TW200520040A - Cassette table and wafer-inspecting apparatus - Google Patents
Cassette table and wafer-inspecting apparatusInfo
- Publication number
- TW200520040A TW200520040A TW093135633A TW93135633A TW200520040A TW 200520040 A TW200520040 A TW 200520040A TW 093135633 A TW093135633 A TW 093135633A TW 93135633 A TW93135633 A TW 93135633A TW 200520040 A TW200520040 A TW 200520040A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- cassette
- opening part
- pushing means
- cassette table
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
Abstract
The cassette table (2) includes: plural wafers 5 each having an orientation flat part in a laminating direction; a first opening part to retrieve/dispose said wafer; a cassette 6 having a second opening part disposed opposite to said first opening part; first pushing means (803, 804) in the cassette for retrieval/disposition to push/press said wafer through said second opening part; and second pushing means (903, 904) in the cassette for retrieval/disposition to push/press said wafer through said first opening part. Any one of said first pushing means and said second pushing means pushes/presses the orientation flat part, and the other one pushes/presses the peripheral edge of the said wafer, so as to hold the wafer.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003400726A JP2005166758A (en) | 2003-11-28 | 2003-11-28 | Cassette base and wafer inspecting device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200520040A true TW200520040A (en) | 2005-06-16 |
Family
ID=34724879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093135633A TW200520040A (en) | 2003-11-28 | 2004-11-19 | Cassette table and wafer-inspecting apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005166758A (en) |
KR (1) | KR20050052350A (en) |
CN (1) | CN100413048C (en) |
TW (1) | TW200520040A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011014582A (en) * | 2009-06-30 | 2011-01-20 | Tesetsuku:Kk | Electronic component carrier |
JP5889581B2 (en) * | 2010-09-13 | 2016-03-22 | 東京エレクトロン株式会社 | Wafer inspection equipment |
JP5682421B2 (en) * | 2011-04-01 | 2015-03-11 | セイコーエプソン株式会社 | Printing device |
CN111960313A (en) * | 2020-07-21 | 2020-11-20 | 沈阳芯源微电子设备有限公司 | Substrate lifting mechanism |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065570A (en) * | 1992-06-17 | 1994-01-14 | Ratsupu Master S F T Kk | Mechanism for positioning orientation flat of semiconductor wafer |
JPH08139162A (en) * | 1994-11-11 | 1996-05-31 | Toshiba Corp | Transfer device and method for positioning wafer |
WO1997045861A1 (en) * | 1996-05-28 | 1997-12-04 | Holtronic Technologies Ltd. | Device for gripping and holding a substrate |
JPH11121585A (en) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | Wafer carrier |
JP2002270672A (en) * | 2001-03-09 | 2002-09-20 | Olympus Optical Co Ltd | Method of alignment and substrate-inspecting apparatus |
-
2003
- 2003-11-28 JP JP2003400726A patent/JP2005166758A/en active Pending
-
2004
- 2004-11-19 TW TW093135633A patent/TW200520040A/en unknown
- 2004-11-23 KR KR1020040096056A patent/KR20050052350A/en not_active Application Discontinuation
- 2004-11-26 CN CNB2004100958892A patent/CN100413048C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20050052350A (en) | 2005-06-02 |
CN100413048C (en) | 2008-08-20 |
JP2005166758A (en) | 2005-06-23 |
CN1622306A (en) | 2005-06-01 |
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