TW200510082A - Fabricating and cleaning chamber components having textured surfaces - Google Patents

Fabricating and cleaning chamber components having textured surfaces

Info

Publication number
TW200510082A
TW200510082A TW093113180A TW93113180A TW200510082A TW 200510082 A TW200510082 A TW 200510082A TW 093113180 A TW093113180 A TW 093113180A TW 93113180 A TW93113180 A TW 93113180A TW 200510082 A TW200510082 A TW 200510082A
Authority
TW
Taiwan
Prior art keywords
fabricating
textured
particles
textured surface
component
Prior art date
Application number
TW093113180A
Other languages
English (en)
Other versions
TWI302116B (en
Inventor
Brian T West
Marc O Schweitzer
Jennifer L Watia
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200510082A publication Critical patent/TW200510082A/zh
Application granted granted Critical
Publication of TWI302116B publication Critical patent/TWI302116B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning In General (AREA)
  • Treatment Of Fiber Materials (AREA)
TW093113180A 2003-09-02 2004-05-11 Fabricating and cleaning chamber components having textured surfaces TWI302116B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/653,713 US20050048876A1 (en) 2003-09-02 2003-09-02 Fabricating and cleaning chamber components having textured surfaces

Publications (2)

Publication Number Publication Date
TW200510082A true TW200510082A (en) 2005-03-16
TWI302116B TWI302116B (en) 2008-10-21

Family

ID=34217955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093113180A TWI302116B (en) 2003-09-02 2004-05-11 Fabricating and cleaning chamber components having textured surfaces

Country Status (3)

Country Link
US (3) US20050048876A1 (zh)
TW (1) TWI302116B (zh)
WO (1) WO2005021173A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416997B (zh) * 2008-06-30 2013-11-21 Lam Res Corp 多元件電極之再處理程序
CN111451190A (zh) * 2019-01-21 2020-07-28 宁波江丰电子材料股份有限公司 靶材的清洗方法
TWI801345B (zh) * 2016-09-13 2023-05-11 美商應用材料股份有限公司 用於腔室部件、設計薄膜及處理腔室的紋理化表層

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CN107838091B (zh) * 2017-10-27 2020-10-16 昆明和玘电力设备有限公司 一种用于绝缘瓷瓶的带电作业清扫方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416997B (zh) * 2008-06-30 2013-11-21 Lam Res Corp 多元件電極之再處理程序
TWI801345B (zh) * 2016-09-13 2023-05-11 美商應用材料股份有限公司 用於腔室部件、設計薄膜及處理腔室的紋理化表層
CN111451190A (zh) * 2019-01-21 2020-07-28 宁波江丰电子材料股份有限公司 靶材的清洗方法

Also Published As

Publication number Publication date
WO2005021173A1 (en) 2005-03-10
TWI302116B (en) 2008-10-21
US7993470B2 (en) 2011-08-09
US20090120462A1 (en) 2009-05-14
US20050048876A1 (en) 2005-03-03
US20080038481A1 (en) 2008-02-14

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