WO2005029555A3 - Nanostructure augmentation of surfaces for enhanced thermal transfer - Google Patents
Nanostructure augmentation of surfaces for enhanced thermal transfer Download PDFInfo
- Publication number
- WO2005029555A3 WO2005029555A3 PCT/US2004/030734 US2004030734W WO2005029555A3 WO 2005029555 A3 WO2005029555 A3 WO 2005029555A3 US 2004030734 W US2004030734 W US 2004030734W WO 2005029555 A3 WO2005029555 A3 WO 2005029555A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- nanostructure
- augmentation
- thermal transfer
- nanostructures
- enhanced thermal
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0081—Thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50361203P | 2003-09-16 | 2003-09-16 | |
US50361303P | 2003-09-16 | 2003-09-16 | |
US50359103P | 2003-09-16 | 2003-09-16 | |
US60/503,612 | 2003-09-16 | ||
US60/503,613 | 2003-09-16 | ||
US60/503,591 | 2003-09-16 | ||
US53224403P | 2003-12-23 | 2003-12-23 | |
US60/532,244 | 2003-12-23 | ||
US54470904P | 2004-02-13 | 2004-02-13 | |
US60/544,709 | 2004-02-13 | ||
US56018004P | 2004-04-06 | 2004-04-06 | |
US60/560,180 | 2004-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005029555A2 WO2005029555A2 (en) | 2005-03-31 |
WO2005029555A3 true WO2005029555A3 (en) | 2005-07-07 |
Family
ID=34382307
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/030416 WO2005028549A2 (en) | 2003-09-16 | 2004-09-16 | Nano-composite materials for thermal management applications |
PCT/US2004/030734 WO2005029555A2 (en) | 2003-09-16 | 2004-09-16 | Nanostructure augmentation of surfaces for enhanced thermal transfer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/030416 WO2005028549A2 (en) | 2003-09-16 | 2004-09-16 | Nano-composite materials for thermal management applications |
Country Status (2)
Country | Link |
---|---|
TW (2) | TW200519346A (en) |
WO (2) | WO2005028549A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US8062554B2 (en) * | 2005-02-04 | 2011-11-22 | Raytheon Company | System and methods of dispersion of nanostructures in composite materials |
US9771264B2 (en) | 2005-10-25 | 2017-09-26 | Massachusetts Institute Of Technology | Controlled-orientation films and nanocomposites including nanotubes or other nanostructures |
DE102006010232A1 (en) | 2006-03-02 | 2007-09-06 | Schunk Kohlenstofftechnik Gmbh | Method for producing a heat sink and heat sink |
CN100437013C (en) * | 2006-03-07 | 2008-11-26 | 天津大学 | Heating tube with nanometer coating on internal surface and evaporator |
JP2009537339A (en) | 2006-05-19 | 2009-10-29 | マサチューセッツ・インスティテュート・オブ・テクノロジー | Nanostructure reinforced composite and nanostructure strengthening method |
US8337979B2 (en) | 2006-05-19 | 2012-12-25 | Massachusetts Institute Of Technology | Nanostructure-reinforced composite articles and methods |
KR100818273B1 (en) | 2006-09-04 | 2008-04-01 | 삼성전자주식회사 | Method of reducing temperature difference between a pair of substrates and fluid reaction device using the same |
US8220530B2 (en) | 2006-10-17 | 2012-07-17 | Purdue Research Foundation | Electrothermal interface material enhancer |
JP5201367B2 (en) * | 2007-03-23 | 2013-06-05 | 帝人株式会社 | Thermosetting resin composite composition, resin molded body and method for producing the same |
US8636972B1 (en) | 2007-07-31 | 2014-01-28 | Raytheon Company | Making a nanomaterial composite |
GB0715990D0 (en) * | 2007-08-16 | 2007-09-26 | Airbus Uk Ltd | Method and apparatus for manufacturing a component from a composite material |
US8919428B2 (en) | 2007-10-17 | 2014-12-30 | Purdue Research Foundation | Methods for attaching carbon nanotubes to a carbon substrate |
US8541058B2 (en) | 2009-03-06 | 2013-09-24 | Timothy S. Fisher | Palladium thiolate bonding of carbon nanotubes |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US8541933B2 (en) * | 2010-01-12 | 2013-09-24 | GE Lighting Solutions, LLC | Transparent thermally conductive polymer composites for light source thermal management |
US8668356B2 (en) | 2010-04-02 | 2014-03-11 | GE Lighting Solutions, LLC | Lightweight heat sinks and LED lamps employing same |
FR2958407B1 (en) * | 2010-04-02 | 2012-12-28 | Snecma | PROCESS FOR ANALYZING A PLURALITY OF FERROMAGNETIC PARTICLES |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US9484283B2 (en) | 2013-01-04 | 2016-11-01 | Toyota Motor Engineering & Manufacturing North America Inc. | Modular jet impingement cooling apparatuses with exchangeable jet plates |
US9460985B2 (en) | 2013-01-04 | 2016-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses having a jet orifice surface with alternating vapor guide channels |
ES2663666T3 (en) | 2013-02-28 | 2018-04-16 | N12 Technologies, Inc. | Nanostructure film cartridge based dispensing |
US8981556B2 (en) | 2013-03-19 | 2015-03-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having non-uniform jet orifice sizes |
US9247679B2 (en) | 2013-05-24 | 2016-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement coolers and power electronics modules comprising the same |
US9257365B2 (en) | 2013-07-05 | 2016-02-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies and power electronics modules having multiple-porosity structures |
US9803938B2 (en) | 2013-07-05 | 2017-10-31 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies having porous three dimensional surfaces |
CN105086912B (en) * | 2015-09-06 | 2017-07-04 | 安徽工业大学 | A kind of stronitum stannate nanometer rods composite electron encapsulating material |
JP6802808B2 (en) | 2015-12-28 | 2020-12-23 | 日立造船株式会社 | Manufacturing method of carbon nanotube composite material and carbon nanotube composite material |
CN109311239A (en) | 2016-05-31 | 2019-02-05 | 麻省理工学院 | Composite article including non-linear elongated nanostructure is with and related methods |
US20190085138A1 (en) | 2017-09-15 | 2019-03-21 | Massachusetts Institute Of Technology | Low-defect fabrication of composite materials |
US11031657B2 (en) | 2017-11-28 | 2021-06-08 | Massachusetts Institute Of Technology | Separators comprising elongated nanostructures and associated devices and methods, including devices and methods for energy storage and/or use |
CN111891399B (en) * | 2020-06-18 | 2023-06-20 | 北京遥感设备研究所 | Become multi-functional integrated structure of high-strength high heat conduction of branch aluminum alloy |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5946930A (en) * | 1997-03-26 | 1999-09-07 | Anthony; Michael M. | Self-cooling beverage and food container using fullerene nanotubes |
US5965267A (en) * | 1995-02-17 | 1999-10-12 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide and the nanoencapsulates and nanotubes formed thereby |
US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
US20030116503A1 (en) * | 2001-12-21 | 2003-06-26 | Yong Wang | Carbon nanotube-containing structures, methods of making, and processes using same |
KR20030062116A (en) * | 2002-01-16 | 2003-07-23 | 삼성에스디아이 주식회사 | Heat radiator structure and manufacturing method therof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10113587A1 (en) * | 2001-03-20 | 2002-10-02 | Morphochem Ag | Process for the preparation of substituted pyrroles |
US6965513B2 (en) * | 2001-12-20 | 2005-11-15 | Intel Corporation | Carbon nanotube thermal interface structures |
-
2004
- 2004-09-16 TW TW093128074A patent/TW200519346A/en unknown
- 2004-09-16 WO PCT/US2004/030416 patent/WO2005028549A2/en active Application Filing
- 2004-09-16 WO PCT/US2004/030734 patent/WO2005029555A2/en active Application Filing
- 2004-09-16 TW TW093128070A patent/TW200516100A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5965267A (en) * | 1995-02-17 | 1999-10-12 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide and the nanoencapsulates and nanotubes formed thereby |
US5946930A (en) * | 1997-03-26 | 1999-09-07 | Anthony; Michael M. | Self-cooling beverage and food container using fullerene nanotubes |
US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
US20030116503A1 (en) * | 2001-12-21 | 2003-06-26 | Yong Wang | Carbon nanotube-containing structures, methods of making, and processes using same |
KR20030062116A (en) * | 2002-01-16 | 2003-07-23 | 삼성에스디아이 주식회사 | Heat radiator structure and manufacturing method therof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
Also Published As
Publication number | Publication date |
---|---|
TW200519346A (en) | 2005-06-16 |
WO2005028549A2 (en) | 2005-03-31 |
TW200516100A (en) | 2005-05-16 |
WO2005028549A3 (en) | 2005-08-18 |
WO2005029555A2 (en) | 2005-03-31 |
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