TW200508404A - Substrate material - Google Patents

Substrate material

Info

Publication number
TW200508404A
TW200508404A TW093108504A TW93108504A TW200508404A TW 200508404 A TW200508404 A TW 200508404A TW 093108504 A TW093108504 A TW 093108504A TW 93108504 A TW93108504 A TW 93108504A TW 200508404 A TW200508404 A TW 200508404A
Authority
TW
Taiwan
Prior art keywords
substrate material
ppm
magnesium
instance
over
Prior art date
Application number
TW093108504A
Other languages
Chinese (zh)
Inventor
Kalle Harkki
Tuomas Renfors
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Publication of TW200508404A publication Critical patent/TW200508404A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The invention relates to a substrate material made of copper alloy, to be used in high-temperature coating processes. The alloy contains not more than 10 ppm oxygen, and magnesium for over 30 ppm. The substrate material can be used for instance in solar panels.
TW093108504A 2003-04-03 2004-03-29 Substrate material TW200508404A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030507A FI114809B (en) 2003-04-03 2003-04-03 Surface Materials

Publications (1)

Publication Number Publication Date
TW200508404A true TW200508404A (en) 2005-03-01

Family

ID=8565919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108504A TW200508404A (en) 2003-04-03 2004-03-29 Substrate material

Country Status (4)

Country Link
DE (1) DE112004000528T5 (en)
FI (1) FI114809B (en)
TW (1) TW200508404A (en)
WO (1) WO2004087975A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020128598A (en) * 2020-05-26 2020-08-27 三菱マテリアル株式会社 Rolled copper sheet, and component for electronic and electric apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03291340A (en) * 1990-04-10 1991-12-20 Mitsubishi Materials Corp Copper alloy extra fine wire for semiconductor device and semiconductor device
JP2662209B2 (en) * 1995-10-05 1997-10-08 古河電気工業株式会社 Copper alloy for electronic equipment with excellent plating adhesion and solder bondability and its manufacturing method
JP2898627B2 (en) * 1997-03-27 1999-06-02 日鉱金属株式会社 Copper alloy foil
JP3957391B2 (en) * 1998-03-06 2007-08-15 株式会社神戸製鋼所 High strength, high conductivity copper alloy with excellent shear processability

Also Published As

Publication number Publication date
WO2004087975A1 (en) 2004-10-14
DE112004000528T5 (en) 2006-01-19
FI20030507A0 (en) 2003-04-03
FI114809B (en) 2004-12-31
FI20030507A (en) 2004-10-04

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