TW200509289A - Methods and fixtures for facilitating handling of thin films - Google Patents

Methods and fixtures for facilitating handling of thin films

Info

Publication number
TW200509289A
TW200509289A TW093120787A TW93120787A TW200509289A TW 200509289 A TW200509289 A TW 200509289A TW 093120787 A TW093120787 A TW 093120787A TW 93120787 A TW93120787 A TW 93120787A TW 200509289 A TW200509289 A TW 200509289A
Authority
TW
Taiwan
Prior art keywords
fixtures
methods
film
thin films
processed
Prior art date
Application number
TW093120787A
Other languages
English (en)
Inventor
Anil Raj Duggal
Paul Alan Mcconnelee
Marc Schaepkens
Min Yan
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of TW200509289A publication Critical patent/TW200509289A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Manipulator (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW093120787A 2003-07-24 2004-07-12 Methods and fixtures for facilitating handling of thin films TW200509289A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/625,171 US20050016464A1 (en) 2003-07-24 2003-07-24 Methods and fixtures for facilitating handling of thin films

Publications (1)

Publication Number Publication Date
TW200509289A true TW200509289A (en) 2005-03-01

Family

ID=33552859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120787A TW200509289A (en) 2003-07-24 2004-07-12 Methods and fixtures for facilitating handling of thin films

Country Status (6)

Country Link
US (1) US20050016464A1 (zh)
EP (1) EP1505667A3 (zh)
JP (1) JP2005042114A (zh)
KR (1) KR20050012165A (zh)
CN (1) CN1599520A (zh)
TW (1) TW200509289A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
JP5209504B2 (ja) * 2006-02-08 2013-06-12 スリーエム イノベイティブ プロパティズ カンパニー ガラス転移点を超える温度でのフィルム基材の製造のための方法
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
US20080194724A1 (en) * 2007-02-12 2008-08-14 Pankaj Singh Gautam Method of forming a crosslinked poly(arylene ether) film, and film formed thereby
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
JP2013255693A (ja) * 2012-06-13 2013-12-26 Dainippon Printing Co Ltd 噴霧デバイス用の液体カートリッジ、液体カートリッジパッケージ、噴霧デバイス及び噴霧デバイス用のメッシュ付容器
CN104937135B (zh) * 2013-01-28 2018-01-19 应用材料公司 基板载体配置与夹持基板的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633541A (en) * 1970-10-06 1972-01-11 Mark Tex Corp Drawing support assembly
US4104099A (en) * 1977-01-27 1978-08-01 International Telephone And Telegraph Corporation Method and apparatus for lapping or polishing materials
US4644639A (en) * 1984-12-21 1987-02-24 At&T Technologies, Inc. Method of supporting an article
JPH0523568Y2 (zh) * 1986-11-08 1993-06-16
JPH0538051Y2 (zh) * 1986-11-08 1993-09-27
WO1993003800A1 (en) * 1991-08-16 1993-03-04 Rudell Design Toy racket with sound resonating membrane
TW224443B (zh) * 1992-07-31 1994-06-01 Minnesota Mining & Mfg
JPH0715793U (ja) * 1993-09-02 1995-03-17 ブラザー工業株式会社 刺繍枠
US5718618A (en) * 1996-02-09 1998-02-17 Wisconsin Alumni Research Foundation Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
US6000814A (en) * 1997-07-17 1999-12-14 Donnelly Corporation Vehicular component assembly with hard coated element
US6142044A (en) * 1999-09-03 2000-11-07 Lucent Technologies, Inc. System for trimming excess material
US6956324B2 (en) * 2000-08-04 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
JP4583568B2 (ja) * 2000-09-19 2010-11-17 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2003133068A (ja) * 2001-10-25 2003-05-09 Nec Corp 発光表示装置の製造方法およびそれを適用した発光表示装置の製造装置
JP3980864B2 (ja) * 2001-10-31 2007-09-26 東光株式会社 半導体基板の取り付け構造
CN1689181A (zh) * 2002-08-30 2005-10-26 佩密斯股份有限公司 用于简化制造具有薄膜材料装置的夹具和方法

Also Published As

Publication number Publication date
US20050016464A1 (en) 2005-01-27
KR20050012165A (ko) 2005-01-31
EP1505667A2 (en) 2005-02-09
JP2005042114A (ja) 2005-02-17
CN1599520A (zh) 2005-03-23
EP1505667A3 (en) 2009-11-11

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