TW200511310A - Transplanted magnetic random access memory(MRAM) devices on thermally-sensitive substrates using laser transfer and method for making the same - Google Patents

Transplanted magnetic random access memory(MRAM) devices on thermally-sensitive substrates using laser transfer and method for making the same

Info

Publication number
TW200511310A
TW200511310A TW093116345A TW93116345A TW200511310A TW 200511310 A TW200511310 A TW 200511310A TW 093116345 A TW093116345 A TW 093116345A TW 93116345 A TW93116345 A TW 93116345A TW 200511310 A TW200511310 A TW 200511310A
Authority
TW
Taiwan
Prior art keywords
mram
transplanted
thermally
making
devices
Prior art date
Application number
TW093116345A
Other languages
English (en)
Other versions
TWI322992B (en
Inventor
Arunava Gupta
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200511310A publication Critical patent/TW200511310A/zh
Application granted granted Critical
Publication of TWI322992B publication Critical patent/TWI322992B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
TW093116345A 2003-06-12 2004-06-07 Transplanted magnetic random access memory(mram) devices on thermally-sensitive substrates using laser transfer and method for making the same TWI322992B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/459,517 US7494896B2 (en) 2003-06-12 2003-06-12 Method of forming magnetic random access memory (MRAM) devices on thermally-sensitive substrates using laser transfer

Publications (2)

Publication Number Publication Date
TW200511310A true TW200511310A (en) 2005-03-16
TWI322992B TWI322992B (en) 2010-04-01

Family

ID=33510827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116345A TWI322992B (en) 2003-06-12 2004-06-07 Transplanted magnetic random access memory(mram) devices on thermally-sensitive substrates using laser transfer and method for making the same

Country Status (7)

Country Link
US (3) US7494896B2 (zh)
EP (1) EP1631966A4 (zh)
JP (1) JP2007503129A (zh)
KR (1) KR100850190B1 (zh)
CN (1) CN101263580B (zh)
TW (1) TWI322992B (zh)
WO (1) WO2004114312A2 (zh)

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WO2008036837A2 (en) * 2006-09-20 2008-03-27 The Board Of Trustees Of The University Of Illinois Release strategies for making transferable semiconductor structures, devices and device components
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US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
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US9669613B2 (en) 2010-12-07 2017-06-06 Ipg Photonics Corporation Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated
WO2011069242A1 (en) * 2009-12-09 2011-06-16 Cooledge Lighting Inc. Semiconductor dice transfer-enabling apparatus and method for manufacturing transfer-enabling apparatus
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US8334152B2 (en) * 2009-12-18 2012-12-18 Cooledge Lighting, Inc. Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate
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WO2013089867A2 (en) 2011-12-01 2013-06-20 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
KR20150004819A (ko) 2012-03-30 2015-01-13 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 표면에 상응하는 부속체 장착가능한 전자 장치
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Also Published As

Publication number Publication date
US7494896B2 (en) 2009-02-24
US20040252559A1 (en) 2004-12-16
US20080044930A1 (en) 2008-02-21
CN101263580A (zh) 2008-09-10
EP1631966A2 (en) 2006-03-08
US7674686B2 (en) 2010-03-09
JP2007503129A (ja) 2007-02-15
KR100850190B1 (ko) 2008-08-05
WO2004114312A2 (en) 2004-12-29
WO2004114312A3 (en) 2006-10-19
CN101263580B (zh) 2011-08-24
US7888757B2 (en) 2011-02-15
TWI322992B (en) 2010-04-01
KR20060004982A (ko) 2006-01-16
US20080055790A1 (en) 2008-03-06
EP1631966A4 (en) 2010-09-08

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