WO2005117917A3 - Thermal management system and computer arrangement - Google Patents

Thermal management system and computer arrangement Download PDF

Info

Publication number
WO2005117917A3
WO2005117917A3 PCT/US2005/011746 US2005011746W WO2005117917A3 WO 2005117917 A3 WO2005117917 A3 WO 2005117917A3 US 2005011746 W US2005011746 W US 2005011746W WO 2005117917 A3 WO2005117917 A3 WO 2005117917A3
Authority
WO
WIPO (PCT)
Prior art keywords
management system
thermal management
fluid
cooling device
cooling devices
Prior art date
Application number
PCT/US2005/011746
Other languages
French (fr)
Other versions
WO2005117917A2 (en
Inventor
Viktor Frul
Original Assignee
Thermonix Llc
Viktor Frul
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermonix Llc, Viktor Frul filed Critical Thermonix Llc
Publication of WO2005117917A2 publication Critical patent/WO2005117917A2/en
Publication of WO2005117917A3 publication Critical patent/WO2005117917A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2204/00—End product comprising different layers, coatings or parts of cermet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

It is the object of the present invention to provide a low weight, compact, low vertical profile thermal management system for removing heat from electronic components. The thermal management system comprises of a plurality of 'flow-through' type cooling devices, a source of filtered pressurized fluid suitable for use as a coolant, and a fluid delivering device that supplies the cooling devices with fluid. A preferred fluid is air, such as a filtered pressurized air. The cooling device is comprised of a high conductivity metal matrix composite heat spreader, a miniature heat sink, preferably of the same material, a permeable heat exchanger with high specific surface, and a closure that provides structural integrity of the cooling device.
PCT/US2005/011746 2004-04-07 2005-04-07 Thermal management system and computer arrangement WO2005117917A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US56038204P 2004-04-07 2004-04-07
US60/560,382 2004-04-07
US59125404P 2004-07-26 2004-07-26
US60/591,254 2004-07-26

Publications (2)

Publication Number Publication Date
WO2005117917A2 WO2005117917A2 (en) 2005-12-15
WO2005117917A3 true WO2005117917A3 (en) 2007-11-01

Family

ID=35463336

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/011746 WO2005117917A2 (en) 2004-04-07 2005-04-07 Thermal management system and computer arrangement

Country Status (2)

Country Link
US (1) US20060011336A1 (en)
WO (1) WO2005117917A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060245946A1 (en) * 2005-04-07 2006-11-02 Eric Ingersoll Air mover for improved cooling of electronics
US7197804B2 (en) * 2005-08-29 2007-04-03 The Aerospace Corporation Method of making copper and carbon nanotube thermal conductor
US7235895B2 (en) * 2005-10-13 2007-06-26 General Electric Company Method and apparatus for gravity induced thermal energy dissipation
US7447029B2 (en) * 2006-03-14 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber for dissipation heat generated by electronic component
US20070227700A1 (en) * 2006-03-29 2007-10-04 Dimitrakopoulos Christos D VLSI chip hot-spot minimization using nanotubes
US7742297B2 (en) * 2006-04-20 2010-06-22 The Boeing Company Ceramic foam electronic component cooling
WO2007142273A1 (en) * 2006-06-08 2007-12-13 International Business Machines Corporation Highly heat conductive, flexible sheet
US8482921B2 (en) 2006-10-23 2013-07-09 Teledyne Scientific & Imaging, Llc. Heat spreader with high heat flux and high thermal conductivity
US20080225489A1 (en) * 2006-10-23 2008-09-18 Teledyne Licensing, Llc Heat spreader with high heat flux and high thermal conductivity
JP5223677B2 (en) * 2006-11-02 2013-06-26 日本電気株式会社 Semiconductor device
CN101330814B (en) * 2007-06-22 2010-11-10 富准精密工业(深圳)有限公司 Radiating device
US7916484B2 (en) * 2007-11-14 2011-03-29 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
US20090139475A1 (en) * 2007-11-30 2009-06-04 Caterpillar Inc. Engine cooling system including metal foam
US8356657B2 (en) 2007-12-19 2013-01-22 Teledyne Scientific & Imaging, Llc Heat pipe system
JP5351479B2 (en) * 2008-01-28 2013-11-27 東京エレクトロン株式会社 Cooling structure of heating source
US8247699B2 (en) * 2008-09-30 2012-08-21 Hitachi Global Storage Technologies, Netherlands B.V. Flex circuit assembly with a dummy trace between two signal traces
CN101754654A (en) * 2008-12-08 2010-06-23 富准精密工业(深圳)有限公司 Heat transfer substrate and heat dissipation device provided with same
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
US8720828B2 (en) * 2009-12-03 2014-05-13 The Boeing Company Extended plug cold plate
CN201854534U (en) * 2010-06-24 2011-06-01 景德镇正宇奈米科技有限公司 Ceramic radiation heat dissipating structure
US8811014B2 (en) 2011-12-29 2014-08-19 General Electric Company Heat exchange assembly and methods of assembling same
US8780559B2 (en) 2011-12-29 2014-07-15 General Electric Company Heat exchange assembly for use with electrical devices and methods of assembling an electrical device
JP6132228B2 (en) * 2012-02-15 2017-05-24 パナソニックＩｐマネジメント株式会社 Clothing with cooling or heating function
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader
US10090173B2 (en) * 2015-06-05 2018-10-02 International Business Machines Corporation Method of fabricating a chip module with stiffening frame and directional heat spreader
US9583408B1 (en) * 2015-08-21 2017-02-28 International Business Machines Corporation Reducing directional stress in an orthotropic encapsulation member of an electronic package
KR102433388B1 (en) * 2015-10-22 2022-08-17 삼성전자주식회사 Outdoor unit of air conditioner, cooling unit applying the same and method of manufacturing cooling unit
EP3618583A4 (en) * 2017-04-25 2021-01-20 KYOCERA Corporation Electronic element mounting substrate, electronic device, and electronic module
CN112584665B (en) * 2019-09-27 2022-02-15 杭州海康威视数字技术股份有限公司 Heat dissipation structure of electronic equipment and construction method thereof
US11710723B2 (en) * 2021-08-05 2023-07-25 Kambix Innovations, Llc Thermal management of three-dimensional integrated circuits
CN115579334A (en) * 2022-10-10 2023-01-06 南方电网科学研究院有限责任公司 Heat dissipation device used in gas-liquid mixed medium and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592363A (en) * 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US6333551B1 (en) * 2000-09-07 2001-12-25 International Business Machines Corporation Surface profiling in electronic packages for reducing thermally induced interfacial stresses
US20020003691A1 (en) * 2000-03-14 2002-01-10 Eesley Gary Lynn High performance heat exchange assembly
US20020096428A1 (en) * 2000-05-31 2002-07-25 Tim Scott Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233954A (en) * 1989-08-11 1993-08-10 Mechanology Toroidal hyper-expansion rotary engine, compressor, expander, pump and method
JP2746279B2 (en) * 1990-06-18 1998-05-06 日本タングステン 株式会社 Substrate material for semiconductor device and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592363A (en) * 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US20020003691A1 (en) * 2000-03-14 2002-01-10 Eesley Gary Lynn High performance heat exchange assembly
US20020096428A1 (en) * 2000-05-31 2002-07-25 Tim Scott Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications
US6333551B1 (en) * 2000-09-07 2001-12-25 International Business Machines Corporation Surface profiling in electronic packages for reducing thermally induced interfacial stresses

Also Published As

Publication number Publication date
WO2005117917A2 (en) 2005-12-15
US20060011336A1 (en) 2006-01-19

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