TW200504136A - Photosensitive resist resin composition and method for manufacturing printed circuit board using it - Google Patents

Photosensitive resist resin composition and method for manufacturing printed circuit board using it

Info

Publication number
TW200504136A
TW200504136A TW093117916A TW93117916A TW200504136A TW 200504136 A TW200504136 A TW 200504136A TW 093117916 A TW093117916 A TW 093117916A TW 93117916 A TW93117916 A TW 93117916A TW 200504136 A TW200504136 A TW 200504136A
Authority
TW
Taiwan
Prior art keywords
resin composition
resist resin
photosensitive resist
circuit board
printed circuit
Prior art date
Application number
TW093117916A
Other languages
Chinese (zh)
Other versions
TWI298731B (en
Inventor
Morimoto Hidenobu
Makino Shigeo
Yasuda Kiyomi
Tahara Shuji
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of TW200504136A publication Critical patent/TW200504136A/en
Application granted granted Critical
Publication of TWI298731B publication Critical patent/TWI298731B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Abstract

The present invention provides a negative type photosensitive resist resin composition containing a photosensitive polymerization generator which has a high resolution, wherein the composition is exposed using near ultraviolet light and developed with a weak alkali. A negative type photosensitive resist resin composition of the present invention comprises a photosensitive polymer which comprises at least one resin having a side chain containing ethylene unsaturated group whose gram equivalent weight is from 100 to 1000 g/eq, and an photosensitive monomer which comprises at least three ethylene unsaturated group and has a viscosity of 2000mPa.s or more at 25 degrees and 1 atm.
TW093117916A 2003-06-23 2004-06-21 Photosensitive resist resin composition and method for manufacturing printed circuit board using it TWI298731B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003177411 2003-06-23

Publications (2)

Publication Number Publication Date
TW200504136A true TW200504136A (en) 2005-02-01
TWI298731B TWI298731B (en) 2008-07-11

Family

ID=33534957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117916A TWI298731B (en) 2003-06-23 2004-06-21 Photosensitive resist resin composition and method for manufacturing printed circuit board using it

Country Status (5)

Country Link
JP (1) JPWO2004114021A1 (en)
KR (3) KR100903465B1 (en)
CN (1) CN100595672C (en)
TW (1) TWI298731B (en)
WO (1) WO2004114021A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100826148B1 (en) * 2006-12-29 2008-04-30 박행임 Face care
CN105336855B (en) * 2012-01-12 2020-08-04 大日本印刷株式会社 Vapor deposition mask device preparation body

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6485655A (en) * 1987-09-28 1989-03-30 Ishikawajima Harima Heavy Ind Sterilizing and washing apparatus
JPH05179462A (en) * 1991-12-27 1993-07-20 Sharp Corp Resist applying method
JPH05327181A (en) * 1992-05-19 1993-12-10 Dainippon Toryo Co Ltd Manufacture of printed circuit board
JPH075687A (en) * 1993-06-18 1995-01-10 Mitsui Toatsu Chem Inc Liquid etching resist and copper-plated laminate board coated with etching resist film
JPH0777800A (en) * 1993-09-09 1995-03-20 Ajinomoto Co Inc Photosensitive resin composition
JP2819279B2 (en) * 1996-09-13 1998-10-30 東京化工機株式会社 Photosensitive resist coating method and coating apparatus
JP3652053B2 (en) * 1997-03-07 2005-05-25 サツマ通信工業株式会社 Method for forming thin film on substrate for electronic circuit
JPH1172914A (en) * 1997-08-27 1999-03-16 Toagosei Co Ltd Photo-polymerizable resin composition
JP2000187322A (en) * 1998-10-15 2000-07-04 Mitsubishi Chemicals Corp Photosensitive composition, image forming material and image forming method using same
JP2000155416A (en) * 1998-11-19 2000-06-06 Mitsui Chemicals Inc Photosensitive liquid composition and its use
JP2000330278A (en) * 1999-05-25 2000-11-30 Taiyo Ink Mfg Ltd Photosensitive resin composition
JP3880252B2 (en) * 1999-08-09 2007-02-14 東洋インキ製造株式会社 Photosensitive coloring composition for color filter and color filter using the same
JP2002107926A (en) * 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd Photosensitive resin composition
JP2002241440A (en) * 2001-02-19 2002-08-28 Toppan Printing Co Ltd Alkaline soluble polymer and photosensitive resin composition
JP2002251007A (en) * 2001-02-23 2002-09-06 Toppan Printing Co Ltd Photosensitive resin composition

Also Published As

Publication number Publication date
KR100903465B1 (en) 2009-06-18
CN1795418A (en) 2006-06-28
KR20060006831A (en) 2006-01-19
CN100595672C (en) 2010-03-24
TWI298731B (en) 2008-07-11
KR20080035022A (en) 2008-04-22
WO2004114021A1 (en) 2004-12-29
JPWO2004114021A1 (en) 2006-08-03
KR20070086618A (en) 2007-08-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees