FI20030507A0 - Substrate material - Google Patents

Substrate material

Info

Publication number
FI20030507A0
FI20030507A0 FI20030507A FI20030507A FI20030507A0 FI 20030507 A0 FI20030507 A0 FI 20030507A0 FI 20030507 A FI20030507 A FI 20030507A FI 20030507 A FI20030507 A FI 20030507A FI 20030507 A0 FI20030507 A0 FI 20030507A0
Authority
FI
Finland
Prior art keywords
substrate material
substrate
Prior art date
Application number
FI20030507A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI114809B (en
FI20030507A (en
Inventor
Ilm. Myoeh.
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20030507A priority Critical patent/FI114809B/en
Publication of FI20030507A0 publication Critical patent/FI20030507A0/en
Priority to TW093108504A priority patent/TW200508404A/en
Priority to DE112004000528T priority patent/DE112004000528T5/en
Priority to PCT/FI2004/000198 priority patent/WO2004087975A1/en
Publication of FI20030507A publication Critical patent/FI20030507A/en
Application granted granted Critical
Publication of FI114809B publication Critical patent/FI114809B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FI20030507A 2003-04-03 2003-04-03 Surface Materials FI114809B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20030507A FI114809B (en) 2003-04-03 2003-04-03 Surface Materials
TW093108504A TW200508404A (en) 2003-04-03 2004-03-29 Substrate material
DE112004000528T DE112004000528T5 (en) 2003-04-03 2004-04-01 Substrate material of a copper-magnesium alloy
PCT/FI2004/000198 WO2004087975A1 (en) 2003-04-03 2004-04-01 Substrate material of a copper-magnesium alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030507A FI114809B (en) 2003-04-03 2003-04-03 Surface Materials
FI20030507 2003-04-03

Publications (3)

Publication Number Publication Date
FI20030507A0 true FI20030507A0 (en) 2003-04-03
FI20030507A FI20030507A (en) 2004-10-04
FI114809B FI114809B (en) 2004-12-31

Family

ID=8565919

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030507A FI114809B (en) 2003-04-03 2003-04-03 Surface Materials

Country Status (4)

Country Link
DE (1) DE112004000528T5 (en)
FI (1) FI114809B (en)
TW (1) TW200508404A (en)
WO (1) WO2004087975A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020128598A (en) * 2020-05-26 2020-08-27 三菱マテリアル株式会社 Rolled copper sheet, and component for electronic and electric apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03291340A (en) * 1990-04-10 1991-12-20 Mitsubishi Materials Corp Copper alloy extra fine wire for semiconductor device and semiconductor device
JP2662209B2 (en) * 1995-10-05 1997-10-08 古河電気工業株式会社 Copper alloy for electronic equipment with excellent plating adhesion and solder bondability and its manufacturing method
JP2898627B2 (en) * 1997-03-27 1999-06-02 日鉱金属株式会社 Copper alloy foil
JP3957391B2 (en) * 1998-03-06 2007-08-15 株式会社神戸製鋼所 High strength, high conductivity copper alloy with excellent shear processability

Also Published As

Publication number Publication date
WO2004087975A1 (en) 2004-10-14
TW200508404A (en) 2005-03-01
DE112004000528T5 (en) 2006-01-19
FI114809B (en) 2004-12-31
FI20030507A (en) 2004-10-04

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