TW200508404A - Substrate material - Google Patents
Substrate materialInfo
- Publication number
- TW200508404A TW200508404A TW093108504A TW93108504A TW200508404A TW 200508404 A TW200508404 A TW 200508404A TW 093108504 A TW093108504 A TW 093108504A TW 93108504 A TW93108504 A TW 93108504A TW 200508404 A TW200508404 A TW 200508404A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate material
- ppm
- magnesium
- instance
- over
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Conductive Materials (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030507A FI114809B (fi) | 2003-04-03 | 2003-04-03 | Alustamateriaali |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200508404A true TW200508404A (en) | 2005-03-01 |
Family
ID=8565919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093108504A TW200508404A (en) | 2003-04-03 | 2004-03-29 | Substrate material |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE112004000528T5 (fi) |
FI (1) | FI114809B (fi) |
TW (1) | TW200508404A (fi) |
WO (1) | WO2004087975A1 (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020128598A (ja) * | 2020-05-26 | 2020-08-27 | 三菱マテリアル株式会社 | 銅圧延板及び電子・電気機器用部品 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03291340A (ja) * | 1990-04-10 | 1991-12-20 | Mitsubishi Materials Corp | 半導体装置用銅合金極細線及び半導体装置 |
JP2662209B2 (ja) * | 1995-10-05 | 1997-10-08 | 古河電気工業株式会社 | メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法 |
JP2898627B2 (ja) * | 1997-03-27 | 1999-06-02 | 日鉱金属株式会社 | 銅合金箔 |
JP3957391B2 (ja) * | 1998-03-06 | 2007-08-15 | 株式会社神戸製鋼所 | 剪断加工性に優れる高強度、高導電性銅合金 |
-
2003
- 2003-04-03 FI FI20030507A patent/FI114809B/fi active
-
2004
- 2004-03-29 TW TW093108504A patent/TW200508404A/zh unknown
- 2004-04-01 WO PCT/FI2004/000198 patent/WO2004087975A1/en active Application Filing
- 2004-04-01 DE DE112004000528T patent/DE112004000528T5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2004087975A1 (en) | 2004-10-14 |
DE112004000528T5 (de) | 2006-01-19 |
FI20030507A0 (fi) | 2003-04-03 |
FI114809B (fi) | 2004-12-31 |
FI20030507A (fi) | 2004-10-04 |
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