TW200520221A - Method of manufacturing a semiconductor device with a bipolar transistor and device with a bipolar transistor - Google Patents

Method of manufacturing a semiconductor device with a bipolar transistor and device with a bipolar transistor

Info

Publication number
TW200520221A
TW200520221A TW093122783A TW93122783A TW200520221A TW 200520221 A TW200520221 A TW 200520221A TW 093122783 A TW093122783 A TW 093122783A TW 93122783 A TW93122783 A TW 93122783A TW 200520221 A TW200520221 A TW 200520221A
Authority
TW
Taiwan
Prior art keywords
stack
silicon region
bipolar transistor
side face
silicides
Prior art date
Application number
TW093122783A
Other languages
English (en)
Inventor
Francois Igor Neuilly
Johannes Josephus Theodorus Marinus Donkers
Eyup Aksen
Joost Melai
Yukiko Furukawa
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200520221A publication Critical patent/TW200520221A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66272Silicon vertical transistors
    • H01L29/66287Silicon vertical transistors with a single crystalline emitter, collector or base including extrinsic, link or graft base formed on the silicon substrate, e.g. by epitaxy, recrystallisation, after insulating device isolation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41708Emitter or collector electrodes for bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66242Heterojunction transistors [HBT]
TW093122783A 2003-08-01 2004-07-29 Method of manufacturing a semiconductor device with a bipolar transistor and device with a bipolar transistor TW200520221A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03102405 2003-08-01

Publications (1)

Publication Number Publication Date
TW200520221A true TW200520221A (en) 2005-06-16

Family

ID=34112485

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122783A TW200520221A (en) 2003-08-01 2004-07-29 Method of manufacturing a semiconductor device with a bipolar transistor and device with a bipolar transistor

Country Status (5)

Country Link
EP (1) EP1654755A1 (zh)
JP (1) JP2007501512A (zh)
KR (1) KR20060056971A (zh)
TW (1) TW200520221A (zh)
WO (1) WO2005013350A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007000693A2 (en) * 2005-06-27 2007-01-04 Nxp B.V. Semiconductor device and method of manufacturing such a device
ATE496393T1 (de) 2005-11-21 2011-02-15 Nxp Bv Verfahren zur herstellung eines halbleiterbauelements und mit einem solchen verfahren erhaltenes halbleiterbauelement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4932981B2 (ja) 2000-01-11 2012-05-16 ルネサスエレクトロニクス株式会社 バイポーラトランジスタおよびその製造方法
EP1137073A1 (de) * 2000-03-24 2001-09-26 Infineon Technologies AG Heterobipolar-Transistor mit T-förmigem Emitteranschlusskontakt und Herstellungsverfahren dafür
JP3528756B2 (ja) * 2000-05-12 2004-05-24 松下電器産業株式会社 半導体装置
US6605519B2 (en) * 2001-05-02 2003-08-12 Unaxis Usa, Inc. Method for thin film lift-off processes using lateral extended etching masks and device

Also Published As

Publication number Publication date
WO2005013350A1 (en) 2005-02-10
JP2007501512A (ja) 2007-01-25
KR20060056971A (ko) 2006-05-25
EP1654755A1 (en) 2006-05-10

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