CN1284049C - Exposure method for exposure device - Google Patents
Exposure method for exposure device Download PDFInfo
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- CN1284049C CN1284049C CN 200410048823 CN200410048823A CN1284049C CN 1284049 C CN1284049 C CN 1284049C CN 200410048823 CN200410048823 CN 200410048823 CN 200410048823 A CN200410048823 A CN 200410048823A CN 1284049 C CN1284049 C CN 1284049C
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- exposure
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Abstract
An exposure method for an exposure device has a good integrated accuracy of a substrate and a photomask and a short process time in performing exposure to a substrate rapidly. The invented method uses a substrate integrated with an integration mark and a patterned photomask having a photomask mark, and performs exposure in a state where the photomask is tightly connected to the substrate. The invented method comprises: using the photomask mark as a basis to obtain a point MA where the diagonal lines of half region of the photomask intersect, and a point MB where the diagonal lines of the whole region of the photomask intersect; using the integration mark as a basis to obtain a point WA where the diagonal lines of half of the region of the substrate intersect, and a point WB where the diagonal lines of the whole region of the substrate intersect; performing a comparison process of comparing the MB point of the photomask mark with the WB point of the integration mark; performing a determination process of determining whether the WB point of the integration mark relative to the MB point of the photomask mark is within a tolerance range; and irradiating the exposure light on the whole substrate when the determined result from the determination process falls within the tolerance range.
Description
Technical field
The present invention relates to the exposure method of substrates such as a kind of printed circuit board (PCB), crystal liquid substrate and mask, particularly carry out the exposure method of the exposure device of exposure operation according to the distribution point (by branch) of mask and substrate.
Background technology
Patent documentation 1: the spy opens flat 11-194507 communique (paragraph 0011～0014, Fig. 3)
Patent documentation 2: the spy opens 2000-122303 communique (in full)
In the past, when making printed circuit board (PCB), use following exposure device, this exposure device will After being provided with the mask and substrate calibration of circuit pattern, expose to the sun by under the state that makes both driving fits, shining Light light copies to the pattern of circuit on the substrate.
Such exposure device has: the pedestal of placing substrate; Have predetermined pattern and be positioned at the mask on pedestal top what the substrate on the pedestal exposed; Make mask or substrate calibrate mobile calibration mobile device; The optical system that constitutes by light source and catoptron etc. to mask and base plate exposure.
In addition; known following exposure method (for example; with reference to patent documentation 1): substrate and mask are divided into arbitrary region (for example four zones); at first carry out the calibration of substrate integral body; carry out the calibration in each zone then; carry out exposure operation in proper order from the zone beginning of finishing calibration, carry out this action repeatedly and finish the exposure operation of substrate integral body.
And, following method has been proposed (for example, with reference to patent documentation 2): when a plurality of pattern integral body are exposed (describing by beam flying), the zone that measurement should be exposed centre of gravity place and whole centre of gravity place separately, based on this measurement data, proofread and correct respectively according to a plurality of zones reference position information separately,, each pattern is exposed according to the data after proofreading and correct.
But, in the technology of in patent documentation 1, putting down in writing, owing at first carry out the calibration of substrate integral body, according to suitable order the arbitrary region of dividing is calibrated, begin to expose from the zone of having finished calibration, therefore, under the situation that is divided into four zones, the calibration of substrate integral body need be carried out calibration steps five times, even and under the situation that is divided into two zones, also must carry out three times calibration steps, expend time in very much.
And owing at first by the mark of mask and substrate substrate integral body is calibrated, after therefore each zone being calibrated, it is big that error becomes again.
Because the technology of record is following method in the patent documentation 2: the centre of gravity place of each pattern that measurement should be exposed and whole centre of gravity place, based on this measurement data, proofread and correct a plurality of zones reference position information separately, according to the data after proofreading and correct, each pattern is exposed, therefore, the exposure of each pattern needs the time, and be difficult to apply it to as the exposure device of printed base plate, mask and substrate driving fit are come in the device that the pattern to mask directly exposes.
Summary of the invention
The present invention puts in view of the above problems and proposes, and its objective is the exposure method that a kind of exposure device is provided, and it can carry out the calibration of substrate and mask well by short step precision, and can promptly carry out the exposure of substrate integral body.
As solution to the problems described above, the exposure method of exposure device of the present invention is calibrated substrate and mask, expose under the state of aforesaid substrate in the aforementioned mask driving fit, wherein aforesaid substrate has the collimating marks of a plurality of location usefulness, aforementioned mask has and is used for the mask mark of above-mentioned collimating marks aligned position and is provided with predetermined pattern, this exposure method comprises the following steps: to be labeled as the basis with aforementioned mask, obtains half regional diagonal line resulting distribution point MA intersected with each other of aforementioned mask, and the step of the diagonal line of aforementioned mask integral body resulting distribution point MB intersected with each other; Based on above-mentioned collimating marks, obtain the step of the diagonal line resulting distribution point WB intersected with each other of half regional diagonal line resulting distribution point WA intersected with each other of aforesaid substrate and aforesaid substrate integral body; The comparison step that the distribution point WB of the distribution point MB of aforementioned mask mark and above-mentioned collimating marks is compared; According to above-mentioned comparison step (result), the distribution point WB that judges above-mentioned collimating marks is with respect to the distribution point MB of the aforementioned mask mark determining step in permissible range whether; And when above-mentioned determining step is judged in permissible range, exposure light is shone step (claim 1) in aforesaid substrate integral body.
In this exposure method, be labeled as the basis with mask, obtain half the regional distribution point MA of mask and the distribution point MB of mask integral body; Based on collimating marks, obtain half the regional distribution point WA of substrate and the distribution point WB of substrate integral body (also can be placed on the step of carrying out calibrating operation according to mask mark and above-mentioned collimating marks after the step of asking distribution point WA, WB); Distribution point WB between the collimating marks of distribution point MB between the mask mark and substrate is compared, in the time of in permissible range, substrate integral body is exposed, therefore, can carry out the precision excellent exposure substrate integral body.
The exposure method of the exposure device that the present invention relates to is in above-mentioned determining step, may further comprise the steps: when the distribution point WB that judges above-mentioned collimating marks when the distribution point MB of aforementioned mask mark is outside permissible range, second comparison step that the distribution point MA of the distribution point WA of above-mentioned collimating marks and aforementioned mask mark is compared; According to above-mentioned second comparison step, the distribution point WA that judges above-mentioned collimating marks is with respect to the distribution point MA of aforementioned mask mark second determining step in permissible range whether; When above-mentioned second determining step is judged in permissible range, exposure light is shone half regional step (claim 2) in aforesaid substrate.
In this exposure method, at the distribution point MB that further judges with respect to the mask mark, the distribution point WB of collimating marks is outside permissible range the time, the distribution point WA of collimating marks and the distribution point MA of mask mark are compared, when judging in permissible range, exposed in half zone of substrate, therefore, can only carry out the precision excellent exposure half zone of the substrate after the calibration.
In addition, the exposure method of the exposure device that the present invention relates to, in above-mentioned second determining step, comprise when the distribution point WA that judges above-mentioned collimating marks when the distribution point MA of aforementioned mask mark is outside permissible range, unload the removing step (claim 3) of (discharge) aforesaid substrate.
In this exposure method, the distribution point between the collimating marks of distribution point between the mask mark and substrate is compared, under the bad situation of align mode, unload this substrate, therefore, can not carry out the invalid exposure of low precision.
Description of drawings
Fig. 1 is the planimetric map of expression the present invention as the major part of the used exposure device of an example.
Fig. 2 is the schematic perspective view of expression the present invention as the integral body of the used exposure device of an example.
Fig. 3 (a) is the synoptic diagram of the configuration of expression mask mark; Fig. 3 (b) is the synoptic diagram of configuration of the collimating marks of expression substrate.
Fig. 4 is the side schematic view of expression the present invention as the used exposure device of an example.
Fig. 5 is the system construction drawing that exposure device of the present invention relates to.
Fig. 6 is the process flow diagram of embodiment of the exposure method of the exposure device that the present invention relates to.
Symbol description
1: exposure device; 2: pedestal; 3: substrate; 4: mask; 6: light source; 7 (7A～7D): catoptron; 8: camera; 9: control gear; 11: cylinder; 13: the table body; 24: data input part; 25: data operation portion; 26: the data comparing section; 27: judging part; 28: the exposure signal generating unit; 30: optical gate (shutter) mechanism; M (M1～M6): the mask mark; MA: distribution point (distribution point in half zone of mask); MB: distribution point (distribution point in half zone of mask); W (W1～W6): collimating marks; WA: distribution point (distribution point in half zone of substrate); WB: distribution point (distribution point in half zone of substrate).
Embodiment
Below, with reference to accompanying drawing, the embodiment of the exposure method of the exposure device that the present invention relates to is described.
The present invention is a kind of exposure method of exposure device, it is to the substrate of collimating marks with a plurality of location usefulness and have and be used for calibrating with the mask mark of collimating marks aligned position and the mask that is provided with predetermined pattern, exposes under the state on the substrate in the mask driving fit.
At first, the exposure device as the prerequisite of exposure method is described.
In the accompanying drawing of institute's reference, Fig. 1 is the planimetric map of the major part of expression exposure device.Fig. 2 is the schematic perspective view of exposure device integral body.Fig. 3 (a) is the synoptic diagram of configuration of the mask mark of expression mask.Fig. 3 (b) is the synoptic diagram of configuration of the collimating marks of expression substrate.Fig. 4 is the side schematic view of exposure device.
As shown in Figure 1 and Figure 2, exposure device 1 comprises: the pedestal 2 of placing substrate 3; Keep mask 4 and be provided with the table body 13 of mask pushing mechanism 5 (5A, 5B, 5C), wherein mask has the specified circuit pattern that substrate 3 is exposed and is positioned on the substrate 3, and mask pushing mechanism 5 is to make mask 4 calibrate mobile correcting mechanism; From by the top irradiates light of the mask 4 that this body 13 kept and to substrate 3 expose by light source 6 and the catoptron 7 (optical system that 7A～7B) etc. is constituted; Be used to detect the camera 8 of substrate 3 and the align mode of mask 4; Via the control gear 9 (with reference to Fig. 5) of camera 8 control mask thrust units 5 with the position alignment of carrying out substrate 3 and mask 4 etc.; And block and shine in shutter mechanism 30 (with reference to Fig. 4) of the light in the regulation zone of substrate 3 etc.
As shown in Figure 4, pedestal 2 can make substrate 3 and mask 4 driving fits by cylinder 11 is up and down, and, for substrate 3 is fixed on the pedestal 2, have not shown adsorbing mechanisms such as vacuum pump in the inside of pedestal 2.Therefore, by a large amount of not shown adsorption hole on the pedestal 2, make attraction air effect that adsorbing mechanism produces in the hole, thereby substrate 3 is adsorbed on the pedestal 2.
And, substitute as aforementioned mask pushing mechanism 5, also can be between cylinder 11 and pedestal 3, be equipped with and divide can calibrating mobile platform 20, can calibrate mobile platform 21 and can calibrate mobile platform 22 of three grades of settings, carry out the calibrating operation between substrate 3 and the mask 4 in the x direction in the y direction in the θ direction.
As shown in Figures 1 and 2, mask keeper 14 is arranged on the body 13 by spheroid etc. with can move freely, and mask pushing mechanism 5 has: be configured in a pair of pushing part 5A, 5B on each limit of this mask keeper 14; Be configured in the pushing part 5C on the adjacent edge of this pushing part 5A, 5B; And be configured in and pushing part 5A, 5B, locational follower 16,16,16 that 5C is relative.By suitably driving this pushing mechanism 5 (5A, 5B, 5C), the mask keeper 14 that can make mask 4 is in directions X (the paper left and right directions of Fig. 1), Y direction (the paper above-below direction of Fig. 1), perhaps as clockwise or calibrate mobile around the θ direction of the direction of vertical axis.
As shown in Figure 2, optical system comprises: comprised the ultraviolet discharge lamp of provision wavelengths and be configured in the light source 6 that the elliptical reflector at this discharge lamp rear constitutes by irradiation; Plane mirror 7A, 7B, 7C and the concave mirror 7D that will reflect towards prescribed direction from the irradiates light of this light source 6; And be configured in fly lens 7E on the assigned position in the light path of light source 6.Therefore,, shine on substrate 3 as directional light via fly lens 7E, plane mirror 7A, 7B, 7C and concave mirror 7D from the light of light source 6 from mask 4 tops.And, preferably on light source 6, have not shown optical gate, so that only just can irradiates light in exposure operation.
As shown in Figure 4, shutter mechanism 30 be arranged on mask keeper 14 near, have and block with advancing and retreat from the shield 32 of the irradiates light of concave mirror 7D and the maintaining part 31 that freely keeps this shield 32.
As shown in Figure 5, control gear 9 has data input part 24, data operation portion 25, data comparing section 26, judging part 27 and exposure signal generating unit 28.
And, also can constitute control gear 9 with the PC (personal computer) of display with input medias such as keyboard and mouse and CRT (Cathode-RayTube) or liquid crystal panel and so on.
In data input part 24, input is by the captured collimating marks W of camera 8, each data of mask mark M.Each data of being imported are: the mask mark M1～M6 of the mask 4 imported successively with camera 8 and the positional information of collimating marks W1～W6 have been carried out the position data after the opto-electronic conversion; And the mobile data of the distance that camera 8 moved etc.
Data operation portion 25 is according to each data of being imported, and the position of computing mask mark M and collimating marks W relation is stored in the position data that calculates in the not shown storer etc. simultaneously.
In addition, data operation portion 25 each data by being imported according to data input part 24, computing has the range data between the collimating marks of particular kind of relationship and range data between the mask mark of particular kind of relationship is arranged, thus being positioned in half zone of computing substrate 3 or another half zone to the distribution point WA of the collimating marks W of angular direction and the distribution point WB that is positioned at substrate 3 integral body to the collimating marks W of angular direction.
Similarly, being arranged in the distribution point MA of the mask mark M of angular direction and the distribution point MB to the mask mark of angular direction that is positioned at the zone of mask 4 integral body in one of data operation portion 25 computing masks 4 half zone or another half zone is stored in above-mentioned distribution point WA, WB and distribution point MA, MB respectively in the not shown storer etc. as position data.
Data comparing section 26 is the consistent degree of mask mark M and each position data of collimating marks W relatively, simultaneously, distribution point MA, the MB of mask mark are compared as distribution point WA, the WB of the collimating marks of reference value data and corresponding distribution point MA, the MB that becomes these reference value data.
Judging part 27 judges that mask mark M and collimating marks W are in permissible range or outside permissible range with respect to the predefined reference value that is stored in the not shown storer etc., judges that simultaneously the distribution point MB of the distribution point WB of substrate 3 integral body and mask 4 or distribution point MA, WB are in permissible range or outside permissible range with respect to the predefined reference value that is stored in the not shown storer etc.
Then, if judging part 27 is judged mask mark M and collimating marks W outside permissible range, then output signal sends signal to mask pushing mechanism 5, carries out calibrating operation by mask pushing mechanism 5.
In addition, judge under mask mark M and the situation of collimating marks W in permissible range at judging part 27, distribution point MB and distribution point WB are judged, under distribution point MB, the WB situation in permissible range, export the signal that is used to expose by exposure signal generating unit 28.
And, at judging part 27 under the judgement to distribution point MB and distribution point WB is situation outside permissible range, distribution point MA and distribution point WA are judged, at distribution point MA and distribution point WA under the situation in permissible range, output signal, so that the action of shutter mechanism 30 as shown in Figure 4, shading is carried out in the position in the exposure area not, shine irradiates light simultaneously from light source 6.
Then, judge under distribution point MA, the WA situation outside permissible range at judging part 27, output signal unloads substrate 3 by not shown mechanical arm conveying devices such as (handler) from pedestal 2.
Then with reference to Fig. 6 and other accompanying drawing, a series of flow process of the exposure method of exposure device of the present invention is described.
At first, as shown in Figure 2, substrate 3 is moved into the pedestal 2 of exposure device 1 by not shown conveying devices such as mechanical arm.Be adsorbed under the state of pedestal 2 at the substrate 3 that will move into, pedestal 2 risen move, make substrate 3 and mask 4 vacuum driving fit under relative state.
After with mask 4 and substrate 3 vacuum driving fits, as shown in Figure 1, each camera 8 moves from retreating position, mask mark M and collimating marks W is taken, thereby the position data of mask mark M and collimating marks W is input in the data input part 24 (with reference to Fig. 5).
As Fig. 3, Fig. 5 and shown in Figure 6, because the mask mark M1～M6 of mask 4 and the collimating marks W1～W6 of substrate 3 are imported into data input part 24, therefore, between mask mark M1, the M2 of mask 4, between mask mark M2, the M4, between mask mark M4, the M5, between mask mark M5, the M6 and between mask mark M1, the M6, between mask mark M2, the M5, between mask mark M3, the M4, be imported into data input part 24 as range data.
Simultaneously, between the collimating marks W1 of substrate 3, the W2, between collimating marks W2, the W4, between collimating marks W4, the W5, between collimating marks W5, the W6 and between collimating marks W1, the W6, between collimating marks W2, the W5, between collimating marks W3, the W4, be imported into data input part 24 as range data.(S1)
Then, according to the range data that is transfused to data input part 24, in data operation portion 25, between computing mask mark M2, the M4, the distribution point MA between M3, the M5, and with respect to mask 4 integral body at the distribution point MB between mask mark M1, the M4 of highest distance position, between mask mark M3, the M6.Simultaneously, in data operation portion 25, distribution point WA between computing collimating marks W2, the W4, between W3, the W5, and with respect to substrate 3 integral body at the distribution point WB between collimating marks W1, the W4 of highest distance position, between calibration mask mark W3, the W6, each distribution point MA, MB, WA, WB are stored in (S2) in the data operation portion 25.
Then, calibrate the mask pushing mechanism 5 of mobile correcting mechanism (5A, 5B, 5C),, carry out and the calibrating operation (S3) that is positioned over the substrate 3 on the pedestal 2 according to mask mark M and collimating marks W by making mask 4.
Then, with the state of the data consistent that is calibrated the mask mark M after moving by calibrating operation under, data to the distribution point WB of the data of the distribution point MB of the mask that is stored in operational part 25 and substrate compare (comparison step) (S4) in data comparing section 26.
Judge whether (determining step in the permissible range of regulation of results relatively with judging part 27, S5), if the distribution point WB of the distribution point MB of mask mark M and collimating marks is in the permissible range of regulation ("Yes"), then because can be to substrate 3 WBR exposure lights, therefore, according to signal from judging part 27, produce exposure signal by exposure signal generating unit 28, exposure light is shone substrate 3 (S6) on the whole.
On the other hand, if being judged as of step S5 outside permissible range ("No"), then be stored in the distribution point MA data of the mask mark M in the operational part 25 and the distribution point WA data of collimating marks compare (second comparison step, S7) by 26 pairs of data comparing sections.
Result by 27 pairs of comparisons of judging part judges (second determining step, S8), if in the permissible range of regulation ("Yes"), then owing to can half regional WA of substrate 3 be exposed, therefore, according to signal, when producing exposure signal, make shield 2 actions of shutter mechanism 30 by exposure signal generating unit 28 from judging part 27, cover second half zone do not expose, only to the regional A shown in Fig. 3 (b) expose (S9).If judge outside the permissible range of regulation ("No") among the step S8, then unexposed substrate 3 unloaded (S10).In addition, when exposing, camera is kept out of the way to avoid interference.
As previously discussed, at first substrate 3 is divided into two zones, computing is at the collimating marks W2 to the angular direction, the W4 of a regional A and the distribution point WA between collimating marks W3, the W5, be object then with substrate 3 integral body, computing distribution point WB similarly, exposure again after distribution point MA, MB with mask 4 compare, thereby, can carry out the precision excellent exposure.
In addition, therefore the present invention can enhance productivity owing to can expose to substrate 3 integral body with a spot of step, simultaneously, though only in half regional A of the substrate 3 that should expose distribution point WA consistent with mask, also can expose, therefore, can effectively utilize baseplate material.
The present invention is owing at first be divided into substrate 3 two zones, computing an edge regions A to the distribution point WA between the collimating marks of angular direction, be object then with substrate integral body, computing distribution point WB similarly, after comparing, distribution point MA, MB with mask expose, therefore, can carry out the precision excellent exposure.
Therefore the present invention, can enhance productivity owing to can expose to substrate integral body with a spot of step, simultaneously, though only in half zone of the substrate that should expose distribution point consistent with mask, also can expose, therefore, can effectively utilize baseplate material.
Claims (3)
1. the exposure method of an exposure device, substrate and mask are calibrated, the aforementioned mask driving fit is being exposed under the state of aforesaid substrate, wherein, aforesaid substrate has the collimating marks of a plurality of location usefulness, aforementioned mask has and is used for the mask mark of above-mentioned collimating marks aligned position and is provided with predetermined pattern, and this exposure method is characterised in that, comprises the following steps:
Be labeled as the basis with aforementioned mask, obtain the step of the diagonal line resulting distribution point MB intersected with each other of half regional diagonal line resulting distribution point MA intersected with each other of aforementioned mask and aforementioned mask integral body;
Based on above-mentioned collimating marks, obtain the step of the diagonal line resulting distribution point WB intersected with each other of half regional diagonal line resulting distribution point WA intersected with each other of aforesaid substrate and aforesaid substrate integral body;
The comparison step that the distribution point WB of the distribution point MB of aforementioned mask mark and above-mentioned collimating marks is compared;
According to above-mentioned comparison step, the distribution point WB that judges above-mentioned collimating marks is with respect to the distribution point MB of the aforementioned mask mark determining step in permissible range whether; And
When above-mentioned determining step is judged in permissible range, exposure light is shone in the step of aforesaid substrate integral body.
2. the exposure method of exposure device as claimed in claim 1 is characterized in that,
In above-mentioned determining step, also comprise the following steps:
When the distribution point WB that judges above-mentioned collimating marks when the distribution point MB of aforementioned mask mark is outside permissible range, second comparison step that the distribution point WA of the distribution point MA of aforementioned mask mark and above-mentioned collimating marks is compared;
According to above-mentioned second comparison step, the distribution point WA that judges above-mentioned collimating marks is with respect to the distribution point MA of aforementioned mask mark second determining step in permissible range whether;
When above-mentioned second determining step is judged in permissible range, exposure light is shone half regional step in aforesaid substrate.
3. the exposure method of exposure device as claimed in claim 2 is characterized in that,
In above-mentioned second determining step, also comprise: when the distribution point WA that judges above-mentioned collimating marks when the distribution point MA of aforementioned mask mark is outside permissible range, unload the removing step of aforesaid substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP161606/2003 | 2003-06-06 | ||
| JP2003161606A JP4192039B2 (en) | 2003-06-06 | 2003-06-06 | Exposure method of exposure apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100073563A Division CN100454146C (en) | 2003-06-06 | 2004-06-04 | Exposure apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1573569A CN1573569A (en) | 2005-02-02 |
| CN1284049C true CN1284049C (en) | 2006-11-08 |
Family
ID=34053972
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410048823 Expired - Fee Related CN1284049C (en) | 2003-06-06 | 2004-06-04 | Exposure method for exposure device |
| CNB2006100073563A Expired - Fee Related CN100454146C (en) | 2003-06-06 | 2004-06-04 | Exposure apparatus |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100073563A Expired - Fee Related CN100454146C (en) | 2003-06-06 | 2004-06-04 | Exposure apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4192039B2 (en) |
| CN (2) | CN1284049C (en) |
| TW (1) | TWI243971B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007171621A (en) * | 2005-12-22 | 2007-07-05 | Adtec Engineeng Co Ltd | Contact exposure device |
| CN101655666B (en) * | 2008-08-19 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Photoetching method and system |
| KR20130033165A (en) * | 2011-09-26 | 2013-04-03 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
| CN106444294B (en) * | 2016-10-17 | 2018-05-11 | 上海华力集成电路制造有限公司 | A kind of mask plate fixed system |
| CN109466189A (en) * | 2018-12-21 | 2019-03-15 | 昆山森特斯印刷技术有限公司 | Chromatography positioning device and chromatography positioning system with the chromatography positioning device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56129332A (en) * | 1980-06-04 | 1981-10-09 | Hitachi Ltd | Measurement for mounting position of parts |
| JPH11194507A (en) * | 1998-01-05 | 1999-07-21 | Adtec Engineeng:Kk | Exposure system |
| JP2002008563A (en) * | 2000-04-17 | 2002-01-11 | Toshiba Corp | Color cathode ray tube |
-
2003
- 2003-06-06 JP JP2003161606A patent/JP4192039B2/en not_active Expired - Fee Related
-
2004
- 2004-04-20 TW TW93110927A patent/TWI243971B/en not_active IP Right Cessation
- 2004-06-04 CN CN 200410048823 patent/CN1284049C/en not_active Expired - Fee Related
- 2004-06-04 CN CNB2006100073563A patent/CN100454146C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100454146C (en) | 2009-01-21 |
| TWI243971B (en) | 2005-11-21 |
| JP4192039B2 (en) | 2008-12-03 |
| CN1573569A (en) | 2005-02-02 |
| JP2004361767A (en) | 2004-12-24 |
| CN1818794A (en) | 2006-08-16 |
| TW200428162A (en) | 2004-12-16 |
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