TW200428162A - Exposure method for exposure device - Google Patents

Exposure method for exposure device Download PDF

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TW200428162A
TW200428162A TW93110927A TW93110927A TW200428162A TW 200428162 A TW200428162 A TW 200428162A TW 93110927 A TW93110927 A TW 93110927A TW 93110927 A TW93110927 A TW 93110927A TW 200428162 A TW200428162 A TW 200428162A
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Taiwan
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point
mark
substrate
exposure
mask
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TW93110927A
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Chinese (zh)
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TWI243971B (en
Inventor
Yasuhiko Okugi
Shintaro Yabu
Minoru Ujimasu
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Orc Mfg Co Ltd
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Abstract

An exposure method for an exposure device has a good integrated accuracy of a substrate and a photomask and a short process time in performing exposure to a substrate rapidly. The invented method uses a substrate integrated with an integration mark and a patterned photomask having a photomask mark, and performs exposure in a state where the photomask is tightly connected to the substrate. The invented method comprises: using the photomask mark as a basis to obtain a point MA where the diagonal lines of half region of the photomask intersect, and a point MB where the diagonal lines of the whole region of the photomask intersect; using the integration mark as a basis to obtain a point WA where the diagonal lines of half of the region of the substrate intersect, and a point WB where the diagonal lines of the whole region of the substrate intersect; performing a comparison process of comparing the MB point of the photomask mark with the WB point of the integration mark; performing a determination process of determining whether the WB point of the integration mark relative to the MB point of the photomask mark is within a tolerance range; and irradiating the exposure light on the whole substrate when the determined result from the determination process falls within the tolerance range.

Description

200428162200428162

【發明所屬之技術領域】 本發明有關於一種印刷電 光罩的曝光方法’特別是根據 光作業之曝光裝置的曝光方法 【先前技術】 路板、液晶基板等的基板與 光罩與基板的按分點進行曝 傳統上’在製作印刷電路板時,使用曝光裝置將設有 電路圖案的光罩與基板整合後,纟兩者密接的狀態下照射 曝光光線,將電路的圖案燒附於基板上。 如此的曝光裝置包括載置基板的基台,具有對基台上 的基板做曝光的既定圖案並位於基台上部的光罩,使光罩 或基板整合移動的整合移動裝置,對光罩及基板曝光的光 源及面鏡等組成的光學系。 又,將基板與光罩區分成任意區域(例如四個區域 ),最初進行基板整體的整合,再進行各個區域的整合, 從完成整合的區域依次進行曝光作業,反覆該動作=完成 基板全體的曝光作業,此曝光方法係為公知(例如,參照 專利文獻一)。 然後,對於複數個圖案的全體作曝光之際,量測應曝 光區域個別的重心位置以及全體的重心位置,以此量測資 料為基礎,根據複數個區域的個別的基準位置資訊分別作 修正,根據修正的資料,將個別的圖案做曝光的方法被提 出(例如,參照專利文獻二)。 專利文獻一 特開平1 1 - 1 9 4 5 0 7號公報(段落ο 〇 11〜0 〇 i 4,第3圖[Technical field to which the invention belongs] The present invention relates to an exposure method for a printed electrophotographic mask, particularly an exposure method of an exposure device based on light work. [Prior art] Substrates such as circuit boards, liquid crystal substrates, etc. Traditionally, when manufacturing a printed circuit board, an exposure device is used to integrate a photomask provided with a circuit pattern and a substrate, and then the two are irradiated with exposure light, and the circuit pattern is burned on the substrate. Such an exposure device includes a base on which a substrate is placed, a photomask having a predetermined pattern for exposing the substrate on the base and located on the top of the base, an integrated moving device for integrally moving the photomask or the substrate, and the photomask and the substrate. An optical system consisting of an exposed light source and a mirror. In addition, the substrate and the photomask are divided into arbitrary areas (for example, four areas). The entire integration of the substrate is performed first, and then the integration of each area is performed. The exposure operation is performed sequentially from the area where the integration is completed, and this action is repeated. This exposure method is known (for example, refer to Patent Document 1). Then, when the whole of the plurality of patterns is exposed, the individual barycenter positions of the areas to be exposed and the entire barycenter positions are measured, and based on the measurement data, corrections are made based on the individual reference position information of the multiple areas. Based on the revised data, a method of exposing individual patterns is proposed (for example, refer to Patent Document 2). Patent Document 1 Japanese Patent Application Laid-Open No. 1 1-1 9 4 5 0 7 (paragraph ο 〇 11 ~ 0 〇 i 4, FIG. 3

ZUU42^162 五 發明說明(2) 專利文獻二 特開2000-1223〇3號公 發明欲解決之問題 報(王文) 然而,記載於專利 — 基板整體的整合,對所_的技術,由於是最初進 合’從完成整合的:;以任意;域適當依次地進行整 況下,基板全體的整曝光:在區分成四個區域的狀 m 須進行三次的整合製程,“,區 進行2 :於最初是通過光罩及基板的樟!;Γ:間。 進仃i合’故再對個別之區域進行整合時:己對基板全體 記載於專利文獻二; 玦差會變大。 別圖案的重心位置及二:中’由於是量測應曝光的個 f,根據複數個區域的個別的ΓΐΞ置:ΐϊ量測資料為基 的諸,將個別曝 的圖案曝光需要日本p卩 ’无 因此個別 估本罢^ 間而且如印刷基板的曝丼壯罢炉, 使先罩與基板密接而將 =先I置一般 應用。 罩的圖案做直接曝光的裝置難以 【發明内容】 本I明係有鑑於上述之 一種曝光裝置的载氺太、i 4 其目的為提供 與光罩的if 2 ’11由精度優良且製程短的基板 解決問題:;段可迅速地進行基板全體的曝光。 士 /乍為解決上述問題的手段,本發明之曝光壯署的眼脊 方法,整合具有複數個的^衣置的曝先 疋位用之正口 ^ ,己的基板,以及具ZUU42 ^ 162 Five Invention Descriptions (2) Patent Document No. 2000-1223〇3 The problem to be solved by the invention (Wang Wen) However, the integration of the patent and the substrate is described in the patent. The initial integration from the completion of integration :; arbitrary; the domain is properly adjusted in sequence, the entire exposure of the entire substrate: in the state m divided into four regions, three integration processes must be performed, ", the region performs 2: In the beginning, it was passed through the mask and the substrate of the substrate !; Γ: between. It is necessary to integrate the individual areas: the entire substrate is described in Patent Document 2; the difference will become larger. The position of the center of gravity and the second: Middle 'Because it is the number of exposures f to be measured, based on the individual ΓΐΞ settings of the multiple areas: the measurement data is based on the exposure of the individual exposed patterns, which requires Japanese p 卩' It is estimated that if the printed substrate is exposed, it will be used in close contact with the substrate and the first place is generally used. It is difficult to directly expose the pattern of the cover. [Summary of the Invention] One of the above exposure equipment The purpose of placing the mounting brackets, i 4 is to provide if 2 '11 with a photomask to solve the problem from a substrate with high accuracy and short manufacturing process: the segment can quickly expose the entire substrate. Means, the eye-spine method for exposing and developing the present invention integrates a plurality of ^ clothes sets for the front opening ^, a substrate, and a

2036-6293-PF(N2).ptd 第7頁 200428162 五、發明說明(3)2036-6293-PF (N2) .ptd Page 7 200428162 V. Description of the invention (3)

有用來與上述整合標記對位的光罩標記並設有既定圖案的 光罩’且於上述光罩密接於上述基板的狀態下,包括下列 製程·以上述光罩標記為基礎,而求出上述光罩之一半區 域之對角線彼此交又的按分點^,以及上述光罩全體的對 角線彼此父叉的按分點Μ B的製程;以上述整合標記為基 礎,而求出上述基板之一半區域之對角線彼此交叉的按分 點WA,以及上述基板全體的對角線彼此交叉的按分點㈣的 製程;將上述光罩標記的按分點MB與上述整合標記的八 點WB做比較的比較製程;藉由上述比較製程(之結果女刀 判斷上述整合標記之按分點WB相對於上述光罩標記的八 點MB是否在容許範圍之内的判斷製程;以及在上述判=二 私判斷疋否於谷許範圍時,將曝光的光線照射於上述广 全體的製程(申請專利範圍第1項)。 土板A photomask with a predetermined pattern and a photomask provided to align with the above-mentioned integrated mark, and in a state where the photomask is in close contact with the substrate, includes the following processes: Based on the photomask mark, the above is obtained The process of dividing points by which the diagonal lines of one and a half areas of the mask intersect with each other, and the dividing points of the diagonal lines of the entire mask of the parent by the dividing point BM; based on the above integration mark, the The process of dividing points WA in which the diagonals of half of the areas cross each other, and the process of dividing points ㈣ in which the diagonal lines of the entire substrate cross each other; comparing the points MB of the mask mark with the eight points WB of the integration mark Comparison process; by the result of the above comparison process (the female knife judges whether the point WB of the integration mark with respect to the eight-point MB of the mask mark within the mask mark is within the allowable range); When it is not in the range of Guxu, the exposed light is irradiated to the above-mentioned wide manufacturing process (the first scope of the patent application).

在該曝光方法中,以光罩標記為基礎,而求出光罩 一半區域的按分點MA,以及光罩全體的按分點〇,以上= 整合標記為基礎,而求出基板之一半區域的按分點WA,= 及基板全體的按分點WB,(根據光罩標記及上述整合枳兮 而進行整合作業的製程,也可在求得按分點WA、WB之後| 進入)將光罩彳示兄之間的按分點Μ β與基板之整合標記之 的按分點WB比較,於在容許範圍内時對基板全體進行曝間 光,故可對基板全體做精度佳的曝光。 + 本發明的曝光裝置的曝光方法包括在上述判斷製程 中’當判斷上述整合標記之按分點WB相對於上述光罩^兮 的按分點Μ B在容許範圍之外時,相對於上述光罩標 ^ '、心的按In this exposure method, based on the mask mark, the point-by-point MA of half of the mask and the point-by-point of the entire mask are obtained. Above = the integration mark is used as the basis to determine the point-by-half of the substrate. Point WA, = and the whole point of the substrate by the sub-point WB, (the process of performing the integration operation according to the mask mark and the above integration, or after the sub-points WA, WB are obtained | Enter) and display the mask Comparing the interval between the sub-points M β and the sub-point WB of the integrated mark of the substrate, the entire substrate is exposed to light when it is within the allowable range, so the entire substrate can be exposed with high accuracy. + The exposure method of the exposure device of the present invention includes, in the above-mentioned determination process, when it is judged that the point-by-point WB of the integrated mark with respect to the above-mentioned mask BM is outside the allowable range, it is relative to the above-mentioned mask mark. ^ 'Heart's press

2036-6293-PF(N2).ptd 第8頁 200428162 五、發明說明(4) 分點MA比較上述整合標記的按分點WA的第二比較製程;藉 =^,第二比較製程,判斷上述整合標記的按分SWA相‘ 於上述光罩標記的按分點MA是否在容許範 製程;在上述第二判斷製程判斷是否於容許範圍 ^2光:)照射於上述基板的-半區域的製程(申請專利 在該曝光方法中,相對於光罩椤 整合標記的按分點WB是於容許範圍二。士女分點MB,判斷 記的按分點MA比較整合標記的按八外蚪,相對於光罩標 時,對基板一半的區域做曝光,因 A是於容許範圍内 半區域進行精度佳的曝光。 對整合後的基板之一 又,本發明之曝光裝置的曝光 製程中,包括當判斷上述整人^記万法,在上述第二判斷 光罩標記的按分點MA在容許二=按分點WA相對於上述 排出製程(申請專利範圍第3項)。卜時,排出上述基板的 在该曝光方法中,光罩枳' 標記間的按分點比較,整合^ 9按分點與基板之整合 該基板,不會成為精产姜ϋ ,良的狀況下,由於排出 【實施方式】#度差的無效的曝光。 以下’參照圖式對本發 施形態做說明。 * ^裴置的曝光方法之實 本發明為—種曝光裝置 定位用的整合標記的基板,及2决,整合具有複數個 光罩標記並設有既定圖案的 ’、與整合δ己作對位之 ^ 元車’在光罩密接於基板上的2036-6293-PF (N2) .ptd Page 8 200428162 V. Explanation of the invention (4) The second comparison process according to the sub-point WA compared to the integration mark by the sub-point MA; borrow = ^, the second comparison process to judge the above integration The marked sub-SWA phase 'is based on whether the sub-point MA marked on the above mask is in a permissible standard process; in the above-mentioned second judgment process, it is judged whether it is within a permissible range ^ 2 light :) a process of irradiating the -half area of the substrate (patent application) In this exposure method, the point-by-point WB with respect to the integration mark of the mask is within the permissible range 2. The judgement point MB is compared with the point-by-point outer diameter of the integration mark with respect to the point mark MA. Expose half the area of the substrate, because A is a highly accurate exposure in the half area within the allowable range. For one of the integrated substrates, the exposure process of the exposure device of the present invention includes when determining the entire person ^ Recording method: In the second judgment mask mark, the point-by-point MA is allowed to be equal to the point-by-point WA relative to the above-mentioned discharge process (item 3 of the scope of patent application). In this exposure method, the substrate is discharged. Photomask枳 'Comparison of the points between the points, integration ^ 9 Integration of the points and the substrate by the points will not become a high-quality ginger. In a good condition, due to the exhaustion of the [embodiment] #degree difference of invalid exposure. The following' The embodiment of the present invention will be described with reference to the drawings. * ^ The actuality of the exposure method of Pei Zhi The present invention is a substrate with integrated marks for positioning of an exposure device, and a combination of a plurality of mask marks with a predetermined pattern. The ", ^ Yuan car" which is opposite to the integration δ is closely attached to the substrate in the photomask.

ΙΒΗΙ 2036-6293-PF(N2).ptd 第9頁 200428162 五 發明說明^ ^_: 狀悲下做曝光。 I先,針對曝光方法之基礎的曝光裝置、 在所參照的圖面中,第工圖為表示曝光署兄月。 位的平面圖。第2圖為曝光裝置全體的模:置之主要邛 圖表示光罩的光罩標記的模式圖。第“體圖。第3a 標記的配置的模式圖。第4圖為曝光裝置圖的^;基板之整合 如第1、2圖所示,曝光裝置i包括: 2圖。 2,具有於基板3上曝光的既定電路m宏、 基板3的基台 上的光罩4,並設有使光罩持位於基板3 動機構5⑸,、5C)的桌體13私動二f卓合^之光罩推 的光罩4的上方做光照射而供基板3做在/桌體^從所保持 ^ ^ ^ ^ ^ :: ; 狀^的攝影裝置8,經由攝影裝置8而控制光罩二^ :進行基板3與光罩4之對位等的控制機 以 ),以及遮斷照射於基板3之既定丄上一、、弟5圖 30 (參照第4圖)。 无疋&域之光線的快門機構 基台2,如第4圖所示,藉由圓 動,而使基板3與光罩4可密人,而日1而使其上下移 於基台2上,在基台2的内部:有未圖:2 基板3固定 附機構。因此’基板3吸附於基台2係:由^幫浦等的吸 未圖示的吸附孔以吸附機構將‘二=2上多數個 上而實施。 使及附產生的空氣作用於孔ΙΒΗΙ 2036-6293-PF (N2) .ptd Page 9 200428162 V. Description of the invention ^ ^ _: Expose in a sad state. First, for the exposure device that is the basis of the exposure method, in the referenced drawing, the first drawing shows the month of the exposure department. Plan of bit. Fig. 2 is a diagram of the entire exposure device: the main part of the exposure device. Fig. 2 is a schematic diagram showing a mask mark of a photomask. The body diagram. The pattern diagram of the arrangement marked 3a. The fourth diagram is the exposure device diagram; the integration of the substrate is shown in Figs. 1 and 2. The exposure device i includes: 2 images. The photomask 4 on the base of the substrate 3 exposed on the predetermined circuit m, and the photomask 4 is provided with a table 13 for holding the photomask on the substrate 3 (moving mechanism 5⑸, 5C). The pushed photomask 4 is irradiated with light and the substrate 3 is used for the table / table body ^ from the held ^ ^ ^ ^ ^:: The photo device 8 of the shape ^ is controlled by the photo device 8 ^: Controllers such as the alignment of the substrate 3 and the photomask 4), and interrupting the irradiation of the predetermined beam on the substrate 3, Fig. 30 (refer to Fig. 4). Shutters without light rays The mechanism base 2, as shown in FIG. 4, makes the substrate 3 and the photomask 4 close by being circularly moved, and on the first day, it is moved up and down on the base 2, inside the base 2: Not shown: 2 The substrate 3 is fixed with a mechanism. Therefore, the 'substrate 3 is adsorbed on the base 2 system: the suction holes (not shown) are sucked by a pump, etc., and the number of' two = 2 'is carried out. Cause Air acting on the hole

TO 間呈三段設置可於X方向整V二的7ΛΓ 基台3之 可方There are three 7ΛΓ abutments 3 that can be set in the X direction and can be adjusted in the X direction.

200428162 五、發明說明(6) ' "~*---- 一""~—~—-- =向,整合移動的平台21,以及可於Θ方向整合移動的平 口 2,亦可進行基板3與光罩4的整合作業。 基板3為例如聚酯、聚亞胺、環氧樹脂等材質構成的200428162 V. Description of the invention (6) '" ~ * ---- a " ~~~ ---- = direction, platform 21 integrated with movement, and flat mouth 2 which can integrate movement in Θ direction, also Integration of the substrate 3 and the photomask 4 is performed. The substrate 3 is made of, for example, polyester, polyurethane, epoxy, or the like.

P刷電路板或液晶基板等。在基板3之表面的邊緣部分, 如第1圖式笛Q .. b圖所示,例如左右對稱地設置有複數個〇形 P或圓孔構成的整合標記W (W1〜W6 )(此處為六個)。 长此’稱整合標記w時係總稱整合標記)。 璃的24。貼在於光\=狀的光罩保持器14所保持的透光玻 時如第3a圖所ί在切形Λ未圖示之既定電路圖案,同 處為六幻〇形印^V; 對稱地設置有複數個(此 標記w m〜W6)H= 該〇形印記由基板3之整合 (而且,稱整的光罩標記M (M1〜M6)所構成 卜 σ日守係總稱光罩標記)。 光罩保持器14各邊的一餅施推動機構5包括配置於該 5A、5B之鄰邊的推動部% =5A、5B,配置於該推動部 相向位置上的從動部16、】1配置於推動部5A、5B、5C 機構5 (5A、5B、5C),可16。糟由適當地驅動該推動 向(第1圖之紙面左六太 罩的光罩保持器1 4於X方 方向)’或者是順二時鐘方。向或及二::第1圖之紙面上下 的Θ方向整合移動。 飞鉛直軸線之周圍方向所構成 如第2圖所示’光學系包括 照射既定波長之紫外線P brush circuit board or liquid crystal substrate. On the edge portion of the surface of the substrate 3, as shown in FIG. 1 of the flute Q .. b, for example, a plurality of integrated marks W (W1 to W6) formed by O-shaped P or round holes are arranged left and right symmetrically (here For six). When this is called "integration mark w, it is collectively called integration mark). 24 of 24. The light-transmitting glass held by the light-shaped mask holder 14 is a predetermined circuit pattern not shown in the cut shape Λ as shown in FIG. There are provided a plurality of (this mark wm ~ W6) H = the 0-shaped mark is integrated by the substrate 3 (also, the entire mask mark M (M1 ~ M6) is called the σ-day mark system mask mark). A cake application pushing mechanism 5 on each side of the mask holder 14 includes a pushing portion arranged on the adjacent sides of the 5A, 5B.% = 5A, 5B, and the driven portion 16, arranged on the opposite side of the pushing portion. In the pushing part 5A, 5B, 5C, the mechanism 5 (5A, 5B, 5C), can be 16. This is caused by appropriately driving the pushing direction (the photomask holder 14 on the left side of the paper in the first figure in the X direction) or the clockwise direction. Or and 2 :: Move in the direction of Θ on the top and bottom of the paper as shown in Figure 1. The vertical direction of the flying vertical axis is shown in Figure 2. The optical system includes ultraviolet rays that irradiate a predetermined wavelength.

2036-6293-PF(N2).ptd 第11頁 200428162 五、發明說明(7) :放電蔣燈:丄及配置於放電燈後方的橢圓反射鏡所構成的光 f ’將该光源6的照射光朝既定方向反射的平 7B、7C及凹面鏡7D,以;5舨恶“ ,,,f1 . 配置於光源6光路中之既定位置 上的f Iyer透鏡7E。因此,朵^ , 心丨儿置 平面鏡7Α、7B、7C及凹面的光經由flyer透鏡7Ε、 基板3上。而且,在光 右;光罩4上平行地照射於 業中,光照射的狀態佳、,、有未圖示的快門,於曝光作 攝衫I置8為4台CCD攝影機,固定 上可水平移動的腕的前端。又,,口二於圖〜虎方向 w舱次粗、,认 又该攝影裝置8提供相互之 距離貝枓亚輸入於記憶體等的記憶部(未圖示)。 如弟4圖所示,快門機構30係設置於光罩保持哭14的 附近’並具有遮斷來自凹面籽 ’、寻口口 14的 保持該遮蔽板32自由進出的:持=;、射光的遮蔽板32以及 曾邻^第5ΛΛ=’控制機構9包二資料輸入部24、資料淨 ^25、1料比較部26、判斷部”以及曝光訊號產 而且,以具有鍵盤與滑鼠等的輸入裝置,以 (Cathode-Ray Tube)及液晶晝面之顯示哭 所構成的控制機‘亦可。 在丄料輸入部24 ’輸入以攝影裝 記W與光罩標記Μ的各資料。所於 ^攝的整合才不 8將依次輸入的光罩4的光罩梗=〜^料為用攝影裝置 的位置資訊經光電轉換後的^ 整合標記W1〜W6 置貝料’以及摄寻〈駐要β新 移動之距離的移動資料。 攝心衣置8所2036-6293-PF (N2) .ptd Page 11 200428162 V. Description of the invention (7): Discharge Jiang lamp: 的 and light f 'composed of an elliptical reflector arranged behind the discharge lamp. Plane 7B, 7C and concave mirror 7D reflecting toward a predetermined direction, with 5 舨 evil ",,, f1. F Iyer lens 7E disposed at a predetermined position in the light path of light source 6. Therefore, a flat mirror The light of 7A, 7B, 7C and the concave surface passes through the flyer lens 7E and the substrate 3. Furthermore, on the right side of the light; the reticle 4 is irradiated in parallel in the industry, and the state of light irradiation is good. In the exposure camera I, 8 sets of 4 CCD cameras are fixed on the front end of the wrist that can be moved horizontally. In addition, the second port is thicker than the w direction in the figure to the tiger direction, and the camera 8 provides a mutual distance. Betty is input into the memory part (not shown) of the memory, etc. As shown in Fig. 4, the shutter mechanism 30 is installed near the mask to keep crying 14 'and has a block from the concave seed' and a mouth opening. 14 to keep the shielding plate 32 in and out freely: hold = ;, the shielding plate 32 that emits light and Zeng Lin ^ 第 5ΛΛ = '控The agency 9 includes two data input sections 24, data net 25, 1 material comparison section 26, judgment section ", and exposure signal production. Moreover, it has input devices with keyboard and mouse, etc., (Cathode-Ray Tube) and LCD daylight The control machine made up of crying faces can also be used. To the material input unit 24 ', each of the materials marked with the photographic seal W and the mask mark M is input. The integration of the photo is not necessary. The mask stalk of the photo mask 4 that is input in sequence = ~ ^ is based on the photoelectric conversion of the position information of the photographic device. ^ The integration marks W1 ~ W6 are placed in the shell material. The movement data of the distance of β new movement. 8 sets of decent clothes

五、發明說明(8) 資料演算部2 5從 合標記W的位置關係 圖示的記憶體中。 所輸入的各資料演算光罩標記Μ與整 同時將演算出的位置資料記憶在未 負料〉貞异部2 5,藉由從資+斗# Λ都Q / 資料通過演管出右转—M f 貝科輸入部24所輸入的各 且特定Μ : : ί Ϊ特 的整合標記間距離資料,以及 具光罩標記間距離資料,演算出崎 丰的故或另一邊區域中對角方向的整合標記1之按分 :以及位於基板3全體之對角方向的整合標記W的按分 、、同樣地,資料凟异部2 5演算出位於光罩4之一半的一 达或另邊區域中之對角方向的光罩標記μ的按分點μα, :及位於光罩4全區域中之對角方向的光罩標記之按分點 ,將上述之按分點WA、WB與ΜΑ、MB作為位置資料記憶在 未圖示的記憶體中。 卜資料比較°卩2 6比較光罩標記Μ與整合標記w之個別位置 貝料的一致度,同時將光罩標記之按分點ΜΑ、Μβ作為基準 值貧料,與對應於成為該基準值資料的按分點ΜΑ、ΜΒ的整 合標記之按分點WA、WB作比較。 判斷部27判斷光罩標記Μ與整合標記w相對於預先記憶 在未圖示之記憶體中的基準值是在容許範圍内或容許範圍 外,同時判斷基板3全體之按分點wb與光罩4之按分點MB, 或者是按分點ΜΑ、WB相對於預先記憶在未圖示之記憶體中 的基準值是在容許範圍内或容許範圍外。 然後’若判斷部2 7判斷光罩標記μ與整合標記w在容許V. Description of the invention (8) The data calculation unit 25 takes the position relationship of the combined mark W from the memory shown in the figure. Each input data calculation mask mark M and the calculated position data are stored in the unloaded material at the same time> Zhen Yi Bu 2 5 , from the capital + bucket # Λ 都 Q / data through the performance tube to turn right — Each specific and specific M:: ί that is integrated by M f Beco input unit 24 and the distance data between mask marks with a mask is used to calculate the integration in the diagonal direction of the ridge or the other side Mark 1 mark: and the mark W of the integrated mark W located in the diagonal direction of the entire substrate 3. Similarly, the data difference section 25 calculates the diagonal angle in the one or half of the mask 4 The sub-points μα of the mask mark μ in the direction, and the sub-points of the mask marks located diagonally in the entire area of the reticle 4, and the above-mentioned sub-points WA, WB, ΜA, and MB are stored as position data. Pictured memory. Comparison of data ° 卩 2 6 Compare the consistency of the mask material M at the individual positions of the integration mark w, and use the points MA and Mβ of the mask mark as the reference value, and correspond to the data corresponding to the reference value. The integration marks of the points by MA and MB were compared by the points of WA and WB. The judging unit 27 judges whether the mask mark M and the integration mark w are within a permissible range with respect to a reference value stored in a memory (not shown) in advance, and also judges the sub-point wb of the entire substrate 3 and the photomask 4 The sub-point MB, or sub-point MA, WB is within or outside the allowable range with respect to the reference value stored in advance in a memory not shown. Then, if the judgment section 27 judges that the mask mark μ and the integration mark w are allowed,

2036-6293-PF(N2).ptd 第13頁 五 '發明說明(9) 範圍外’則輪出— ^ 、 由光罩推動機構5進^ ’傳送訊號至光罩推動機構5並細 又,若判斷部27匈t Λ業。 、'; 圍内,則進行相對於扮j光罩標記Μ與整合標記W在容許# MB、WB在容許範圍内二點MB與按分點豹的判斷,按分已 供使其曝光的訊號。㈡況下,由曝光訊號產生部28輪出 WB在容許範圍外的g : :27判斷相對於按分點MB與按分點 判斷’並於按分點MA與二分點MA與按分點以的 出訊號,使如第4圖所刀快 =午範圍内的情況下輪 區域的位置進行遮光,同時使=構30作動而對不在曝光 射。 自光源6的照射光做照 然後’判斷部2 7判斷按分點Ma 外的情況下,輸出訊號將基板3從基、在容許範圍 機等的搬運裝置排出。 σ 2經由未圖示之搬運 接著芩照第6圖及其他圖式,斜 的曝光方法的流程作說明。 ,-十對本發明之曝光裝置 首先,如第2圖所示,藉由去闰一 裝置將基板3搬入曝光裝置i的基未/2不;搬運機等的搬運 在吸附的狀態T ’使基台2上升移動,,:基台2的基板3 向的狀態下做真空密接。 ,使土板3與光罩4相 旦”4二罩:與基板3做真空密接時,如第1圖所示,各攝 衫I置8從退避位置移動而對光罩 ^ ^ 影,藉此將關於光罩標.與整^與整合標記請 /、正。&屺W之位置的資料輸入 2036-6293-PF(N2).ptd 第14頁 200428162 五、發明說明(10) .至貪料輸入部2 4 (參照第5圖) ^,由於光罩4的光罩標記 〜W 6輪入至資料輸入部 光罩標記Μ 2、Μ 4間,光 Μ6間,以及光罩標記Ml、 如第3圖、第5圖及第6圖所 Μ1〜Μ 6以及基板3的整合標記评1 2 4 ’光罩4的光罩標記% 1、% 2間 罩標記Μ4、Μ5間,光罩標記Μ5 一 Μ6間,光罩標記Μ2、Μ5間: ^…二=旱擇?己 ^ ^ ^ - μ 光罩^ "己Μ 3、Μ 4間的距離’作 為距離貧料而輸入至資料輸入部24。 η 2 :基板3的整合標記W1、W2間,整合標記W2、W4 巧,正3私記W4、W5間,整合標記W5、ff6間, 記Wl、W6間,整人俨々wo 虹日日 ⑼ Μ及玉口知 離,# &扣雜一。私 間,整合標記W3、W4間的距 作為距離貧料而輸入至資料輸入部24。 ( S 1 ) —^接著,藉由輸入於資料輸入部24的距離資料, 料 ’貝异部25演异光罩標記M2、M4 f曰,,Μ3、Μ5 對於光罩4全體最遠的位置的光罩標記们、刀μ4,·間, :"t 二;Μ6間的按分點MB。同時,在資料演算部25演 听正a私圮W2、W4間,W3、W5間的按分點WA,以及相對於 基板3全體最遠的位置的整合標記w丨、W4間,整合 €W3、W6間的按分點WB,個按分點ΜΑ、Μβ 資料演算部25。 (S2) I己丨思於 接著,藉由使載置於基台2上的基板3與光罩4整人 動的整合機構之推動機構5 (5A、5B、5C ),整合作=: 光罩標記及整合標記進行(s 3 )。 ’、 接著’ ό己fe於演算部2 5的光罩之按分點㈣的資斑 板之按分點WB的資料,配合在整合作業中使整合移動的^2036-6293-PF (N2) .ptd P.13 5 "Explanation of the invention (9) outside the range" then turn out — ^, enter by the mask pushing mechanism 5 ^ 'transmit the signal to the mask pushing mechanism 5 and thin, If the judging section 27 Hungary t Λ industry. Within the range, the judgment is made with respect to the mask mark M and the integration mark W within the allowable # MB, the WB within the allowable range of two points MB, and the point-by-point leopard, and the signals for exposure are provided by the points. In this case, the exposure signal generating unit 28 rounds out g :: 27 judged by the exposure signal generation unit WB out of the allowable range, compared with the judgment by the points MB and the judgment by the points', and the signals by the points MA, the two points MA, and the points, When the position of the wheel area is within the range of noon as shown in FIG. 4, the position of the wheel area is shielded, and at the same time, the structure 30 is actuated and the exposure is not performed. The irradiation light from the light source 6 is irradiated, and then the 'determination unit 27' judges that the substrate 3 is output from the substrate, a conveyance device such as a machine within an allowable range, when it is judged that it is outside the point Ma. σ 2 is conveyed through an unillustrated process. Next, a description will be given of the flow of an oblique exposure method according to FIG. 6 and other drawings. -Ten pairs of exposure apparatus of the present invention First, as shown in FIG. 2, the substrate 3 is moved into the base 2 of the exposure apparatus i by removing the first device; the conveyer or the like is transported in the adsorption state T 'to make the base The stage 2 moves up, and vacuum-sealed in a state where the substrate 3 of the base 2 is oriented. Make the soil plate 3 and the photomask 4 "" The second cover: when making vacuum tight contact with the substrate 3, as shown in Fig. 1, each of the shirts I is moved from the retracted position to the photomask ^ ^ This will be about the mask mark. And the integration and integration mark please /, positive. &Amp; 屺 W position information entered 2036-6293-PF (N2) .ptd page 14 200428162 V. Description of the invention (10) to Goods input section 2 4 (refer to FIG. 5) ^, since the mask marks ~ W 6 of the photo mask 4 enter the mask marks M 2, M 4, the light M 6 and the mask mark M 1 of the data input section. As shown in Figure 3, Figure 5 and Figure 6 from M1 to M6 and the integrated marking of substrate 3, 1 2 4 'Mask mark of mask 4% 1, 2 mask marks M4, M5, light Mask marks M5 to M6, mask marks M2 and M5: ^ ... 二 = dry selection? ^ ^ ^-Μ Mask ^ " The distance between Μ3 and Μ4 'is entered as a lean material. Data input unit 24. η 2: Integration marks W1 and W2 of the substrate 3, integration marks W2 and W4, 3 private records between W4 and W5, integration marks W5 and ff6, records W1 and W6, whole person 々Wo 虹 日 日 ⑼ Μ and Yukou Know Li, # & I. In private, the distance between the integrated marks W3 and W4 is input to the data input unit 24 as the distance data. (S 1) — ^ Then, the distance data input to the data input unit 24 is used to predict The different part 25 plays different mask marks M2 and M4. F, M3, M5 are the mask marks, knife μ4, and the distance between the farthest positions of the whole mask 4, and the points between the points of " t 2; M6. MB. At the same time, in the data calculation department 25, the private points W2, W4, W3, W5 are divided by the point WA, and the integration mark w 丨, W4, which is the furthest from the entire substrate 3, is integrated. The point-by-point WB between W3 and W6, and the point-and-point MA and Mβ data calculation unit 25. (S2) I have thought about it by moving the substrate 3 and the photomask 4 placed on the base 2 Of the integration mechanism of the promotion mechanism 5 (5A, 5B, 5C), the whole cooperation =: mask mark and integration mark (s 3). ', Then' (the next point of the mask in the calculation department 2 5) The information of the sub-point WB of the information board is used to make the integration move in the integration operation ^

2036-6293-PF(N2).ptd 2004281622036-6293-PF (N2) .ptd 200428162

在貝料比較部2 6做比較(比較製程) 五、發明說明(Η) 罩標記Μ的資料 (S4 )。 比較的結果在判斷部2 7主丨ι η ^ > — (判斷製程,S5),若光罩卜 之容許範圍内 ^ _ 卓*圮mb與整合標記WB在既定之 =圍内(YES) ’則由於基板3全體可照射曝光光:, =來自判斷部27的訊?虎,經曝光訊號產生部28 讯旎,將曝光光線照射基板3全體(% )。 王+凡 w —方面’若步驟S5的判斷為落於容許範圍夕卜(Ν0), 演算部25的光罩標記祕之按分點㈣料與整合標記 知刀點WA育料由貝料比較部26進行比較(第二比較 程、S7 )。 比較的結果在判斷部27做判斷(第二判斷製程、S8 丄右在既定之容許範圍内(YES ),則由於可對基板3的 的區域WA做曝光,藉由來自判斷部27的訊號,經曝光 讯號產生部28產生曝光訊號之同時,使快門機構3〇的遮蔽 板2作動而覆盍其他不曝光的區域,第圖僅所示區域a的 曝光(S9 )。若步驟S8的判斷在既定之容許範圍外(N〇 ),則將未曝光的基板3排出(S1 〇 )。又,在進行曝光 時,使攝影裝置退避而避免干涉。 如以上所述,最初將基板3分成二個區域,對於位於 一邊區域A的對角方向的整合標記”、W4以及整合標記 〇、W5間的按分點WA做演算,接著以基板3全體為對象’ 同樣地演算按分點WB,於光罩4的按分點MA、MB做比較後 再曝光,故可得精度佳的曝光。The comparison is made in the shell material comparison section 26 (comparison process) 5. The description of the invention (i) The data of the mask mark M (S4). The result of the comparison is determined in the judgment section 27 ^ ^ ^ > — (judgment process, S5), if the photomask is within the allowable range ^ 卓 * 圮 mb and the integration mark WB are within the predetermined range (YES) Since the entire substrate 3 can be irradiated with the exposure light: == a signal from the judgment unit 27, the exposure light is irradiated to the entire substrate 3 by the exposure signal generation unit 28 (%). Wang + Fan w — Aspect 'If the judgment of step S5 falls within the allowable range (N0), the mask mark of the calculation section 25 is classified by the sub-point data and the integrated mark is known as the knife point. WA Feed is provided by the shell material comparison section. 26 for comparison (second comparison process, S7). The result of the comparison is judged by the judging section 27 (the second judging process, S8 is right within a predetermined allowable range (YES), because the area WA of the substrate 3 can be exposed, and by the signal from the judging section 27, When the exposure signal generating section 28 generates the exposure signal, the shutter plate 2 of the shutter mechanism 30 is actuated to cover other non-exposed areas, and only the area a shown in the figure is exposed (S9). If judged in step S8 Outside the predetermined allowable range (No), the unexposed substrate 3 is discharged (S1 0). When the exposure is performed, the imaging device is retracted to avoid interference. As described above, the substrate 3 is first divided into two For each area, calculate the integration marks WA, W4, and integration marks 0 and W5 in the diagonal direction of the area A on one side, and then use the entire substrate 3 as the target. Similarly, calculate the separation points WB and the photomask. According to the comparison of the sub-points MA and MB, and then the exposure is performed, a highly accurate exposure can be obtained.

2036-6293-PF(N2).ptd 第16頁 200428162 五、發明說明(12) 又,本發明由於以少量的製程而玎做基板3整體的曝 光,生產效率提升之同時,即使於僅應曝光之基板3的一 半區域A,由於按分點WA與光罩一致才進行曝光,可有效 地活用基板材料。 發明之效果 本發明最初將基板3分成二個區域,對於位於一邊區 域A的對角方向的整合標記間的按分點WA做演算,接著以 基板全體為對象,同樣地演算按分點WB,由於比較光罩的 按分點MA、MB的曝光,可得精度佳的曝光。 本發明由於以少量的製程而可做基板整體的曝光,生 產效率提升之同時,即使於僅應曝光之基板的一半區域 A ’由於按分點W A與光罩一致才進行曝光,可有效地活用 基板材料。2036-6293-PF (N2) .ptd Page 16 200428162 V. Explanation of the invention (12) In addition, the present invention does a whole exposure of the substrate 3 due to a small number of processes, while improving production efficiency, even if only exposure should be performed Half of the area A of the substrate 3 is exposed only at the points WA corresponding to the photomask, and the substrate material can be effectively used. Advantageous Effects of the Invention The present invention first divides the substrate 3 into two regions, and calculates the point-by-point WA between the integration marks located in the diagonal direction of the area A on one side, and then calculates the point-by-point WB similarly for the entire substrate. The exposure of the reticle according to the sub-matrix MA and MB can obtain a highly accurate exposure. The present invention can expose the entire substrate with a small number of processes. At the same time that the production efficiency is improved, even if only half of the substrate A that should be exposed is exposed, the exposure is performed because the sub-point WA is consistent with the photomask, and the substrate can be effectively used. material.

第17頁 200428162 圖式簡單說明 第1圖表示本發明之一實施例的曝光裝置之主要部分 的平面圖。 第2圖表示本發明之一實施例的曝光裝置之全體的立 體圖。 第3 a圖表示光罩標記之配置的模式圖。 第3b圖表示基板之整合標記之配置的模式圖。 第4圖表示本發明之一實施例的曝光裝置的側視圖。 第5圖表示本發明之曝光裝置的系統構造圖。 第6圖表示本發明之曝光裝置的曝光方法之實施型態 的流程圖。 符號說明 1〜曝光裝置; 2〜基台; 3〜基板; 4〜光罩; 5〜光罩推動裝置; 5A、5B、5C〜推動部;Page 17 200428162 Brief Description of Drawings Fig. 1 is a plan view of a main part of an exposure apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view of the entire exposure apparatus according to an embodiment of the present invention. Fig. 3a is a schematic diagram showing the arrangement of the mask marks. Fig. 3b is a schematic diagram showing the arrangement of integrated marks on the substrate. FIG. 4 is a side view of an exposure apparatus according to an embodiment of the present invention. FIG. 5 is a system configuration diagram of the exposure apparatus of the present invention. Fig. 6 is a flowchart showing an embodiment of an exposure method of the exposure apparatus of the present invention. DESCRIPTION OF SYMBOLS 1 ~ exposure device; 2 ~ base; 3 ~ substrate; 4 ~ photomask; 5 ~ photomask pushing device; 5A, 5B, 5C ~ pushing part;

2036-6293-PF(N2).ptd 第18頁 200428162 圖式簡單說明 1 6〜從動部; 20〜X方向整合移動的的平台; 21〜y方向整合移動的的平台; 22〜0方向整合移動的的平台; 2 4〜資料輸入部; 2 5〜資料演算部; 2 6〜資料比較部; 2 7〜判斷部; 2 8〜曝光訊號產生部; 3 0〜快門機構; 3 1〜保持部; 3 2〜遮蔽板; Μ (Ml〜M6 )〜光罩標記; MA〜按分點(光罩半區域中的按分點), MB〜按分點(光罩半區域中的按分點); W ( W1〜W6 )〜整合標記; W A〜按分點(基板半區域中的按分點), WB〜按分點(基板半區域中的按分點)。2036-6293-PF (N2) .ptd Page 18 200428162 Schematic description of 1 6 ~ follower; 20 ~ X direction integrated mobile platform; 21 ~ y direction integrated mobile platform; 22 ~ 0 direction integration Mobile platform; 2 4 ~ data input unit; 2 5 ~ data calculation unit; 2 6 ~ data comparison unit; 2 7 ~ judgment unit; 2 8 ~ exposure signal generation unit; 3 0 ~ shutter mechanism; 3 1 ~ hold 3 2 ~ shielding plate; Μ (Ml ~ M6) ~ mask mark; MA ~ by sub-point (by sub-point in the half area of the mask), MB ~ by sub-point (by sub-point in the half area of the mask); W (W1 ~ W6) ~ integrated mark; WA ~ by points (by points in the half area of the substrate), WB ~ by points (by points in the half area of the substrate).

2036-6293-PF(N2).ptd 第19頁2036-6293-PF (N2) .ptd Page 19

Claims (1)

200428162 六、申請專利範圍 1. 一種 之整合標記 光罩標記並 述基板的狀 以上述 之對角線彼 線彼此交叉 以上述 之對角線彼 線彼此交又 將上述 WB做比較的 藉由上 對於上述光 製程;以及 在上述 線照射於上 2. 如申 法,其更包 當判斷 的按分點MB 分點ΜΑ比較 藉由上 W Α相對於上 曝光裝置的 的基板,以 設有既定圖 態下進行曝 光罩標記為 此交又的按 的按分點MB 整合標記為 此交叉的按 的按分點WB 光罩標記的 比較製程; 述比較製程 罩標記的按 判斷製程判 述基板全體 請專利範圍 括下列製程 上述整合標 在容許範圍 上述整合標 述第二比較 述光罩標記 曝光方法,整合具有複數個定位用 及具有用來與上述整合標記對位的 案的光罩’且於上述光罩密接於上 光,包括下列製程: 基礎,而求出上述光罩之一半區域 分點MA,以及上述光罩全體的對角 的製程; 基礎,而求出上述基板之一半區域 分點WA,以及上述基板全體的對角 的製程; 按分點MB與上述整合標記的按分點 ’判斷上述整合標記之按分點^ B才目 分點Μ B是否在容許範圍之内的判斷 斷是於容許範圍内時,將曝光的光 的製程。一 第1項所述之曝光裝置的曝光方 記之按分點WB相對於上述光罩標記 之外時,相對於上述光罩標記的按 記的按分點WA的第二比較製程; 製程,判斷上述整合標記的按分點 的按分點ΜΑ是否在容許範圍内的第 〇200428162 6. Scope of patent application 1. A kind of integrated marking mask mark and stating that the shape of the substrate intersects each other with the above-mentioned diagonal lines and each other with the above-mentioned diagonal lines and each other and compares the above WB by the above For the above-mentioned light process; and irradiating on the above line 2. As stated in the method, it is more judged to compare the sub-point MB with the sub-point ΜA compared with the substrate of the upper exposure device by the upper W Α to set a predetermined map In the current state, the exposure mask is marked as a cross-pressed point-by-point MB. The integration mark is a cross-pressed as a point-by-point WB mask mark. The comparison process is described by the comparison process. The following processes are included: the above integration mark is within the allowable range, the above integration mark is described, the second comparison is the mask mark exposure method, and a photomask having a plurality of positioning and having a case for alignment with the above integration mark is integrated. Adhering to the glazing includes the following processes: Basically, to find the half-point MA of the half of the mask, and the diagonal system of the entire mask. Based on the process of obtaining the sub-area WA of one half of the substrate and the diagonal of the entire substrate; judging the sub-point ^ B of the integration mark by the sub-point MB and the sub-point by the integration mark ^ B The judgment of whether B is within the allowable range is a process of light exposure when the allowable range is within the allowable range. A second comparison process of the exposure point of the exposure device described in the first item when the point-by-point WB is out of the mask mark, and the point-by-point point WA of the mask mark is compared; the process determines the above Whether the point-by-point MA of the integration mark is within the permissible range. 第20頁 200428162 六、申請專利範圍 二判斷製程; 在上述第二判斷製程判斷是於容許範圍内時,將曝光 的光線照射於上述基板的一半區域的製程。 3.如申請專利範圍第2項所述之曝光裝置的曝光方 法,其中在上述第二判斷製程中,包括當判斷上述整合標 記之按分點W A相對於上述光罩標記的按分點Μ A是在容許範 圍之内時,排出上述基板的排出製程。Page 20 200428162 6. Scope of patent application 2. Judgment process; When the second judgment process judgement is within the allowable range, the process of irradiating the exposed light to a half area of the substrate. 3. The exposure method of the exposure device according to item 2 of the scope of patent application, wherein in the second judgment process, it is included when judging the point by point WA of the integrated mark relative to the point by point M A of the mask mark is When it is within the allowable range, the above-mentioned substrate discharge process is performed. 2036-6293-PF(N2).ptd 第21頁2036-6293-PF (N2) .ptd Page 21
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