention. The present invention will be described in detail in conjunction with the first and second figures. When performing the process method of the present invention, first in step 101, a flexible printed circuit board 1 is prepared, and a plurality of electronic component positioning regions 11 are spaced apart on the flexible printed circuit substrate 1/1301391, and A plurality of soldering regions 12 are disposed at predetermined pitch positions of each of the electronic component positioning regions 11. In addition, in order to achieve the positioning effect in the process, a plurality of optical reference points 13 may be disposed at appropriate positions on the flexible printed circuit board 1. After the preparation of the flexible printed circuit board 1 is completed, the flexible printing may be performed. A support coating 2 is formed on the back surface of the circuit substrate 1 (step 102). The material used for the support coating 2 may be a polyester film (Ethylene 10 Terephthalate) or a polyimide film Pl (Polyimide), and of course, other materials having similar functions, such as FR4 fiberglass board, may be used. Between the support coating 2 and the flexible printed circuit board 1, an adhesive layer 3 can be adhered to bond the two. The adhesive layer 3 can be a conventional adhesive material, and any material that can adhere the support coating 2 to the flexible printed circuit board 1 can be applied. The third figure shows a cross-sectional view of the flexible printed circuit board 1 and the support coating 2 bonded by the adhesive layer 3. i After the above steps are completed, the flexible printed circuit board 1 is then subjected to a molding step (step 103). This forming step can be formed by conventional milling or die punching. After the flexible printed circuit board 1 completes the molding step, the entire flexible printed circuit board 1 together with the respective electronic component positioning regions 11 remains on the adhesive layer 3 of the support layer 2 (step 104). Then, after a simple leveling process (step 105), the flexible printed circuit board 1 can be subjected to a solder paste (welding material) step (step 106) to print the solder paste according to a predetermined pattern. Formed on the soldering surface of the soft 1301391 printed circuit board.
性印刷電路基板1之預定位置上（步^ 步驟時，本發明皆不需使用治具。 即可以習知之技術將 在完成上述一序列之步驟之後，κ 該支撐覆層2及黏著層3予以去除(步驟1〇9)。最後，可 進行成品之檢查（步驟110)。 第四圖所示係顯示本發明第二實施例之軟性電路板零 件組裝方法之流程圖。在此一實施例中，其大部份之步驟 皆與苐一圖所示之實施例流程相同，故相同之步驟乃標示 以相同之步驟編號。 在第一圖所示之實施例流程中，其步驟106中係以錫 貧作為焊著材料依一預定圖型印刷形成於該軟性印刷電路 基板之焊著面，再於步驟108中以迴焊方式使該軟性印刷鲁 電路基板1上之錫膏加熱，使電子元件焊固於該軟性印刷 電路基板1之預定位置上。而在本發明之第二實施例中（ 參閱第四圖所示），其係在步驟l〇6a中以一般電路元件構 裝方式將焊著材料形成於該軟性印刷電路基板之焊著面， 而在步驟108a中以烘烤（Curing)方式使電子元件焊固於該 軟性印刷電路基板之預定位置。 藉由以上之實施例說明可知，本發明所提供之軟性電 路板之零件組裝方法確能在不需使用特定之治具之狀況下 •1301391 ，即可元成整個軟性電路板之電子元件之組裝，除了可減 少特定治具之設備成本、簡化製程之外，更降低了電子元 件受到治具損傷的風險，故本發明確具高度的產業利用價 值。 惟以上之實^例說明，僅為本發明之較佳實施例說明 凡精於此項技術者當可依據本發明之上述實施例說明而 作其它種種之改良及變化。然而這些依據本發明實施例所 作的種種改良及變化，當仍屬於本發明之發明精神及以下 所界定之專利範圍内。 【圖式簡單說明】 第一圖係顯示本發明第一實施例之軟性電路板零件組裝方 法之流程圖； 第二圖係顯示在採用本發明技術時所製備之一軟性印刷電 路基板之立體示意圖； 第三圖係顯示本發明中將軟性印刷電路基板與支揮覆層藉 由黏著層黏著結合時之剖視圖； 胃 第四圖係顯示本發明第二實施例之軟性電路板零件組裴方 法之流程圖。 【圖式各元件符號之說明】 I 軟性印刷電路基板 II 電子元件定位區域 焊著區域 11 • 1301391 13 光學參考點 2 支撐覆層 3 黏著層The predetermined position of the printed circuit board 1 (the step of the step, the present invention does not need to use a jig. That is, the conventional technique will be after the step of completing the above sequence, the support layer 2 and the adhesive layer 3 are given It is removed (step 1〇9). Finally, the inspection of the finished product can be performed (step 110). The fourth figure shows a flow chart showing the method of assembling the flexible circuit board component of the second embodiment of the present invention. In this embodiment Most of the steps are the same as those of the embodiment shown in the figure, so the same steps are denoted by the same step numbers. In the embodiment flow shown in the first figure, the step 106 is The tin-lean is formed as a soldering material on a soldering surface of the flexible printed circuit board according to a predetermined pattern, and in step 108, the solder paste on the flexible printed circuit board 1 is heated by reflowing to make the electronic component Soldering at a predetermined position on the flexible printed circuit board 1. In the second embodiment of the present invention (refer to the fourth figure), it is soldered in a general circuit component configuration in step 〇6a. Material formation The soft printed circuit board is soldered to the surface, and in step 108a, the electronic component is soldered to a predetermined position of the flexible printed circuit board. The above embodiments show that the present invention provides The assembly method of the flexible circuit board can indeed assemble the electronic components of the entire flexible circuit board without using a specific jig, 1301391, in addition to reducing the equipment cost of the specific fixture and simplifying the process. In addition, the risk of damage to the electronic component is reduced, so the present invention has a high industrial utilization value. However, the above description is merely illustrative of the preferred embodiment of the present invention. Various other modifications and changes can be made in accordance with the above-described embodiments of the present invention. However, various modifications and changes made in accordance with the embodiments of the present invention remain within the scope of the inventive concept and the patents defined below. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing shows a flow chart of a method for assembling a flexible circuit board component according to a first embodiment of the present invention; The figure shows a schematic view of a flexible printed circuit board prepared by using the technique of the present invention; the third figure shows a cross-sectional view of the flexible printed circuit board and the support layer bonded by an adhesive layer in the present invention; The fourth figure is a flow chart showing a method of assembling a flexible circuit board component according to a second embodiment of the present invention. [Description of each component symbol] 1. Flexible printed circuit board II Electronic component positioning area welding area 11 • 1301391 13 Optical Reference point 2 support coating 3 adhesive layer