TW200519346A - Nanostructure augmentation of surfaces for enhanced thermal transfer - Google Patents

Nanostructure augmentation of surfaces for enhanced thermal transfer

Info

Publication number
TW200519346A
TW200519346A TW093128074A TW93128074A TW200519346A TW 200519346 A TW200519346 A TW 200519346A TW 093128074 A TW093128074 A TW 093128074A TW 93128074 A TW93128074 A TW 93128074A TW 200519346 A TW200519346 A TW 200519346A
Authority
TW
Taiwan
Prior art keywords
nanostructure
augmentation
thermal transfer
enhanced thermal
nanostructures
Prior art date
Application number
TW093128074A
Other languages
English (en)
Inventor
Ju-Hyung Lee
Nasreen G Chopra
Original Assignee
Koila Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koila Inc filed Critical Koila Inc
Publication of TW200519346A publication Critical patent/TW200519346A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0081—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Thermal Sciences (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW093128074A 2003-09-16 2004-09-16 Nanostructure augmentation of surfaces for enhanced thermal transfer TW200519346A (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US50359103P 2003-09-16 2003-09-16
US50361203P 2003-09-16 2003-09-16
US50361303P 2003-09-16 2003-09-16
US53224403P 2003-12-23 2003-12-23
US54470904P 2004-02-13 2004-02-13
US56018004P 2004-04-06 2004-04-06

Publications (1)

Publication Number Publication Date
TW200519346A true TW200519346A (en) 2005-06-16

Family

ID=34382307

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093128074A TW200519346A (en) 2003-09-16 2004-09-16 Nanostructure augmentation of surfaces for enhanced thermal transfer
TW093128070A TW200516100A (en) 2003-09-16 2004-09-16 Nano-composite materials for thermal management applications

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW093128070A TW200516100A (en) 2003-09-16 2004-09-16 Nano-composite materials for thermal management applications

Country Status (2)

Country Link
TW (2) TW200519346A (zh)
WO (2) WO2005028549A2 (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US8062554B2 (en) * 2005-02-04 2011-11-22 Raytheon Company System and methods of dispersion of nanostructures in composite materials
US9771264B2 (en) 2005-10-25 2017-09-26 Massachusetts Institute Of Technology Controlled-orientation films and nanocomposites including nanotubes or other nanostructures
DE102006010232A1 (de) 2006-03-02 2007-09-06 Schunk Kohlenstofftechnik Gmbh Verfahren zur Herstellung eines Kühlkörpers sowie Kühlkörper
CN100437013C (zh) * 2006-03-07 2008-11-26 天津大学 一种蒸发器
EP2024283A2 (en) 2006-05-19 2009-02-18 Massachusetts Institute of Technology Continuous process for the production of nanostructures including nanotubes
US8337979B2 (en) 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
KR100818273B1 (ko) 2006-09-04 2008-04-01 삼성전자주식회사 기판 사이의 온도 차이를 줄이는 방법 및 이를 이용한 유체반응 장치
WO2008049015A2 (en) 2006-10-17 2008-04-24 Purdue Research Foundation Electrothermal interface material enhancer
JP5201367B2 (ja) * 2007-03-23 2013-06-05 帝人株式会社 熱硬化性樹脂複合組成物、樹脂成形体およびその製造方法
US8636972B1 (en) 2007-07-31 2014-01-28 Raytheon Company Making a nanomaterial composite
GB0715990D0 (en) * 2007-08-16 2007-09-26 Airbus Uk Ltd Method and apparatus for manufacturing a component from a composite material
US8919428B2 (en) 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US8541058B2 (en) 2009-03-06 2013-09-24 Timothy S. Fisher Palladium thiolate bonding of carbon nanotubes
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US8541933B2 (en) * 2010-01-12 2013-09-24 GE Lighting Solutions, LLC Transparent thermally conductive polymer composites for light source thermal management
US8668356B2 (en) * 2010-04-02 2014-03-11 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
FR2958407B1 (fr) * 2010-04-02 2012-12-28 Snecma Procede d'analyse d'une pluralite de particules ferromagnetiques
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
US9460985B2 (en) 2013-01-04 2016-10-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses having a jet orifice surface with alternating vapor guide channels
US9484283B2 (en) 2013-01-04 2016-11-01 Toyota Motor Engineering & Manufacturing North America Inc. Modular jet impingement cooling apparatuses with exchangeable jet plates
WO2014134484A1 (en) 2013-02-28 2014-09-04 N12 Technologies, Inc. Cartridge-based dispensing of nanostructure films
US8981556B2 (en) 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
US9247679B2 (en) 2013-05-24 2016-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement coolers and power electronics modules comprising the same
US9803938B2 (en) 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
CN105086912B (zh) * 2015-09-06 2017-07-04 安徽工业大学 一种锡酸锶纳米棒复合电子封装材料
TWI721077B (zh) * 2015-12-28 2021-03-11 日商日立造船股份有限公司 奈米碳管複合材料及奈米碳管複合材料的製造方法
WO2017210238A1 (en) 2016-05-31 2017-12-07 Massachusetts Institute Of Technology Composite articles comprising non-linear elongated nanostructures and associated methods
WO2019055155A1 (en) 2017-09-15 2019-03-21 Massachusetts Institute Of Technology LOW-RATE MANUFACTURE OF COMPOSITE MATERIAL DEFECTS
WO2019108616A1 (en) 2017-11-28 2019-06-06 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods for energy storage and/or use
CN111891399B (zh) * 2020-06-18 2023-06-20 北京遥感设备研究所 一种变成分铝合金高强高导热多功能集成结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780101A (en) * 1995-02-17 1998-07-14 Arizona Board Of Regents On Behalf Of The University Of Arizona Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide
US5946930A (en) * 1997-03-26 1999-09-07 Anthony; Michael M. Self-cooling beverage and food container using fullerene nanotubes
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
DE10113587A1 (de) * 2001-03-20 2002-10-02 Morphochem Ag Verfahren zur Herstellung von substituierten Pyrrolen
US6965513B2 (en) * 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
US6713519B2 (en) * 2001-12-21 2004-03-30 Battelle Memorial Institute Carbon nanotube-containing catalysts, methods of making, and reactions catalyzed over nanotube catalysts
KR100873630B1 (ko) * 2002-01-16 2008-12-12 삼성에스디아이 주식회사 방열 구조체 및 그의 제조방법

Also Published As

Publication number Publication date
WO2005028549A3 (en) 2005-08-18
WO2005028549A2 (en) 2005-03-31
WO2005029555A3 (en) 2005-07-07
WO2005029555A2 (en) 2005-03-31
TW200516100A (en) 2005-05-16

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