TW200510575A - Plating apparatus and method - Google Patents

Plating apparatus and method

Info

Publication number
TW200510575A
TW200510575A TW093125843A TW93125843A TW200510575A TW 200510575 A TW200510575 A TW 200510575A TW 093125843 A TW093125843 A TW 093125843A TW 93125843 A TW93125843 A TW 93125843A TW 200510575 A TW200510575 A TW 200510575A
Authority
TW
Taiwan
Prior art keywords
plating liquid
plating
impurity removal
removal means
feeds
Prior art date
Application number
TW093125843A
Other languages
Chinese (zh)
Other versions
TWI373537B (en
Inventor
Souichi Obata
Yuuichi Kameyama
Original Assignee
Almex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Inc filed Critical Almex Inc
Publication of TW200510575A publication Critical patent/TW200510575A/en
Application granted granted Critical
Publication of TWI373537B publication Critical patent/TWI373537B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides a plating apparatus whose productivity is greatly improved through extension of the time intervals between maintenance works. The plating apparatus has: a plating liquid extraction and feeding means which extracts a plating liquid from areas outside each anode unit and inside each anode chamber and feeds it to other areas; a first impurity removal means which electrochemically removes impurities from the extracted and fed plating liquid; a second impurity removal means which mechanically removes impurities remaining in the plating liquid which has passed the first impurity removal means; and a plating liquid returning and feeding means which returns and feeds the plating liquid, from which the remaining impurities have been removed by the second impurity removal means, to a cathode chamber inside a plating tank and outside each sealed anode chamber structure.
TW093125843A 2003-09-02 2004-08-27 Plating apparatus and method TW200510575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003309954A JP4707941B2 (en) 2003-09-02 2003-09-02 Plating processing apparatus and plating processing method

Publications (2)

Publication Number Publication Date
TW200510575A true TW200510575A (en) 2005-03-16
TWI373537B TWI373537B (en) 2012-10-01

Family

ID=34411963

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125843A TW200510575A (en) 2003-09-02 2004-08-27 Plating apparatus and method

Country Status (4)

Country Link
JP (1) JP4707941B2 (en)
KR (1) KR101133372B1 (en)
CN (1) CN1637171A (en)
TW (1) TW200510575A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100934729B1 (en) * 2007-10-29 2009-12-30 (주)화백엔지니어링 Electroless Tin Plating Solution Impurity Removal Apparatus and Method
JP5457010B2 (en) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 Continuous plating equipment
CN102995094A (en) * 2011-09-19 2013-03-27 代芳 Method for stabilizing metal ion concentration in electroplating bath
JP2016130363A (en) * 2015-01-09 2016-07-21 Tdk株式会社 Plating apparatus
TWI615363B (en) * 2016-04-08 2018-02-21 科閎電子股份有限公司 Method for decreasing the concentration of at least one contamination cation in an electrolytic solution
CN106917132B (en) * 2017-04-27 2018-12-07 北京纽堡科技有限公司 A kind of electroplanting device
CN107723745B (en) * 2017-09-25 2019-09-17 杨家华 A kind of metallurgical electrolysis slot device
KR20190065527A (en) 2017-12-02 2019-06-12 오준혁 Rotatable folding laundry hanger
JP7061792B2 (en) * 2018-07-27 2022-05-02 日本表面化学株式会社 Manufacturing method of plating equipment and plating products
CN112941600B (en) * 2021-01-25 2024-06-04 株洲信康科技有限责任公司 Electroplating equipment for precise instrument

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554297Y2 (en) * 1976-01-29 1980-01-31
JPH0294260U (en) * 1989-01-13 1990-07-26
JP2001049499A (en) * 1999-08-12 2001-02-20 Ebara Corp Plating device
JP2001316893A (en) * 2000-05-01 2001-11-16 Shimonoseki Mekki Kk Surface treatment method and device using insoluble anode
JP2003013291A (en) * 2001-06-29 2003-01-15 Almex Inc Plating apparatus
JP4014827B2 (en) * 2001-07-25 2007-11-28 シャープ株式会社 Plating equipment

Also Published As

Publication number Publication date
TWI373537B (en) 2012-10-01
KR101133372B1 (en) 2012-04-06
KR20050024184A (en) 2005-03-10
JP4707941B2 (en) 2011-06-22
JP2005076100A (en) 2005-03-24
CN1637171A (en) 2005-07-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees