TW200514862A - Extended life sputter target - Google Patents

Extended life sputter target

Info

Publication number
TW200514862A
TW200514862A TW093126906A TW93126906A TW200514862A TW 200514862 A TW200514862 A TW 200514862A TW 093126906 A TW093126906 A TW 093126906A TW 93126906 A TW93126906 A TW 93126906A TW 200514862 A TW200514862 A TW 200514862A
Authority
TW
Taiwan
Prior art keywords
backing plate
target
cylindrical recess
target insert
insert
Prior art date
Application number
TW093126906A
Other languages
English (en)
Other versions
TWI352130B (en
Inventor
Rene Perrot
Thomas J Hunt
Holger J Koenigsmann
Paul S Gilman
Original Assignee
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc filed Critical Praxair Technology Inc
Publication of TW200514862A publication Critical patent/TW200514862A/zh
Application granted granted Critical
Publication of TWI352130B publication Critical patent/TWI352130B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
TW093126906A 2003-09-09 2004-09-06 Extended life sputter target TWI352130B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/657,085 US20050051606A1 (en) 2003-09-09 2003-09-09 Method of manufacturing an extended life sputter target assembly and product thereof

Publications (2)

Publication Number Publication Date
TW200514862A true TW200514862A (en) 2005-05-01
TWI352130B TWI352130B (en) 2011-11-11

Family

ID=34226490

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126906A TWI352130B (en) 2003-09-09 2004-09-06 Extended life sputter target

Country Status (10)

Country Link
US (1) US20050051606A1 (zh)
EP (1) EP1670967B1 (zh)
JP (1) JP4902860B2 (zh)
KR (1) KR101117415B1 (zh)
CN (1) CN1849408A (zh)
DE (1) DE602004023630D1 (zh)
IL (1) IL173989A (zh)
SG (1) SG149008A1 (zh)
TW (1) TWI352130B (zh)
WO (1) WO2005026406A1 (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100762084B1 (ko) * 2003-12-25 2007-10-01 닛코킨조쿠 가부시키가이샤 동 또는 동합금 타겟트/동합금 백킹 플레이트 조립체
US8123107B2 (en) * 2004-05-25 2012-02-28 Praxair S.T. Technology, Inc. Method for forming sputter target assemblies
US20070251819A1 (en) * 2006-05-01 2007-11-01 Kardokus Janine K Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets
US8206646B2 (en) * 2006-12-22 2012-06-26 Praxair Tecnology, Inc. Method for consolidating and diffusion-bonding powder metallurgy sputtering target
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
JP2009144186A (ja) * 2007-12-12 2009-07-02 Takeuchi Kogyo:Kk スパッタリング用ターゲット部材およびその製造法
EP2318171B1 (en) * 2008-07-07 2017-09-06 Constellium Switzerland AG A fusion welding process to join aluminium and titanium
CN101745734B (zh) * 2009-12-18 2011-09-07 北京有色金属研究总院 一种大面积靶材与背板的快速焊接方法
US8992747B2 (en) * 2010-03-12 2015-03-31 Applied Materials, Inc. Apparatus and method for improved darkspace gap design in RF sputtering chamber
CN101811209A (zh) * 2010-04-14 2010-08-25 宁波江丰电子材料有限公司 靶材组件的制作方法
CN102345100B (zh) * 2010-07-29 2013-10-09 鸿富锦精密工业（深圳）有限公司 铝铈金属靶材及利用该铝铈金属靶材制作铝铈膜的方法
KR101988391B1 (ko) 2011-06-27 2019-06-12 솔레라스 리미티드 스퍼터링 타겟
JP2013032586A (ja) * 2011-07-07 2013-02-14 Sumitomo Chemical Co Ltd スパッタリングターゲット、ターゲット材およびバッキングプレート
WO2013122927A1 (en) * 2012-02-14 2013-08-22 Tosoh Smd, Inc. Low deflection sputtering target assembly and methods of making same
CN103343321A (zh) * 2012-03-12 2013-10-09 有研亿金新材料股份有限公司 一种制造溅射靶材的方法
TW201544615A (zh) * 2014-05-30 2015-12-01 Tosoh Smd Inc 射頻辨識金屬內安裝以及用於濺鍍標靶之隔離
JP2015229782A (ja) * 2014-06-04 2015-12-21 日新電機株式会社 スパッタリングターゲット収納容器、およびスパッタリング装置
CN107851548A (zh) * 2015-07-24 2018-03-27 应用材料公司 热敏粘结的金属靶的冷却和利用优化
JP6271798B2 (ja) * 2016-07-13 2018-01-31 住友化学株式会社 スパッタリングターゲットの製造方法
JP6277309B2 (ja) 2016-07-13 2018-02-07 住友化学株式会社 スパッタリングターゲットの製造方法およびスパッタリングターゲット
CN110892089B (zh) * 2017-08-01 2022-05-24 出光兴产株式会社 溅射靶、氧化物半导体膜的成膜方法以及背板
CN110029316A (zh) * 2018-01-11 2019-07-19 合肥江丰电子材料有限公司 长寿命lcd靶材组件及其形成方法
JPWO2020195030A1 (ja) 2019-03-28 2021-09-13 Ｊｘ金属株式会社 スパッタリングターゲット製品及びスパッタリングターゲット製品の再生品を製造する方法
US11754691B2 (en) 2019-09-27 2023-09-12 Taiwan Semiconductor Manufacturing Company Ltd. Target measurement device and method for measuring a target
US11492699B2 (en) * 2021-02-17 2022-11-08 Applied Materials, Inc. Substrate temperature non-uniformity reduction over target life using spacing compensation
CN113275731A (zh) * 2021-05-19 2021-08-20 宁波江丰电子材料股份有限公司 一种钼靶材与背板的扩散焊接方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215639A (en) * 1984-10-09 1993-06-01 Genus, Inc. Composite sputtering target structures and process for producing such structures
US5226469A (en) * 1987-07-01 1993-07-13 Kawasaki Jukogyo Kabushiki Kaisha Composite structures and methods of manufacturing the same
JPH06128738A (ja) * 1992-10-20 1994-05-10 Mitsubishi Kasei Corp スパッタリングターゲットの製造方法
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
US6073830A (en) * 1995-04-21 2000-06-13 Praxair S.T. Technology, Inc. Sputter target/backing plate assembly and method of making same
US5674367A (en) * 1995-12-22 1997-10-07 Sony Corporation Sputtering target having a shrink fit mounting ring
US5836505A (en) * 1996-05-07 1998-11-17 Commissariat A L'energie Atomique Joining by brazing of ceramic materials containing silicon carbide
US6071389A (en) * 1998-08-21 2000-06-06 Tosoh Smd, Inc. Diffusion bonded sputter target assembly and method of making
WO2000015863A1 (en) * 1998-09-11 2000-03-23 Tosoh Smd, Inc. Low temperature sputter target bonding method and target assemblies produced thereby
US6092427A (en) * 1999-09-15 2000-07-25 Praxair S.T. Technology, Inc. Method of testing a bond interface
US6599405B2 (en) * 2001-05-30 2003-07-29 Praxair S.T. Technology, Inc. Recessed sputter target

Also Published As

Publication number Publication date
WO2005026406A1 (en) 2005-03-24
US20050051606A1 (en) 2005-03-10
IL173989A0 (en) 2006-07-05
TWI352130B (en) 2011-11-11
EP1670967A4 (en) 2007-07-25
SG149008A1 (en) 2009-01-29
KR20060073616A (ko) 2006-06-28
IL173989A (en) 2010-06-16
JP4902860B2 (ja) 2012-03-21
DE602004023630D1 (de) 2009-11-26
CN1849408A (zh) 2006-10-18
JP2007505217A (ja) 2007-03-08
EP1670967A1 (en) 2006-06-21
EP1670967B1 (en) 2009-10-14
KR101117415B1 (ko) 2012-02-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees