TW200513800A - Radiation-sensitive polymer composition and pattern forming method using the same - Google Patents

Radiation-sensitive polymer composition and pattern forming method using the same

Info

Publication number
TW200513800A
TW200513800A TW093130278A TW93130278A TW200513800A TW 200513800 A TW200513800 A TW 200513800A TW 093130278 A TW093130278 A TW 093130278A TW 93130278 A TW93130278 A TW 93130278A TW 200513800 A TW200513800 A TW 200513800A
Authority
TW
Taiwan
Prior art keywords
acid
composition
radiation
polymer composition
sensitive polymer
Prior art date
Application number
TW093130278A
Other languages
English (en)
Other versions
TWI305870B (en
Inventor
Kazumi Noda
Katsuya Takemura
Yoshitaka Hamada
Mutsuo Nakashima
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200513800A publication Critical patent/TW200513800A/zh
Application granted granted Critical
Publication of TWI305870B publication Critical patent/TWI305870B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW093130278A 2003-10-07 2004-10-06 Radiation-sensitive polymer composition and pattern forming method using the same TWI305870B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003347709A JP4192068B2 (ja) 2003-10-07 2003-10-07 感放射線性樹脂組成物並びにこれを用いたパターン形成方法

Publications (2)

Publication Number Publication Date
TW200513800A true TW200513800A (en) 2005-04-16
TWI305870B TWI305870B (en) 2009-02-01

Family

ID=34419648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130278A TWI305870B (en) 2003-10-07 2004-10-06 Radiation-sensitive polymer composition and pattern forming method using the same

Country Status (4)

Country Link
US (1) US20050079443A1 (zh)
JP (1) JP4192068B2 (zh)
KR (1) KR101055534B1 (zh)
TW (1) TWI305870B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1726608A1 (en) * 2004-03-17 2006-11-29 JSR Corporation Radiation-sensitive resin composition
JP4488215B2 (ja) * 2004-08-19 2010-06-23 信越化学工業株式会社 レジスト組成物並びにこれを用いたパターン形成方法
JP2006106311A (ja) * 2004-10-05 2006-04-20 Shin Etsu Chem Co Ltd ケイ素含有レジスト組成物並びにこれを用いたパターン形成方法
US7320855B2 (en) * 2004-11-03 2008-01-22 International Business Machines Corporation Silicon containing TARC/barrier layer
JP4687898B2 (ja) * 2006-03-14 2011-05-25 信越化学工業株式会社 含フッ素ケイ素化合物、シリコーン樹脂、それを用いたレジスト組成物、及びパターン形成方法
US8945808B2 (en) * 2006-04-28 2015-02-03 International Business Machines Corporation Self-topcoating resist for photolithography
US8034532B2 (en) * 2006-04-28 2011-10-11 International Business Machines Corporation High contact angle topcoat material and use thereof in lithography process
US7951524B2 (en) * 2006-04-28 2011-05-31 International Business Machines Corporation Self-topcoating photoresist for photolithography
DE102013003329A1 (de) 2013-02-25 2014-08-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Silane, Hybridpolymere und Photolack mit Positiv-Resist Verhalten sowie Verfahren zur Herstellung
KR102032345B1 (ko) * 2016-09-28 2019-10-15 삼성에스디아이 주식회사 감광성 수지 조성물, 그로부터 형성된 경화막, 및 상기 경화막을 갖는 전자 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432257B (en) * 1997-01-31 2001-05-01 Shinetsu Chemical Co High molecular weight silicone compound, chemically amplified positive resist composition and patterning method
TW546542B (en) * 1997-08-06 2003-08-11 Shinetsu Chemical Co High molecular weight silicone compounds, resist compositions, and patterning method
US6531260B2 (en) * 2000-04-07 2003-03-11 Jsr Corporation Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition
US6623909B2 (en) * 2000-06-02 2003-09-23 Shin-Etsu Chemical Co., Ltd. Polymers, resist compositions and patterning process
JP4141625B2 (ja) 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
JP2002194085A (ja) * 2000-10-20 2002-07-10 Jsr Corp ポリシロキサン
JP4534371B2 (ja) 2001-03-16 2010-09-01 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP2002308990A (ja) 2001-04-10 2002-10-23 Jsr Corp ポリシロキサンとその製造方法および感放射線性樹脂組成物
JP2003020335A (ja) * 2001-05-01 2003-01-24 Jsr Corp ポリシロキサンおよび感放射線性樹脂組成物
DE60234409D1 (de) * 2001-06-29 2009-12-31 Jsr Corp Säuregenerator, Sulfonsäure, Sulfonsäurederivate und strahlungsempfindliche Zusammensetzung
US7217492B2 (en) * 2002-12-25 2007-05-15 Jsr Corporation Onium salt compound and radiation-sensitive resin composition

Also Published As

Publication number Publication date
US20050079443A1 (en) 2005-04-14
KR20050033822A (ko) 2005-04-13
JP4192068B2 (ja) 2008-12-03
JP2005114942A (ja) 2005-04-28
TWI305870B (en) 2009-02-01
KR101055534B1 (ko) 2011-08-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees