200521637 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種對應基板伸縮之印刷電路板用曝光 裝置。 【先前技術】 ^隧著近年來電子製品的輕薄短小化•高機能化，印刷 =路板越來越高精度•高密度化，因此在製造印刷電路板 %也要使用㈣光裝置將預定圖案感光成像在塗布 光阻y等之感光材料的基板表面，然後藉由钱刻步驟在 土板上形成圖案的微影法。 由於印刷電路板之材料為塑膠，因此通過製程 ^胃$職學藥品或熱職生的衝擊並且發生伸缩。要 在P刷電路板利用微影的手法 案時，通常可藓AA 深及鮮錫先阻劑的圖 ^, 由稷數次的微影法來製造。一π所#田+ 使光罩及印刷電路板密接而曝光的贫又所吏用之 精度·高密度的印刷電路板時^ 要以高 響’而使圖案無法配置在適當的二伸：會-來不良的影 得多層板之各層間之結人* ，因此會產生為了取 光阻劑之開口部位移的；題的位置偏移、或是鮮錫 得不對圖案進行具有充分裕度的^止這種情況產生，不 度·高密度化造成影響。 、又汁，結果就會對高精 為了解決上述問題， 〈習知技術] > 知用以下的解決方法。 藉由其他步驟測定印刷 J1甲蝻置亚且依測定結 316402 200521637 果予以分組。從預先準備之不同尺寸的複數種光罩中，依 各組選取最適當的光罩放置在眼 、， 隹*光衣置，亚將印刷電路板 依組別投入曝光裝置的方法。 〈習知技術2> 2光裝置設置分㈣㈣（shutter)功能，並非 有面和整面一起曝光，而是拉 疋猎由刀剎成複數個區域而曝 先，以儘置減少圖案位置偏移量的方法。 一 〈習知技術3> 使用投影曝光裝置的方法。由於可藉由使透^ 動來進行光罩的倍率修正，因此配 夕 而進行光罩之倍率修正並且曝光的方法。的伸^ [專利文獻1]曰本特開2000_250227號 【發明内容】 [發明所欲解決之課題] ;二在上述習知技術中分別有如下的問題。 =技術！在將印刷電路板投入曝光裝置之前 先測疋伸縮量並且做好八 要預讀 習知 刀、、且，因而增加多餘之製程。 ；LJ疋在進行曝光時，並非所有面产敕而 曝光，而是分室JA 齐所百面和整面一起200521637 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to an exposure device for a printed circuit board corresponding to the expansion and contraction of a substrate. [Previous technology] ^ Tunneling electronic products in recent years has become thinner, shorter, and more functional. Printing = road boards are becoming more and more accurate and high-density. Therefore, in the manufacture of printed circuit boards, it is also necessary to use calenders to pattern the patterns. Photographic imaging is performed on the surface of a substrate coated with a photosensitive material such as a photoresist Y, and then a photolithography method is used to form a pattern on a soil plate by a money engraving step. Since the material of the printed circuit board is plastic, it is subject to the impact of the vocational medicines or hot vocational students through the manufacturing process. When using the lithography method for the P-brushed circuit board, the pattern of the moss AA depth and the fresh tin pre-resistor can usually be made by the lithography method several times.一 π 所 # 田 + Poor and precise exposure for making the photomask and the printed circuit board close together. High-density printed circuit boards ^ It must be loud so that the pattern cannot be arranged in the proper extension: will -There is a bad effect on the connection between the layers of the multi-layer board *, so the opening of the photoresist will be shifted; the position of the question is shifted, or the pattern of fresh tin is not sufficient. ^ Until this happens, the degree and density will be affected. In order to solve the above problems, <Knowledge Technology> > Know the following solutions. The print J1 formazan was determined by other steps and grouped according to the results of measurement 316402 200521637. From a plurality of photomasks of different sizes prepared in advance, the most appropriate photomask is selected for each group and placed in the eye, and the printed circuit board is put into the exposure device according to the group. <Known Technology 2> The shutter function is set on the 2-light device. Instead of exposing both the surface and the entire surface, the camera is exposed by the knife brake in multiple areas to reduce the pattern position shift. Volume method. -<Known Technology 3> A method using a projection exposure apparatus. Since the magnification correction of the mask can be performed by making the lens transparent, a method of correcting the magnification of the mask and performing exposure is also provided. [Patent Document 1] Japanese Patent Application Publication No. 2000_250227 [Summary of the Invention] [Problems to be Solved by the Invention]; Secondly, the above conventional techniques have the following problems. = Technology! Before putting the printed circuit board into the exposure device, measure the amount of expansion and contraction and do a good job in advance. Know the knife, and, therefore, add extra processes. ; When exposure is performed by LJ 疋, not all faces are exposed and exposed, but the room JA Qi Sobai and the whole face together
Λ ^ 成祓數次而曝光，因此有曝光時門從I 致處理時間變長的缺點。 h先4間笑長以 習知技術3則是裝置罝 同等的處理時間，需要ir亦南’為了獲得與密接方式 費用需要密接方式的1。倍左右之多。0而小入 本發明之目的在於解決上述習知技術的問題。 316402 7 200521637 [用以解決課題之手段] :了達成上述目的，本發明提供 光裝置，其特徵為呈有· S + 丨Μ包給槪用曝 繪的不同大小上L:應印刷電路板之伸縮而描 檢知的複數個光罩(一。嗽 檢知的手段而得知的曝光前少< ο手奴，攸猎由耵述 針、十、、—p刷電路板的伸縮狀態，從 刚述稷數個光罩中選擇最適各 〜攸 擇的光罩—&罟, 々手段；將前述所選 禪的光罩叹置在曝光部的手段；以、 的光罩，然後對前述印刷電用5又置在该曝光部 在上、千m 订曝光的曝光手段。 縮狀態，並選擇適人*先別榀知印刷電路板的伸 因此可進行有效率且古_疮_ 再叹置农曝光部， 丁令效卞且月度•高密度的曝光。 可構成使前述複數個光罩形成、， 且使該薄膜狀的光I h寻艇狀先罩，亚 邻m 罩私動而將所選擇的光罩設置在曝光 「心措由此構成可進行更有效率的曝光。 在*先 [發明之效果] 根據本發明之印刷電路板 事前測定伸縮旦廿μ& 彳、尤衣置，具有不會產生 j疋伸、、佰里亚做好組群區 間與習知宓接$ 夕餘手‘，而在節拍時 的價格下等，裝置導入費用也大致同等 最小限度，：：=縮所造成的圖案位移的影響抑制在 精度·产的:篇/土地進灯生產’而可有效率地製造高 回山度的印刷電路板的效果。 【貫施方式】 以下根據圖式來說明本發明之實施形態。 316402 200521637 第1圖中，此印刷電路板用曝光裝置具有投 曝光部β。 反 在刖步驟施有光阻劑的基板50是經由投入部a而載 於曝光部B的载置台（stage)4上，而可在此接受曝光载置 載置口 4可朝χγζ & θ方向移動，而可使所 板標記51與光罩薄膜丨進行對位。 1基 在 & Α。又有搬送滾輪20，在此上方移動而來的美 板可藉由兩台或四台咖相機2讀取其基板標記/ 51。基板標記51是事先設在基板50上的㈣位置，夢由 板標記51、51的位置關係，便可算出基板 伸縮置。 來自CCD相機2之基板標記51白勺晝像會被送到控制裝 置3，並在此計算出伸縮量。 、 此外1基板標記51可❹與光罩進行對位用的標記。 於=我1是形成連續的薄膜狀，並且捲繞在光罩滾 輪10、1 0上。然後藉由滾輪 的基板50上。 Π構成位在載置台4上 在光罩薄膜1設有複數個光罩15。亦即，描緣有複數 個具有以設計值尺寸作成之曝光圖案的標準光罩15、以及 =於該標準圖案描”微小尺寸不同之大小之圖案的光 罩15。被小尺寸最好是事先準備好預定數量之相對於例 如曝光尺寸500_而在Χγ方向皆以1〇微米左右之一定比 例’使@案备§小及擴大後的圖案。 另外’在預先已知道會因為基板材料之伸縮特性或所 316402 9 200521637 描繪之圖案以致以方向的伸縮率不-定的情況下，又最好 準備配合χγ之各個伸縮之尺寸的光罩。 控制裝置3可對光罩滾輪1〇進行驅動控制而進行旋 LV:止Λ之控制，並且使具有預定尺寸之光罩圖案的光 罩15位在基板50上。 控制裝置3是如前所述而構成，即根據來自⑽相機 2之基板標記51的晝像訊號計算㈣縮量，並且從該計算 結果’使在光罩薄膜1中具有最洎 光罩15位在基板50上。適田之尺寸之曝光圖案的 當基板50，皮載置於載置台4，並且在該基板5〇使最 適观罩15位於基板50上之後，利用CCD相機43分別 項取基板標記51及預先設在光罩15的定位標記（未圖 了）’並且使載置纟4朝XY& 0方向移動，以 與光罩15的定位。 然後，使載置台4朝Z方向上升，並且如第2圖所干， 以包圍破螭板40及玻璃板4〇之周圍的方式，使安裴於四 邊的墊圈41經由光罩薄膜1密接於載置台4。 同時，從吸引孔42進行真空吸引，藉此使光罩“與 土板50岔接，在CCD相機43從曝光區域退開之後，從光 源5發出紫外線光並進行曝光。 曝光結束後便排出基板50。通常是利用反轉機使美 反轉並進行背面的曝光。 土 #路此外，亦可取代玻璃板40而使用壓克力（丙烯酸樹脂） 等紫外線可透過的塑膠製品。 曰 316402 10 200521637 所說明的實施形態由於是在投入部A算出基板5〇 ^伸縮量’並且在曝光時使用對應該伸縮量的光罩15,因 可有效率地進行高精度的曝光。 【圖式簡單說明】 [主 1 3 5 11 20 41 43 51 ^西疋本务明之一Λ他艰恶的概略圖〇 昂2圖是本發明之一實施形態之動作的說 要元件符號說明】 光罩薄膜 控制裝置 光源 滚輪 搬送滾輪 墊圈 CCD相機 基板標記 2 CCD相機 4 載置台 10 光罩滾輪 15 光罩 40 玻璃板 42 吸引孔 50 基板Λ ^ is exposed several times and exposed. Therefore, there is a disadvantage that the processing time of the gate from I becomes longer during exposure. h is the first 4 laughter. The conventional technology 3 is the device. The same processing time is required, and ir is also required. ’In order to obtain the cost of the seal method, the seal method 1 is required. As many as about. The purpose of the present invention is to solve the problems of the conventional techniques described above. 316402 7 200521637 [Means to solve the problem]: In order to achieve the above object, the present invention provides a light device, which is characterized in that it is provided with a package of S + M for different sizes of exposure painting. L: should be printed circuit board. A plurality of photomasks that are known by telescopic inspection (a. Pre-exposure is less known by means of cough detection means), ο hand slaves, which are used to read the telescopic state of the printed circuit board by the needle, ten, and p. From the several masks just described, choose the most suitable ~ selective mask— & 罟, 々 means; the means of sighing the selected Zen mask in the exposure section; the mask with, and The aforementioned printed circuit board 5 is placed on the exposure unit at an upper and thousands of meters to customize the exposure method. Shrink the state, and choose a suitable person * Don't know the extension of the printed circuit board, so it can be efficient and ancient. The agricultural exposure department, Ding Lingxiao, has a monthly and high-density exposure. It can form a plurality of photomasks as described above, and make the film-shaped light I h look for a boat-like mask, and the sub-m mask m moves privately. The selected reticle is set at the exposure. "This will make more efficient exposure possible. Before [ [Effects of the Ming] The printed circuit board according to the present invention is measured in advance in terms of expansion and contraction μ & 尤, Yu Yi Chi, which will not produce j 疋 extension, and Berea do well in the group interval and the conventional method. , And the price at the time of the beat, etc., the device introduction costs are also about the same minimum: :: = the effect of pattern displacement caused by shrinkage is suppressed in the precision and production of: articles / land into the lamp production 'and can be efficiently manufactured The effect of a high-return printed circuit board. [Implementation method] The following describes the embodiment of the present invention based on the drawings. 316402 200521637 In Figure 1, this exposure device for a printed circuit board has an exposure section β. (1) The substrate 50 to which the photoresist is applied is placed on the stage 4 of the exposure section B through the input section a, and the exposure placement table 4 can be moved in the χγζ & The plate mark 51 can be aligned with the mask film. 1 base is at & A. There is also a transport roller 20, and the US plate moved above it can be read by two or four coffee cameras 2. Its substrate mark / 51. The substrate mark 51 is First set on the substrate 50, and calculate the extension and contraction of the substrate from the positional relationship between the plate marks 51 and 51. The day image of the substrate mark 51 from the CCD camera 2 will be sent to the control device 3, and This calculates the amount of expansion and contraction. In addition, 1 substrate mark 51 can be used to mark the alignment with the mask. Yu = I1 is formed into a continuous film, and is wound around the mask rollers 10 and 10. Then borrow The substrate 50 is composed of a roller. Π constitutes a plurality of photomasks 15 provided on the photomask film 1 on the mounting table 4. That is, there are a plurality of standard photomasks 15 with an exposure pattern made in a design value. And = a mask 15 in which a pattern with different sizes is described in the standard pattern. The small size is preferably prepared in advance with a predetermined number relative to, for example, an exposure size of 500_ and a certain ratio of about 10 microns in the Xγ direction 'to make @ 案 备 § small and enlarged patterns. In addition, in the case where it is known in advance that the expansion and contraction directions of the direction may vary due to the expansion and contraction characteristics of the substrate material or the pattern drawn by 316402 9 200521637, it is best to prepare a photomask with each expansion and contraction of χγ. The control device 3 can control the rotation of the mask roller 10 by rotating LV: stop Λ, and position the mask 15 having a mask pattern of a predetermined size on the substrate 50. The control device 3 is configured as described above, that is, the amount of shrinkage is calculated based on the day image signal from the substrate mark 51 of the camera 2, and from this calculation result, the mask 15 is provided with the largest mask 15 On the substrate 50. When the substrate 50 is exposed to the pattern of the size of Shida, the substrate 50 is placed on the mounting table 4 and the substrate 50 is placed on the substrate 50. Then, the CCD camera 43 is used to take the substrate mark 51 and preset Position the mark 15 (not shown) on the photomask 15 and move the mounting plate 4 in the XY & 0 direction to position the photomask 15. Then, the mounting table 4 is raised in the Z direction, and as shown in FIG. 2, the gaskets 41 on the four sides of the ampere are closely adhered to each other through the mask film 1 so as to surround the periphery of the breaking plate 40 and the glass plate 40. Mounting table 4. At the same time, vacuum suction is performed from the suction hole 42 so that the photomask "connects with the soil plate 50. After the CCD camera 43 is retracted from the exposure area, ultraviolet light is emitted from the light source 5 and exposed. After the exposure is completed, the substrate is discharged. 50. Normally, the reversing machine is used to reverse the beauty and expose the back side. 土 # 路 In addition, you can also use acrylic (acrylic resin) UV-transparent plastic products instead of glass plate 40. 316402 10 200521637 In the illustrated embodiment, the substrate 50 is calculated and retracted in the input unit A, and the photomask 15 corresponding to the amount of expansion and contraction is used during the exposure, so that high-precision exposure can be performed efficiently. [Schematic description] [Master 1 3 5 11 20 41 43 51 ^ One of the most important things in Xi'an's book Λ He's arduous outline picture Ang 2 picture is the key element description of the operation of one embodiment of the present invention] Photomask film control device light source Roller conveying roller washer CCD camera substrate mark 2 CCD camera 4 Mounting stage 10 Mask roller 15 Mask 40 Glass plate 42 Suction hole 50 Substrate